System and Method for Sintering Structures on a Base

Abstract

A system and a method for sintering one or more structures on a base includes at least one sinter unit that is configured to sinter the structures on the base. The sinter unit is further configured to position at least one film layer to be in proximity to the structures on the base, and apply force and provide heat to the film layer and the structures on the base for the structures to sinter. A corresponding method is further described.

What is claimed is: 
     
         1 . A system for sintering one or more structures on a base, comprising
 at least one sinter unit, configured to sinter the one or more structures on the base;   wherein the sinter unit is further configured to   position at least one film layer to be in proximity to the one or more structures on the base; and   apply force and provide heat to the film layer and the one or more structures on the base for the one or more structures to sinter.   
     
     
         2 . The system according to  claim 1 , wherein the sinter unit comprises a thermal-pressure module, which comprises
 a presser, which is configured to apply the force via its press surface;   a platform, in which the base rests thereupon; and   a heating sub-module, which is configured to provide heat to any one or both the presser and the platform.   
     
     
         3 . The system according to  claim 2 , wherein the presser is configured to move along one or more directions, which include any one or both of:
 a first direction for applying the force against the one or more structures on the base, with the film layer being between the presser and the one or more structures on the base; and   a second direction for relieving the force against the one or more structures on the base.   
     
     
         4 . The system according to  claim 2 , wherein the press surface of the presser is contoured to include one or more cavities, which are each adapted to substantially enclose and to be substantially adjacent to each of the one or more structures on the base as the presser applies the force. 
     
     
         5 . The system according to  claim 2 , wherein
 the film layer is heat resistant; and   the presser has a coating that substantially prevents adhesion between the presser, and any one or both the film layer and the one or more structures on the base.   
     
     
         6 . The system according to  claim 2 , further comprising a film handler module that is configured to prepare and handle a tray, the tray being formed by the film layer being supported by a support structure, for the tray to be actuated for the film layer to be between the presser and the one or more structures on the base. 
     
     
         7 . The system according to  claim 1 , further comprising a first material application unit configured to position a stencil to be adjacent to the base, and dispose a first material onto the stencil to be spread, for the one or more structures to be formed on the base. 
     
     
         8 . The system according to  claim 7 , further comprising a second material application unit configured to dispose second material onto the one or more structures on the base. 
     
     
         9 . The system according to  claim 1 , wherein the one or more structures are of a material composition that is selected from a group of metals that comprises copper, silver, gold, palladium, tin, or platinum. 
     
     
         10 . A method for sintering one or more structures on a base, comprising the step of sintering the one or more structures on the base, by a sinter unit;
 wherein the sinter unit is further configured to   position at least one film layer to be in proximity to the one or more structures on the base; and   apply force and provide heat to the film layer and the one or more structures on the base for the one or more structures to sinter.