Radial oscillating heat pipe for enhanced heat spreading

Abstract

An oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels containing a volume of heat transfer fluid. The condenser section surrounds the evaporator section. An electronics system includes an electronic component, and an oscillating heat pipe positioned at the electronic component configured to remove thermal energy from the electronic component. The oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section. The plurality of fluid channels contain a volume of heat transfer fluid. The condenser section surrounds the evaporator section.

What is claimed is: 
     
         1 . An oscillating heat pipe, comprising: 
 an evaporator section;    a condenser section;   a plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels containing a volume of heat transfer fluid;   wherein the condenser section surrounds the evaporator section.   
     
     
         2 . The oscillating heat pipe of  claim 1 , wherein the plurality of fluid channels extend substantially radially between the condenser section and the evaporator section. 
     
     
         3 . The oscillating heat pipe of  claim 1 , wherein the plurality of fluid channels increases in channel density with increasing distance from the condenser section. 
     
     
         4 . The oscillating heat pipe of  claim 1 , wherein the plurality of fluid channels are arranged into a plurality of channel loops. 
     
     
         5 . The oscillating heat pipe of  claim 4 , wherein the plurality of channel loops are a plurality of loop segments arranged around a perimeter of the evaporator section.  
     
     
         6 . The oscillating heat pipe of  claim 4 , wherein the plurality of channel loops are nested in a radial direction.  
     
     
         7 . The oscillating heat pipe of  claim 4 , wherein at least two channel loops of the plurality of channel loops are interconnected in one of a serial or parallel relationship.  
     
     
         8 . The oscillating heat pipe of  claim 1 , wherein the plurality of channel loops are connected at a common fill port. 
     
     
         9 . The oscillating heat pipe of  claim 1 , wherein the plurality of fluid channels are disposed on one of a circular or rectangular or polygonal substrate.  
     
     
         10 . The oscillating heat pipe of  claim 1 , further comprising one or more interconnects extending through the substrate between a first side of the substrate and a second side of the substrate opposite the first side.  
     
     
         11 . An electronics system, comprising: 
 an electronic component; and    an oscillating heat pipe disposed at the electronic component configured to remove thermal energy from the electronic component, the oscillating heat pipe including: 
 an evaporator section;  
 a condenser section; 
 a plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels containing a volume of heat transfer fluid; 
 wherein the condenser section surrounds the evaporator section. 
   
     
     
         12 . The electronics system of  claim 11 , wherein the evaporator section is disposed at a thermal energy source of the electronic component. 
     
     
         13 . The electronics system of  claim 11 , wherein the plurality of fluid channels are formed in a substrate of the electronics component.  
     
     
         14 . The electronics system of  claim 11 , wherein the plurality of fluid channels are disposed in a substrate operably connected to the electronic component.  
     
     
         15 . The electronics system of  claim 14 , further comprising one or more interconnects extending through the substrate between a first side of the substrate and a second side of the substrate opposite the first side for electronic connections through the oscillating heat pipe.  
     
     
         16 . The electronics system of  claim 11 , wherein the plurality of fluid channels increases in channel density with increasing distance from the condenser section. 
     
     
         17 . The electronics system of  claim 11 , wherein the plurality of fluid channels are arranged into a plurality of channel loops. 
     
     
         18 . The electronics system of  claim 17 , wherein the plurality of channel loops are nested in a radial direction. 
     
     
         19 . The electronics system of  claim 17 , wherein the plurality of channel loops are a plurality of loop segments arranged around a perimeter of the evaporator section.  
     
     
         20 . The electronics system of  claim 17 , wherein at least two channel loops of the plurality of channel loops are interconnected in one of a serial or parallel relationship.