US4162572AExpiredUtility

Providing solder on electrical contacts

Individually held — no corporate assignee on recordPriority: Nov 7, 1977Filed: Nov 7, 1977Granted: Jul 31, 1979
Est. expiryNov 7, 1997(expired)· nominal 20-yr term from priority
Inventors:John J. Rozmus
H01R 43/16H01R 43/02Y10T29/4921Y10T29/49218Y10T29/49222
34
PatentIndex Score
4
Cited by
5
References
5
Claims

Abstract

Providing solder on electrical spring contacts being stamped in a press by arranging the press to form a mounting section on the contact, position a segment of solder adjacent the mounting section, cut the segment, and then wrap the same over the mounting section.

Claims

exact text as granted — not AI-modified
I claim: 
     
       1. In a method of consecutively forming electrical contacts from at least one metal strip worked in a progressive die, which method includes providing a progressive die with its punch pad and die pad having a plurality of fabricating punch means and die means respectively spaced at fabricating stations along said axis for forming said contacts, feeder mechanism intermittently feeding the metal strip between the pads and operating said fabricating punch and die means and said feeder mechanism to consecutively form contacts, the improvement which comprises the method of providing each contact with a solder band secured thereto comprising the steps of: providing said punch pad with a plurality of solder punch means and said die pad with a plurality of solder die means respectively spaced at solder stations along an axis and configured and movable to perform steps (a) through (d) as specified below:   providing a solder strip;   providing feed mechanism for feeding the solder strip adjacent the metal strip;   upon operation of the progressive die and at successive dwells of the metal strip perform the following steps: (a) while an area of the metal strip is at one of said solder stations use solder punch means and die means to punch a pair of cut-outs to form a solder mounting section therebetween;   (b) while said solder mounting section is at an other of said solder stations use the solder feed mechanism to place a segment of the solder strip adjacent said mounting section;   (c) while said solder mounting section and said solder segment are maintained at said other solder station, use solder punch and die means to cut said solder segment so that portions thereof respectively extend outwardly on opposite sides of said mounting section;   (d) while said mounting section and cut solder are maintained at said other solder station use solder punch and die means to wrap said outwardly extending portions over said mounting section so the solder is self-secured thereto; and     repeat steps (a) through (d) on the body strip and solder strip until said steps being simultaneously performed and continue said simultaneous operation to consecutively provide contacts with a solder band.   
     
     
       2. The method of claim 1 further including the step, performed when said mounting section and the solder secured thereto are at another of said solder stations, of using solder punch and die means to completely wrap the solder around the mounting section. 
     
     
       3. In a method of consecutively forming electrical contacts from at least one metal strip worked in a progresive die, which method includes providing a progressive die with its punch pad and die pad having a plurality of fabricating punch means and die means respectively spaced at fabricating stations along said axis for forming said contacts, feeder mechanism intermittently feeding the metal strip between the pads and operating said fabricating punch and die means and said feeder mechanism to consecutively form contacts, the improvement which comprises the method of providing each said contact with a solder mass secured thereto comprising the steps of: providing said punch pad with a plurality of solder punch means and said die pad with a plurality of solder die means respectively spaced at solder stations along an axis and configured and movable to perform steps (a) through (d) as specified below;   providing a solder strip;   providing feed mechanism for feeding the solder strip adjacent the metal strip;   upon operation of the progressive die and at successive dwells of the metal strip perform the following steps: while an area of the metal strip is at one of said solder stations use solder punch means and die means to form a solder mounting section:   (b) while said solder mounting section is at an other of said solder mounting stations use the solder feed mechanism to place a segment of the solder strip adjacent said mounting section;   (c) while said solder mounting section and said solder segment are maintained at said other solder station use solder punch and die means to cut said solder segment;   (d) while said mounting section and cut solder are maintained at said other solder station use solder punch and die means to press the solder against said mounting section and deform the solder over the section so that the solder secures itself to the mounting section.     repeat steps (a) through (d) on the body strip and solder strip until said steps being simultaneously performed and continue said simultaneous operation to consecutively provide contacts with a solder mass.   
     
     
       4. The method of providing electrical contacts each with a solder band secured thereto comprising the steps of: providing a strip having a plurality of at least partially formed electrical contacts each with a solder mounting section;   providing a solder strip;   sequentially moving said strip so that said mounting section sequentially occupies one of a plurality of positions serially spaced along an axis at a pre-selected positions perform the following operations for each such contact; (a) while said mounting section is at one of said positions locate a segment of the solder strip adjacent said mounting section;   (b) while said mounting section and solder segment are maintained in said one position cut said segment so that portions extend respectively outwardly on opposite sides of said mounting section;   (c) while said mounting section and the cut solder segment are maintained in said one position at least partially wrap the cut solder over said mounting section so that the solder secures itself to the mounting section; and     repeating said steps (a) through (c) until the steps are being simultaneously performed and continue said simultaneous operation to consecutively provide contacts with a solder band.   
     
     
       5. The method of providing electrical contacts each with a solder band secured thereto comprising the steps of: providing a strip having a plurality of at least partially formed electrical contacts each with a solder mounting section;   providing a solder strip;   sequentially moving said strip so that said mounting section sequentially occupies one of a plurality of positions serially spaced along an axis at pre-selected positions perform the following operations for each such contact; (a) while said mounting section is at one of said positions locate a segment of the solder strip adjacent said mounting section;   (b) while said mounting section and solder segment are maintained in said one position cut said segment so that portions extend respectively outwardly on opposite sides of said mounting section;   (c) while said mounting section and the cut solder segment are maintained in said one position at least partially wrap the cut solder over said mounting section so that the solder secures itself to the mounting section;   (d) while maintaining said wrapped condition move the strip to position said mounting section and wrapped solder at another of said positions and then completely wrap the solder around the mounting section; and     repeating said steps (a) through (d) until the steps are being simultaneously performed and continue said simultaneous operation to consecutively provide contacts with a solder band.

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