Method for manufacturing individualized-piece-film and individualized-piece-film, and method for manufacturing display device and display device

Abstract

A method for manufacturing an individualized-piece-film that can obtain excellent workability of individualized pieces, an individualized-piece-film, and a display device. The method irradiates a laser light from a base material side to an anisotropic conductive film formed on a base material to remove the anisotropic conductive film in the irradiated area (removal portion), thereby forming individualized pieces of a predetermined shape. The thickness of the anisotropic conductive film is 1 μm or more and 10 μm or less, the melt viscosity of the anisotropic conductive film at 30° C. is 2,000 Pa*s or more and 800,000 Pa*s or less, and 90% or more of the conductive particles in the anisotropic conductive film are present at an average of the center positions of the conductive particles in the thickness direction of the anisotropic conductive film.

1 - 26 . (canceled) 
     
     
         27 . An individualized-piece-film including individualized pieces of a predetermined shape composed of an anisotropic conductive film, wherein
 the thickness of the anisotropic conductive film is 0.9 times or more and 8 times or less of the particle diameter of the conductive particles in the anisotropic conductive film, and   the melt viscosity of the anisotropic conductive film at 30° C. is 2,000 Pa*s or more and 800,000 Pa*s or less.   
     
     
         28 . The individualized-piece-film according to  claim 27 , wherein 90% or more of the conductive particles in the anisotropic conductive film are present at an average of the center positions of the conductive particles in the thickness direction of the anisotropic conductive film. 
     
     
         29 . The individualized-piece-film according to  claim 27 , wherein the predetermined shape is at least one selected from a polygon with obtuse angles, a polygon with rounded corners, an ellipse, an oval, and a circle. 
     
     
         30 . The individualized-piece-film according to  claim 27 , wherein the conductive particles in the anisotropic conductive film are aligned in a surface direction. 
     
     
         31 . The individualized-piece-film according to  claim 27 , wherein the melt viscosity of the anisotropic conductive film at 30° C. is 5,000 Pa*s or more and 500,000 Pa*s or less. 
     
     
         32 . A display device, comprising:
 a plurality of light-emitting elements;   a wiring substrate on which the light-emitting elements are arranged; and   a cured film that connects the plurality of light-emitting elements to the wiring substrate, wherein   the cured film is made by curing individualized pieces of a predetermined shape composed of an anisotropic conductive film,   the thickness of the anisotropic conductive film is 0.9 times or more and 8 times or less of the particle diameter of the conductive particles in the anisotropic conductive film, and   the melt viscosity of the anisotropic conductive film at 30° C. is 2,000 Pa*s or more and 800,000 Pa*s or less.   
     
     
         33 . The display device according to  claim 32 , wherein 90% or more of the conductive particles in the anisotropic conductive film are present at an average of the center positions of the conductive particles in the thickness direction of the anisotropic conductive film. 
     
     
         34 . The display device according to  claim 32 , wherein the predetermined shape is at least one selected from a polygon with obtuse angles, a polygon with rounded corners, an ellipse, an oval, and a circle. 
     
     
         35 . The display device according to  claim 32 , wherein the distance between the individualized pieces is 3 μm or more. 
     
     
         36 . The display device according to  claim 32 , wherein the light-emitting elements are arranged in units of subpixels that constitute a pixel. 
     
     
         37 . The display device according to  claim 32 , wherein the individualized pieces are arranged on the wiring substrate in units of subpixels or pixels. 
     
     
         38 . A connection structure, comprising:
 a first electronic component;   a second electronic component; and   a cured film connecting the first electronic component and the second electronic component, wherein   the cured film is made by curing individualized pieces of a predetermined shape composed of an anisotropic conductive film,   the thickness of the anisotropic conductive film is 0.9 times or more and 8 times or less of the particle diameter of the conductive particles in the anisotropic conductive film, and   the melt viscosity of the anisotropic conductive film at 30° C. is 2,000 Pa*s or more and 800,000 Pa*s or less.   
     
     
         39 . The connection structure according to  claim 38 , wherein 90% or more of the conductive particles in the anisotropic conductive film are present at an average of the center positions of the conductive particles in the thickness direction of the anisotropic conductive film. 
     
     
         40 . The connection structure according to  claim 38 , wherein the predetermined shape is at least one selected from a polygon with obtuse angles, a polygon with rounded corners, an ellipse, an oval, and a circle. 
     
     
         41 . The connection structure according to  claim 38 , wherein the distance between the individualized pieces is 3 μm or more. 
     
     
         42 . The connection structure according to  claim 38 , wherein the conductive particles in the anisotropic conductive film are aligned in a surface direction. 
     
     
         43 . The connection structure according to  claim 38 , wherein the melt viscosity of the anisotropic conductive film at 30° C. is 5,000 Pa*s or more and 500,000 Pa*s or less. 
     
     
         44 . The display device according to  claim 32 , wherein the conductive particles in the anisotropic conductive film are aligned in a surface direction. 
     
     
         45 . The display device according to  claim 32 , wherein the melt viscosity of the anisotropic conductive film at 30° C. is 5,000 Pa*s or more and 500,000 Pa*s or less.