Particle manufacturing method and particle manufacturing device

Abstract

A particle manufacturing method is disclosed. A particle manufacturing method according to one aspect of the present disclosure as a method of forming a spherical particle may include forming a structure for forming a structure of a protruding shape with a material composing of the particle on a first substrate, disposing substrates for disposing the first substrate such that the structure faces downward and disposing a second substrate facing the first substrate below the first substrate, forming a particle for heating and diffusing the structure of the first substrate to from a spherical particle from the diffused material of the structure, and collecting a particle for collecting particles by landing the spherical particles falling from the first substrate on the second substrate.

What is claimed is: 
     
         1 . A particle manufacturing method as a method of forming a spherical particle, the method comprising:
 forming a structure for forming a structure of a protruding shape with a material composing of the particle on a first substrate;   disposing substrates for disposing the first substrate such that the structure faces downward and disposing a second substrate facing the first substrate below the first substrate;   forming a particle for heating and diffusing the structure of the first substrate to form a spherical particle from the diffused material of the structure; and   collecting a particle for collecting particles by landing the spherical particles falling from the first substrate on the second substrate.   
     
     
         2 . The particle manufacturing method of  claim 1 ,
 wherein the forming a structure comprises forming a cylindrical pillar standing on the first substrate.   
     
     
         3 . The particle manufacturing method of  claim 2 ,
 wherein in the forming a structure, a diameter or an aspect ratio of the cylindrical pillar is modified to control a diameter of the spherical particle formed in the forming a particle.   
     
     
         4 . The particle manufacturing method of  claim 3 ,
 wherein the forming a structure comprises:   forming a first cylindrical pillar on the first substrate;   oxidizing the first pillar; and   forming a second cylindrical pillar having a smaller diameter than the first cylindrical pillar by removing an oxidized layer of the first cylindrical pillar.   
     
     
         5 . The particle manufacturing method of  claim 1 ,
 wherein in the forming a structure, the material composing of the particle comprises a semiconductor material.   
     
     
         6 . The particle manufacturing method of  claim 5 ,
 wherein the semiconductor material comprises at least any one of silicon (Si), germanium (Ge), gallium arsenide (GaAs), and silicon carbide (SiC).   
     
     
         7 . The particle manufacturing method of  claim 1 ,
 wherein the forming a particle comprises annealing the structure at a high temperature.   
     
     
         8 . The particle manufacturing method of  claim 1 , the method further comprising separating the particle for separating the spherical particle landed on the second substrate from the second substrate. 
     
     
         9 . The particle manufacturing method of  claim 8 ,
 wherein the separating the particle comprises sliding a blade across a surface of the second substrate to detach the spherical particle.   
     
     
         10 . The particle manufacturing method of  claim 1 , the method further comprising, after the collecting a particle, planarizing the first substrate for reuse to re-form a structure of a protruding shape with a material composing of the particle on the first substrate. 
     
     
         11 . A particle manufacturing device comprising:
 a support configured to support a first substrate below which a structure of a protruding shape is formed;   a heating unit configured to heat the structure of the first substrate supported by the support; and   a collection unit disposed below the support and configured to support a second substrate on which a spherical particle transformed by heating the structure is landed.   
     
     
         12 . The particle manufacturing device of  claim 11 , further comprising a chamber accommodating the support, the heating unit and the collection unit. 
     
     
         13 . The particle manufacturing device of  claim 11 , further comprising a blade configured to slide across a surface of the second substrate to detach the spherical particle.