Polishing surface dressing method and method of manufacturing substrate

Abstract

A polishing surface dressing method includes: a dressing step of dressing a polishing surface; a polishing surface shape measuring step of measuring the shape of the polishing surface based on a displacement amount in a first direction orthogonal to the polishing surface and a movement position in the second direction of the dressing section that is in contact with the polishing surface; a determination step of determining appropriateness of the shape of the polishing surface measured in the polishing surface shape measuring step; and a condition change step of changing a contact condition in which the dressing section makes contact with the polishing surface in the dressing step, when the shape of the polishing surface is determined to be “No Good”, and the dressing step is performed again based on the contact condition changed in the condition change step.

What is claimed is: 
     
         1 . A polishing surface dressing method comprising dressing a polishing surface of a polishing pad of a polishing apparatus by a dressing section of a dressing mechanism,
 the polishing apparatus including: a holding table which is rotatable and holds a workpiece; the polishing pad which is rotatable and has the polishing surface provided to oppose a holding surface of the holding table; the dressing mechanism which is configured to make contact with the polishing surface and dress the polishing surface; a first direction movement mechanism which is configured to move the dressing section of the dressing mechanism in a first direction that is orthogonal to the polishing surface; a second direction movement mechanism which is configured to move at least one of the dressing section or the polishing pad in a second direction parallel to the polishing surface; and a displacement measuring unit which is configured to measure a displacement amount in the first direction of the dressing section,   the dressing the polishing surface by the dressing section including:   a dressing step of dressing the polishing surface by moving the dressing section along the polishing surface by the second direction movement mechanism while causing the dressing section to be in contact with the polishing surface by the first direction movement mechanism;   a polishing surface shape measuring step of measuring the shape of the polishing surface based on the displacement amount in the first direction and a movement position in the second direction of the dressing section that is in contact with the polishing surface;   a determination step of determining appropriateness of the shape of the polishing surface measured in the polishing surface shape measuring step; and   a condition change step of changing a contact condition in which the dressing section makes contact with the polishing surface in the dressing step, when the shape of the polishing surface is determined to be “No Good”,   the dressing step being performed based on the contact condition changed in the condition change step.   
     
     
         2 . The polishing surface dressing method according to  claim 1 , wherein, the contact condition is at least one of rotation speed of at least one of the polishing surface or the dressing section, moving speed of the dressing section, or pressing force with which the dressing section presses the polishing surface. 
     
     
         3 . The polishing surface dressing method according to  claim 1 , further comprising a dressing amount measurement step which includes accumulation of a dressing amount of the polishing pad in the dressing step, determination of whether an accumulated value of the dressing amount is less than a predetermined set value, and issuing of an alarm when the accumulated value of the dressing amount has reached the set value. 
     
     
         4 . The polishing surface dressing method according to  claim 2 , further comprising a dressing amount measurement step which includes accumulation of a dressing amount of the polishing pad in the dressing step, determination of whether an accumulated value of the dressing amount is less than a predetermined set value, and issuing of an alarm when the accumulated value of the dressing amount has reached the set value. 
     
     
         5 . A method of manufacturing a substrate, comprising:
 the polishing surface dressing method according to  claim 1 ; and   a polishing step of polishing a substrate that is a workpiece by the polishing pad, when the shape of the polishing surface is determined to be “Good” in the determination step of the polishing surface dressing method.   
     
     
         6 . A method of manufacturing a substrate, comprising:
 the polishing surface dressing method according to  claim 2 ; and   a polishing step of polishing a substrate that is a workpiece by the polishing pad, when the shape of the polishing surface is determined to be “Good” in the determination step of the polishing surface dressing method.   
     
     
         7 . A method of manufacturing a substrate, comprising:
 the polishing surface dressing method according to  claim 3 ; and   a polishing step of polishing a substrate that is a workpiece by the polishing pad, when the shape of the polishing surface is determined to be “Good” in the determination step of the polishing surface dressing method.   
     
     
         8 . A method of manufacturing a substrate, comprising:
 the polishing surface dressing method according to claim  4 ; and   a polishing step of polishing a substrate that is a workpiece by the polishing pad, when the shape of the polishing surface is determined to be “Good” in the determination step of the polishing surface dressing method.