Chip grinding device and grinding method

Abstract

The present application introduces a chip grinding device and a chip grinding method. The chip grinding device includes: a fixture for holding the chip; a grinding assembly set above the fixture for grinding the chip; a moving assembly connected to the grinding assembly for adjusting the position of the grinding assembly; a vacuum assembly set on one side of the fixture for collecting debris and dust generated during chip grinding, wherein the vacuum assembly is equipped with a speed control button for adjusting the collection power; and a controller electrically connected to at least the grinding assembly and the moving assembly for controlling the operation of the grinding assembly and the moving assembly. Therefore, the application avoids the problems of low efficiency and low precision caused by manual grinding, maintains the cleanliness of the surrounding environment, and avoids problems such as short circuits of chips caused by debris and dust.

What is claimed is: 
     
         1 . A chip grinding device, wherein the chip grinding device comprises:
 Fixture, used for clamping the chip.   Grinding assembly, arranged above the clamp for grinding the chip;   Moving assembly, connected to the grinding assembly for moving the grinding assembly to adjust its position.   Vacuum assembly, arranged on one side of the clamp for collecting the debris and dust generated when the chip is grinding, wherein the vacuum assembly is provided with a speed regulating button for adjusting the collected power;   Controller, at least electrically connected to the grinding assembly and the moving assembly, for controlling the operation of the grinding assembly and the moving assembly.   
     
     
         2 . The chip grinding device according to  claim 1 , wherein the fixture comprises:
 A base is provided with a base slide rail.   The first clamping block and the second clamping block are set on the base, and the chip is set between the first clamping block and the second clamping block. At least one of the first clamping block and the second clamping block can slide along the base slide rail to hold the chip.   
     
     
         3 . The chip grinding device according to  claim 2 , wherein the first clamping block and the second clamping block are provided with spaced protrusions on the side facing the chip, and the protrusions of the first clamping block and the protrusions of the second clamping block are offset. 
     
     
         4 . The chip grinding device according to  claim 2 , wherein the moving assembly comprises a first moving unit, a second moving unit, and a third moving unit, wherein:
 The first moving unit is connected to the grinding assembly and is used to control the movement of the grinding assembly in the first direction.   The second moving unit is connected to the first moving unit and the third moving unit respectively, and is used to control the first moving unit to move in the second direction.   The third moving unit is used to control the second moving unit to move in the third direction.   Wherein, the first direction, the second direction, and the third direction are perpendicular to each other, and the first direction is perpendicular to the direction of the chip.   
     
     
         5 . The chip grinding device according to  claim 4 , wherein the chip grinding device further comprises an automatic leveling sensor and a pressure sensor. A grinding assembly includes a grinding motor and a grinding head. A grinding motor is used to drive the grinding head to rotate. An automatic leveling sensor is set on the first moving unit and is used to move with the first moving unit to touch the feature position points of the chip. A pressure sensor is set on the base and is used to obtain the height of the grinding head when the automatic leveling sensor touches multiple feature position points of the chip, so as to calculate the relative heights of the multiple feature position points and control the grinding head to rise or fall according to the multiple relative heights. 
     
     
         6 . The chip grinding device according to  claim 1 , wherein the chip grinding device further comprises a camera, which is set above the chip to detect the model of the chip and provide feedback to the controller, so that the controller can control the grinding assembly and the moving assembly according to the model. 
     
     
         7 . The chip grinding device according to  claim 1 , wherein the vacuum assembly comprises a vacuum cleaner and a vacuum pipe, wherein:
 One end of the vacuum pipe is connected to the vacuum cleaner, and the other end is set on the side of the fixture, with the opening of the other end facing the chip.   A vacuum cleaner is equipped with a vacuum fan, and the speed control button is set on the vacuum cleaner to adjust the power of the vacuum fan.   
     
     
         8 . The chip grinding device according to  claim 7 , wherein the vacuum pipe comprises a vacuum part, a transition part, a main body part, and a connecting part, wherein:
 The vacuum part is set on one side of the fixture and forms the opening.   The transition part connects the vacuum part and the main body part, and the directions set for the vacuum part and the main body part are different, and the transition part is a curved structure.   The main body part is connected to the vacuum cleaner through the connecting part at one end away from the transition part.   
     
     
         9 . The chip grinding device according to  claim 8 , wherein the dust vacuum part is a rectangular structure, the main body part is a cylindrical structure, one end of the transition part is a rectangular structure adapted to the dust vacuum part, and the other end is a cylindrical structure adapted to the main body part, and the transition part is bent from the rectangular structure to the cylindrical structure. 
     
     
         10 . A method for grinding chips, wherein the method for grinding chips is applied in a chip grinding device according to  claim 1 , and the method for grinding chips comprises:
 Provide the chip on the fixture.   Control the movement of the moving assembly to adjust the position of the grinding assembly.   Control the grinding assembly to grind the chip, and simultaneously opening the vacuum assembly to collect the debris and dust generated when the chip is grinding, wherein the power collected by the vacuum assembly can be adjusted according to the grinding speed of the grinding assembly.