US4210453AExpiredUtility
Carbon bonded refractory brick composition
Est. expiryNov 8, 1998(expired)· nominal 20-yr term from priority
Inventors:Donald Bowers
C04B 35/013
23
PatentIndex Score
7
Cited by
3
References
4
Claims
Abstract
A composition for molding refractory bricks having improved stability and load resistance in a furnace at elevated temperatures includes between 50 to 97 percent by weight of a pulverulent sized refractory material and between 3 to 27 percent by weight carbon. The carbon in the composition before curing at elevated temperatures includes a liquid carbonaceous bonding resin which improves the moldability of the composition before curing and provides high strength and rigidity to the brick after curing at elevated temperatures.
Claims
exact text as granted — not AI-modifiedI claim:
1. A moldable refractory composition for making a compact shaped body which includes about 75 percent by weight periclase with about 34 percent of said periclase having a size which passes through a 4 mesh Tyler Standard Screen and is retained on a 10 mesh screen, about 28 percent by weight having a size which passes through a 10 mesh screen and is retained on a 35 mesh screen, about 14 percent by weight having a size which passes through a 35 mesh screen and about 34 percent by weight having a size which passes through a 150 mesh screen and about 25 percent by weight carbon, a portion of said carbon prior to subjecting said composition to curing at elevated temperatures being in the form of a liquid carbonaceous bonding resin.
2. A moldable refractory composition for making a compact refractory brick consisting essentially of about 80 percent by weight periclase, about 12 percent graphite and about 8 precent bonding resin.
3. A moldable refractory composition as set forth in claim 2 in which said bonding resin includes about 25 percent by weight dry phenolic powder and about 75 percent by weight phenol formaldehyde liquid bonding resin.
4. A moldable refractory composition as set forth in claim 2 in which said bonding resin consists of a phenolic liquid resin.Join the waitlist — get patent alerts
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