Plating bath solutions and methods of plating

Abstract

Compositions for electroless plating baths and their use are disclosed, and more particularly chemical solutions and a method to transform a plating bath from the ability to produce one type of plated layer into a plating bath able to produce a different type of plated layer.

1 . An electroless metalized bath for plating a plurality of types of articles, comprising one or more initial solutions mixed with water, said initial solutions comprising together, in defined proportions, at least one metal salt; at least one complexer, at least one reducing agent, at least one pH adjuster in addition to said at least one complexer; and at least one stabilizer for stabilizing a plating reaction; wherein said bath is controlled by maintaining bath pH and temperature;
 wherein in said plating bath, plating one or more articles with a first kind of plated layer having specific physical properties;   wherein replenishing said plating bath by adding an additional amount of one or more solutions to said plating bath, said additional amount determined based on the determined depletion of at least one of said metal salt from said plating bath, plating at least one additional article with a plated layer having the same specific physical properties as said first kind of plated layer;   wherein replenishing said plating bath by adding an amount of a different one or more solutions to said plating bath, said amount determined based on the determined depletion of at least one of said metal salts from said plating bath, and plating at least one additional article with a second kind of plated layer having different specific physical properties from said first kind of plated layer.   
     
     
         2 . The method of  claim 1 , wherein said one or more solutions is limited to one. 
     
     
         3 . The method of  claim 1 , wherein said initial one or more solutions is used to produce a high phosphorus kind of electroless nickel plated layer. 
     
     
         4 . The method of  claim 1 , wherein said different one or more solutions is used to produce a medium phosphorus kind of electroless nickel plated layer. 
     
     
         5 . The method of  claim 2 , wherein said different one or more solutions is used to produce a low phosphorus electroless kind of nickel plated layer. 
     
     
         6 . A method for plating a plurality of types of articles comprising the steps of:
 formulating a plating bath by mixing one or more initial solutions with water, said initial solutions comprising together, in defined proportions, at least one metal salt; at least one complexer, at least one reducing agent, at least one PH adjuster in addition to said at least one complexer; and at least one stabilizer for stabilizing a plating reaction;   controlling said bath by maintaining bath pH and temperature;   in said plating bath, plating one or more articles with a first kind of plated layer having specific physical properties;   replenishing said plating bath by adding an additional amount of one or more solutions to said plating bath, said additional amount determined based on the determined depletion of at least one of said metal salt from said plating bath, plating at least one additional article with a plated layer having the same specific physical properties as said first kind of plated layer; and   replenishing said plating bath by adding an amount of a different one or more solutions to said plating bath, said amount determined based on the determined depletion of at least one of said metal salts from said plating bath, and plating at least one additional article with a second kind of plated layer having different specific physical properties from said first kind of plated layer.   
     
     
         7 . The method of  claim 6 , wherein said one or more solutions is limited to one. 
     
     
         8 . The method of  claim 7 , wherein said initial one or more solutions is used to produce a high phosphorus electroless nickel kind of plated layer. 
     
     
         9 . The method of  claim 7 , wherein said different one or more solutions is used to produce a medium phosphorus kind of electroless nickel plated layer. 
     
     
         10 . The method of  claim 7 , wherein said different one or more solutions is used to produce a low phosphorus kind of electroless nickel plated layer. 
     
     
         11 . The method of  claim 7 , wherein said initial one or more solutions and said different one or more solutions comprise the same composition and defined proportions of at least one metal salt; at least one complexer, at least one reducing agent, at least one pH adjuster in addition to said at least one complexer. 
     
     
         12 . The method of  claim 6 , wherein said initial one or more solutions and said different one or more solutions comprise different compositions and/or defined proportions of one or more stabilizers for stabilizing a plating reaction. 
     
     
         13 . The method of  claim 6 , wherein said initial one or more solutions and said different one or more solutions comprise a different composition and/or defined proportions of one or more accelerators to accelerate a plating reaction. 
     
     
         14 . The method of  claim 6 , wherein said at least one stabilizer is selected from the group consisting of lead, cadmium, bismuth, tin, copper, antimony, sulfur, and non-metal stabilizers in said initial one solution and/or said different one solution. 
     
     
         15 . The method of  claim 6 , wherein said at least one stabilizer in said initial one or more solutions and said different one or more solutions are free from the group consisting of lead, cadmium, chromium, or any substances that would cause the plated layer from said plating bath to not conform to Restriction of Hazardous Substances Directive (RoHS), End of Life Vehicle Directive (ELV), and Waste Electrical and Electronic Equipment Directive (WEEE) regulations. 
     
     
         16 . The method of  claim 6 , wherein said initial one or more solutions and said different one or more solutions are made without introducing PFAS substances. 
     
     
         17 . The method of  claim 6 , wherein said plating bath is an electroless nickel plating bath with a concentration of 3 to 6 grams of nickel per liter of said plating bath. 
     
     
         18 . The method of  claim 6 , wherein said plating bath further comprises a particulate material capable of producing a plated layer containing said particulate material. 
     
     
         19 . The method of  claim 6 , wherein the life of said bath is extended upon introduction of said different one or more solutions. 
     
     
         20 . The method of  claim 6 , wherein the pH of said initial one or more solutions and/or said different one or more solutions is within 3 pH units of the pH of said plating bath.