Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device includes a first substrate and an electronic component coupled to an inner side of the first substrate. A vertical interconnect structure can be coupled to the inner side of the first substrate and may include a core structure coupled to the first substrate, a wire coupled to the core structure and opposite the first substrate, and an encapsulant disposed around the wire. The device also includes a second substrate disposed over the electronic component and coupled to the vertical interconnect structure. The encapsulant can comprise protrusions and a recessed side that define a cavity. The wire can protrude from the encapsulant into the cavity.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a first substrate;   an electronic component coupled to an inner side of the first substrate;   a vertical interconnect structure coupled to the inner side of the first substrate, the vertical interconnect structure comprising:
 a core structure coupled to the first substrate; 
 a wire coupled to the core structure and opposite the first substrate; and 
 a first encapsulant disposed around the wire; and 
   a second substrate disposed over the electronic component and coupled to the vertical interconnect structure.   
     
     
         2 . The electronic device of  claim 1 , wherein the first encapsulant comprises protrusions and a recessed side that define a cavity. 
     
     
         3 . The electronic device of  claim 2 , wherein the wire protrudes from the first encapsulant into the cavity. 
     
     
         4 . The electronic device of  claim 2 , wherein the core structure is disposed in the cavity. 
     
     
         5 . The electronic device of  claim 1 , wherein the core structure comprises a metallic core ball. 
     
     
         6 . The electronic device of  claim 1 , wherein the wire protrudes from the first encapsulant towards the core structure. 
     
     
         7 . The electronic device of  claim 1 , wherein the core structure comprises a fusible material coupled to the wire and coupled to the first substrate. 
     
     
         8 . The electronic device of  claim 1 , further comprising a second encapsulant disposed over the electronic component, around the core structure, and between inner sidewalls of the first encapsulant. 
     
     
         9 . The electronic device of  claim 8 , wherein a side of the first substrate and a side of the second encapsulant are substantially coplanar. 
     
     
         10 . The electronic device of  claim 1 , wherein the second substrate is in electronic communication with the electronic component through the wire, the core structure, and the first substrate. 
     
     
         11 . An electronic device, comprising:
 a first substrate;   an electronic component disposed over an inner side of the first substrate;   a vertical interconnect structure disposed over the inner side of the first substrate, the vertical interconnect structure comprising:
 a metallic core ball coupled to the first substrate; 
 a wire coupled to the metallic core ball opposite the first substrate; 
 a fusible material coupled to the metallic core ball, the wire, and the first substrate; and 
 a first encapsulant disposed around the wire with a tip of the wire protruding from the first encapsulant; 
   a second substrate disposed over the electronic component and the vertical interconnect structure, wherein the wire of the vertical interconnect structure is coupled to the second substrate; and   a second encapsulant disposed over the electronic component, around the metallic core ball, and between inner sidewalls of the first encapsulant.   
     
     
         12 . The electronic device of  claim 11 , wherein a side of the first substrate, a side of the first encapsulant, a side of the second encapsulant, and a side of the second substrate are substantially coplanar. 
     
     
         13 . The electronic device of  claim 11 , wherein the second substrate is in electronic communication with the electronic component through the wire, the metallic core ball, and the first substrate. 
     
     
         14 . The electronic device of  claim 11 , wherein the first encapsulant comprises protrusions and a recessed side defining a cavity. 
     
     
         15 . The electronic device of  claim 14 , wherein the metallic core ball is coupled to the tip of the wire in the cavity. 
     
     
         16 . A method of making an electronic device, comprising:
 providing a first substrate;   providing a wire coupled to an inner side of the first substrate;   providing a first encapsulant over and around the wire with a tip of the wire protruding from the first encapsulant;   providing a metallic core structure over the wire;   coupling an electronic component to a second substrate;   coupling the metallic core structure to the second substrate, wherein a fusible material around the metallic core structure is coupled to the second substrate and the wire; and   providing a second encapsulant between the first substrate and the second substrate, over the electronic component, and around the metallic core structure.   
     
     
         17 . The method of  claim 16 , further comprising removing a portion of the first encapsulant to leave protrusions of the first encapsulant and a recessed side of the first encapsulant that define a cavity. 
     
     
         18 . The method of  claim 16 , wherein providing the first encapsulant comprises:
 providing a chase including a mold film over the first substrate and around the wire with the tip of the wire extending into the mold film;   providing the first encapsulant between the chase and the first substrate; and   removing the chase and the mold film.   
     
     
         19 . The method of  claim 16 , wherein providing the first encapsulant comprises:
 providing the first encapsulant over and around the wire; and   removing a portion of the first encapsulant to expose the wire at a recessed side and between protrusions of the first encapsulant.   
     
     
         20 . The method of  claim 19 , wherein providing the metallic core structure over the wire comprises providing the metallic core structure in a cavity defined by the protrusions and the recessed side.