Printed board, image forming apparatus, and mounting method

Abstract

A printed board includes a plurality of through holes including a first through hole and a second through hole are arranged adjacently in an arrangement direction, a plurality of lands disposed corresponding to the plurality of through holds, and one through fourth pads. The plurality of lands includes a first land corresponding to the first through hole and a second land corresponding to the second through hole. The first land is provided with a first land portion electrically connected to the first pad, and a second land portion electrically connected to the second pad and not electrically connected to the first land portion. The second land is provided with a third land portion electrically connected to the third pad, and a fourth land portion electrically connected to the fourth pad and not electrically connected to the third land portion.

What is claimed is: 
     
         1 . A printed board comprising:
 a through hole arrangement in which a plurality of through holes including a first through hole and a second through hole are arranged adjacently in an arrangement direction;   a plurality of lands disposed corresponding to the plurality of through holds, respectively, the plurality of lands including a first land corresponding to the first through hole and a second land corresponding to the second through hole;   a first pad;   a second pad;   a third pad; and   a fourth pad,   wherein the first land is provided with a first land portion electrically connected to the first pad, and a second land portion electrically connected to the second pad and not electrically connected to the first land portion, and   wherein the second land is provided with a third land portion electrically connected to the third pad, and a fourth land portion electrically connected to the fourth pad and not electrically connected to the third land portion.   
     
     
         2 . The printed board according to  claim 1 , wherein the plurality of lands includes a third land, and
 wherein each of surface areas of the first land portion, the second land portion, the third land portion and the fourth land portion is smaller than a surface area of the third land.   
     
     
         3 . The printed board according to  claim 2 , wherein in a crossing direction along a surface of the printed board and crossing to the arrangement direction, the first land portion and the second land portion are disposed in different positions, and
 wherein in the crossing direction, the third land portion and the fourth land portion are disposed in different positions.   
     
     
         4 . The printed board according to  claim 3 , wherein in the shortest distance between the first land portion and the second land portion is 0.3 mm or more, and
 wherein in the shortest distance between the third land portion and the fourth land portion is 0.3 mm or more.   
     
     
         5 . The printed board according to  claim 4 , wherein in the crossing direction, each of the first land portion and the second land portion is between the first pad and the second pad, and
 wherein in the crossing direction, each of the third land portion and the fourth land portion is between the third pad and the fourth pad.   
     
     
         6 . A printed board comprising:
 a through hole arrangement in which a plurality of through holes including a first through hole, a second through hole and a third through hole are arranged adjacently in an arrangement direction;   a plurality of lands disposed corresponding to the plurality of through holds, respectively, the plurality of lands including a first land corresponding to the first through hole, a second land corresponding to the second through hole, and a third land corresponding to the third through hole; and   a component of which one end side is mounted on the second through hole and of which the other end side is mounted on the third through hole, and overlapped with the first through hole as seen in a direction perpendicular to a surface of the printed board.   
     
     
         7 . The printed board according to  claim 6 , wherein in a crossing direction along the surface of the printed board and crossing to the arrangement direction, the first land is positioned between the second land and the third land. 
     
     
         8 . The printed board according to  claim 7 , wherein in the arrangement direction, at least of the first land, at least of the second land and the third land are positioned at a same position. 
     
     
         9 . The printed board according to  claim 8 , wherein the component is a jumper wire. 
     
     
         10 . An image forming apparatus for performing an image formation onto a recording material, the image forming apparatus comprising:
 a printed board according to  claim 1 .   
     
     
         11 . An image forming apparatus according to  claim 10 , further comprising:
 a photosensitive drum;   an exposure device configured to form an electrostatic latent image on the photosensitive drum; and   a control portion configured to control the exposure device,   wherein the control portion is included in the printed board.   
     
     
         12 . An image forming apparatus for performing an image formation onto a recording material, the image forming apparatus comprising:
 a printed board according to  claim 6 .   
     
     
         13 . An image forming apparatus according to  claim 12 , further comprising:
 a photosensitive drum;   an exposure device configured to form an electrostatic latent image on the photosensitive drum; and   a control portion configured to control the exposure device,   wherein the control portion is included in the printed board.   
     
     
         14 . A mounting method for mounting a mounting component on a substrate,
 wherein the mounting component is provided with a plurality of lead pins,   wherein the substrate includes:
 a plurality of through hole including a first through hole and a second through hole; 
 a plurality of lands disposed corresponding to the plurality of through holds, respectively; 
 a first pad; 
 a second pad; 
 a third pad; and 
 a fourth pad, 
   wherein the plurality of lands includes:
 a first land to which one of lead pins, of the plurality of lead pins to be mounted on the first through hole, is soldered, the first land is provided with a first land portion electrically connected to the first pad, and a second land portion electrically connected to the second pad and not electrically connected to the first land portion; and 
 a second land to which one of lead pins, of the plurality of lead pins to be mounted on the second through hole, is soldered, the second land is provided with a third land portion electrically connected to the third pad, and a fourth land portion electrically connected to the fourth pad and not electrically connected to the third land portion, and 
   wherein the mounting method includes:
 a first step for inserting the plurality of lead pins into the plurality of through holes; 
 a second step for soldering the plurality of lead pins on the plurality of lands; 
 a third step for connecting an inspection device to the first pad and the second pad, and measuring a current signal; and 
 a fourth step for connecting the inspection device to the third pad and the fourth pad, and measuring a current signal.