Heat dissipation device

Abstract

A heat dissipation device is adapted to dissipate a heat source. The heat dissipation device includes a casing, a heat conducting base, a heat conducting block, multiple heat dissipation pipes, at least one first heat dissipation fins assembly, and a heat dissipation medium. The heat conducting base is disposed inside the casing and thermally coupled to the heat source, and has a cavity and a side portion surrounding the cavity. The heat conducting block is disposed inside the cavity and is thermally coupled to the heat conducting base. Each heat dissipation pipe is inserted into the side portion. The at least one first heat dissipation fins assembly partially covers the cavity. The heat dissipation pipes are thermally coupled to the at least one first heat dissipation fins assembly. The heat dissipation medium is stored inside the cavity and immerses at least a portion of the heat conducting block.

What is claimed is: 
     
         1 . A heat dissipation device, adapted to dissipate heat from a heat source, the heat dissipation device comprising: 
 a casing, wherein the heat source is disposed inside the casing;   a heat conducting base, disposed inside the casing, wherein the heat conducting base is thermally coupled to the heat source and has a cavity and a side portion surrounding the cavity;   a heat conducting block, disposed inside the cavity and thermally coupled to the heat conducting base;   a plurality of heat dissipation pipes, inserted into the casing, wherein each of the heat dissipation pipes has a first end and a second end opposite to the first end, the first end of each of the heat dissipation pipes is inserted into the side portion and is interconnected with the cavity, the second end of each of the heat dissipation pipes is interconnected to the cavity;   at least one first heat dissipation fins assembly, disposed on the casing and partially covering the cavity, wherein the heat dissipation pipes are thermally coupled to the at least one first heat dissipation fins assembly; and   a heat dissipation medium, stored inside the cavity and immersing at least a portion of the heat conducting block.   
     
     
         2 . The heat dissipation device according to  claim 1 , wherein the heat conducting base comprises a top opening interconnected to the cavity, a top space is formed between the heat conducting block and the top opening, a lateral space is formed between the heat conducting block and the side portion, the top space and the lateral space are interconnected to each other, and the heat dissipation medium in liquid form is stored in the lateral space. 
     
     
         3 . The heat dissipation device according to  claim 2 , wherein the first end of each of the heat dissipation pipes comprises a connecting opening, and a distance from a center of the connecting opening to a bottom portion of the cavity is less than or equal to a height from a liquid surface of the heat dissipation medium to the bottom portion. 
     
     
         4 . The heat dissipation device according to  claim 2 , wherein the heat conducting block has a top surface facing the top opening, and the top surface has at least one recess, the at least one recess is interconnected to the top space, and the top space is interconnected with the top opening. 
     
     
         5 . The heat dissipation device according to  claim 4 , wherein the top surface of the heat conducting block is provided with at least one second heat dissipation fins assembly, and the at least one second heat dissipation fins assembly is located on one side of the at least one recess. 
     
     
         6 . The heat dissipation device according to  claim 5 , wherein the heat conducting block has a first side surface facing the lateral space and a second side surface opposite to the first side surface, and at least one of the first side surface and the second side surface is provided with a third heat dissipation fins assembly. 
     
     
         7 . The heat dissipation device according to  claim 6 , wherein the top surface of the heat conducting block is further provided with at least one fourth heat dissipation fins assembly, and the at least one recess is located between the at least one second heat dissipation fins assembly and the at least one fourth heat dissipation fins assembly. 
     
     
         8 . The heat dissipation device according to  claim 6 , wherein the third heat dissipation fins assembly comprises a plurality of fins disposed in parallel, and each of the fins is perpendicular to the first side surface or the second side surface. 
     
     
         9 . The heat dissipation device according to  claim 8 , wherein the at least one recess extends from the first side surface toward the second side surface and penetrates the first side surface and the second side surface, at least a portion of the fins of the third heat dissipation fins assembly extends across one side of the at least one recess. 
     
     
         10 . The heat dissipation device according to  claim 5 , wherein the at least one second heat dissipation fins assembly comprises a plurality of fins disposed in parallel, and a slit located between adjacent two of the fins extends from the lateral space toward the at least one recess. 
     
     
         11 . The heat dissipation device according to  claim 4 , further comprising: 
 a cover plate, disposed on one side of the at least one first heat dissipation fins assembly and closes the top opening together with the at least one first heat dissipation fins assembly, wherein the second end of each of the heat dissipation pipes is inserted into the cover plate, and the cover plate is aligned with the at least one recess.   
     
     
         12 . The heat dissipation device according to  claim 2 , wherein the heat conducting block has a first side surface, a second side surface opposite to the first side surface, a third side surface and a fourth side surface opposite to the third side surface, and the lateral space surrounds the first side surface, the second side surface, the third side surface and the fourth side surface, the heat conducting block is provided with at least one tapered hole on at least one of the third side surface and the fourth side surface, and an opening of the at least one tapered hole faces the first end of the heat dissipation pipes, the at least one tapered hole has a bottom surface opposite to the opening, and a diameter of the opening gradually decreases from the opening to the bottom surface. 
     
     
         13 . The heat dissipation device according to  claim 1 , wherein a capillary structure layer is disposed on a surface of the heat conducting block located in the cavity.