Dresser and method of manufacturing the same

Abstract

In one embodiment, a dresser includes a substrate. The dresser further includes a first layer provided on the substrate. The dresser further includes at least one convex portion provided on the substrate or the first layer, having an upper end that is higher than an upper face of the first layer, and having a composition that is different from a composition of the first layer. The dresser further includes a second layer provided on the at least one convex portion.

1 . A dresser comprising:
 a substrate;   a first layer provided on the substrate;   at least one convex portion provided on the substrate or the first layer, having an upper end that is higher than an upper face of the first layer, and having a composition that is different from a composition of the first layer; and   a second layer provided on the at least one convex portion.   
     
     
         2 . The dresser of  claim 1 , wherein the at least one convex portion includes at least any of:
 a first convex portion provided on the substrate so as to be in contact with the substrate; and   a second convex portion provided on the first layer so as not to be in contact with the substrate.   
     
     
         3 . The dresser of  claim 1 , wherein a first convex portion of the at least one convex portion includes:
 a first portion provided on the substrate in the first layer; and   a second portion provided on the first portion and having an upper end that is higher than the upper face of the first layer.   
     
     
         4 . The dresser of  claim 3 , wherein an area of the second portion in plan view is larger than an area of the first portion in plan view. 
     
     
         5 . The dresser of  claim 3 , wherein the second portion is provided on the first portion and the first layer. 
     
     
         6 . The dresser of  claim 3 , wherein a shape of a vertical section of the second portion is a triangle. 
     
     
         7 . The dresser of  claim 1 , wherein
 the substrate is a semiconductor substrate, and   the at least one convex portion is formed of a semiconductor material.   
     
     
         8 . The dresser of  claim 1 , wherein the substrate and the at least one convex portion are formed of the same semiconductor material. 
     
     
         9 . The dresser of  claim 1 , wherein
 the first layer is an insulator, and   the second layer is a diamond layer.   
     
     
         10 . The dresser of  claim 1 , wherein the second layer is provided on the at least one convex portion and the first layer, or provided on the at least one convex portion and the first layer and on side faces of the substrate and the first layer. 
     
     
         11 . The dresser of  claim 1 , further comprising:
 a chip holding member; and   at least one chip provided on the chip holding member,   wherein a first chip of the at least one chip includes the substrate, the first layer, the at least one convex portion, and the second layer.   
     
     
         12 . A method of manufacturing a dresser, comprising:
 forming a first layer on a substrate;   forming, on the substrate or the first layer, a third layer having a composition that is different from a composition of the first layer;   etching the third layer until the first layer is exposed, to form at least one convex portion from the third layer; and   forming a second layer on the at least one convex portion.   
     
     
         13 . The method of  claim 12 , wherein a first convex portion of the at least one convex portion is formed by:
 forming a first portion of the first convex portion on the substrate in the first layer, and   forming, on the first portion, a second portion of the first convex portion such that the second portion has an upper end that is higher than an upper face of the first layer.   
     
     
         14 . The method of  claim 12 , wherein the third layer is formed by epitaxial growth from the substrate. 
     
     
         15 . The method of  claim 12 , further comprising forming at least one concave portion in the first layer before forming the third layer,
 wherein the third layer is formed in the at least one concave portion and on the first layer.   
     
     
         16 . The method of  claim 12 , further comprising:
 forming a fourth layer on the third layer before etching the third layer;   etching the third layer using the fourth layer to form the at least one convex portion from the third layer; and   removing the fourth layer after etching the third layer.   
     
     
         17 . The method of  claim 12 , further comprising:
 manufacturing at least one chip; and   arranging the at least one chip on a chip holding member,   wherein a first chip of the at least one chip is manufactured so as to include the substrate, the first layer, the at least one convex portion, and the second layer.   
     
     
         18 . A method of manufacturing a dresser, comprising:
 preparing a wafer including a substrate, a first layer provided on the substrate, and at least one convex portion provided on the substrate or the first layer and having a composition that is different from a composition of the first layer;   manufacturing at least one chip from the wafer; and   arranging the at least one chip on a chip holding member.   
     
     
         19 . The method of  claim 18 , further comprising:
 forming a second layer on the at least one convex portion after preparing the wafer; and   manufacturing, from the wafer, a first chip including the substrate, the first layer, the at least one convex portion, and the second layer after forming the second layer.   
     
     
         20 . The method of  claim 18 , further comprising:
 manufacturing, from the wafer, a first chip including the substrate, the first layer, and the at least one convex portion after preparing the wafer; and   forming a second layer on the at least one convex portion after manufacturing the first chip.