Thermal device

Abstract

A thermal device including a bottom plate, a heat sink, and an evaporation chamber is provided. The bottom plate has multiple first grooves. The heat sink has multiple second grooves. The heat sink is assembled on the bottom plate, so that the first grooves and the second grooves co-construct multiple fluid channels. The evaporation chamber is configured on the bottom plate. The evaporation chamber includes a chamber and multiple columns. The chamber has multiple fluid inlets and multiple fluid outlets located on different sides. The fluid channels are communicated with the fluid inlets and the fluid outlets. The columns are disposed in the chamber.

What is claimed is: 
     
         1 . A thermal device, comprising:
 a bottom plate, having a plurality of first grooves;   a heat sink, having a plurality of second grooves, wherein the heat sink is assembled on the bottom plate, and the first grooves and the second grooves co-construct a plurality of fluid channels; and   an evaporation chamber, configured on the bottom plate, comprising:
 a chamber, having a plurality of fluid inlets and a plurality of fluid outlets, wherein the fluid inlets and the fluid outlets are located on different sides of the chamber, and the fluid channels are communicated with the fluid inlets and the fluid outlets; and 
 a plurality of columns, disposed in the chamber. 
   
     
     
         2 . The thermal device according to  claim 1 , wherein the fluid channels are in loops, and lengths of the fluid channels are different. 
     
     
         3 . The thermal device according to  claim 1 , wherein some of the fluid channels wind on a first side of the evaporation chamber, and some of the fluid channels wind on a second side of the evaporation chamber, and the first side and the second side are located on different sides of the evaporation chamber. 
     
     
         4 . The thermal device according to  claim 1 , wherein the chamber is made of copper. 
     
     
         5 . The thermal device according to  claim 1 , wherein the evaporation chamber further comprises a first copper powder sintering layer laid in the chamber. 
     
     
         6 . The thermal device according to  claim 5 , wherein the first copper powder sintering layer has a first region, a second region and a third region, the first region is disposed on a side of the chamber adjoining the fluid inlets, the second region is disposed on other sides around the chamber than the side adjoining the fluid inlets, and the first region and the second region enclose the third region. 
     
     
         7 . The thermal device according to  claim 6 , wherein a height of the first region is greater than a height of the second region. 
     
     
         8 . The thermal device according to  claim 6 , wherein the columns are disposed upright at intervals in the third region. 
     
     
         9 . The thermal device according to  claim 6 , wherein a plurality of copper powder sintering columns are disposed on two sides of the second region connected to the first region. 
     
     
         10 . The thermal device according to  claim 1 , wherein a top surface and a circumferential surface of each of the columns are covered with a second copper powder sintering layer. 
     
     
         11 . The thermal device according to  claim 1 , wherein apertures of the fluid inlets are smaller than apertures of the fluid outlets.