US2026049385A1PendingUtilityA1
Low thermal expansion alloy
Est. expiryAug 14, 2044(~18.1 yrs left)· nominal 20-yr term from priority
C22C 38/52C22C 38/50C22C 38/48C22C 38/46C22C 38/44C22C 38/42C22C 38/06C22C 38/04C22C 38/02C22C 38/005C22C 38/002C22C 38/001C21D 8/06C21D 8/10C21D 1/26C21D 8/0273C21D 2211/004C21D 9/46C21D 9/08C21D 8/021C21D 8/0226C21D 2261/00C21D 9/0068C22C 38/14C22C 38/58C22C 38/54C22C 38/08C21D 6/001C22C 38/16C22C 38/12C22C 38/105
59
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Claims
Abstract
The present invention relates to a low thermal expansion alloy, consisting of: 0.10 to 0.40 mass % of C; up to 1.00 mass % of Si; 0.10 to 2.00 mass % of Mn; up to 0.050 mass % of P; up to 0.015 mass % of S; 0.10 to 4.00 mass % of Cu; 35.0 to 45.0 mass % of Ni; 0.10 to 1.00 mass % of V; up to 4.00 mass % of Mo; each up to 0.50 mass % of Cr, Co, Al, Ti, Nb, W, Zr, Hf, and Ta; and each up to 0.050 mass % of B, Mg, Ca, and REM, with the balance being Fe and unavoidable impurities. The low thermal expansion alloy satisfies A≥38.0 and 40.6<B≤44.5. Here, A and B are defined in the description.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A low thermal expansion alloy consisting of:
0.10 mass %≤C≤0.40 mass %; Si≤1.00 mass %; 0.10 mass %≤Mn≤2.00 mass %; P≤0.050 mass %; S≤0.015 mass %; 0.10 mass %≤Cu≤4.00 mass %; 35.0 mass %≤Ni≤45.0 mass %; 0.10 mass %≤V≤1.00 mass %; 0 mass %≤Cr≤0.50 mass %; 0 mass %≤Mo≤4.00 mass %; 0 mass %≤Co≤0.50 mass %; 0 mass %≤Al≤0.50 mass %; 0 mass %≤Ti≤0.50 mass %; 0 mass %≤Nb≤0.50 mass %; 0 mass %≤W≤0.50 mass %; 0 mass %≤Zr≤0.50 mass %; 0 mass %≤Hf≤0.50 mass %; 0 mass %≤Ta≤0.50 mass %; 0 mass %≤B≤0.050 mass %; 0 mass %≤Mg≤0.050 mass %; 0 mass %≤Ca≤0.050 mass %; and 0 mass %≤REM≤0.050 mass %, with the balance being Fe and unavoidable impurities, wherein the low thermal expansion alloy satisfies the following formulas (1) and (2):
A
≥
38.
,
and
(
1
)
40.6
<
B
≤
4
4.5
,
(
2
)
wherein
A
=
[
Ni
]
+
[
Co
]
+
0.7
*
[
Cu
]
-
[
Si
]
-
[
Mn
]
-
[
Cr
]
-
0.5
*
[
Mo
]
-
0.5
*
[
V
]
,
and
B
=
[
Ni
]
+
0.8
*
[
Co
]
+
[
Cu
]
+
6
*
[
C
]
+
1.1
*
[
Si
]
+
[
Mn
]
+
1.2
*
[
Cr
]
+
0.2
*
[
Mo
]
-
0.5
*
[
V
]
.
2 . The low thermal expansion alloy according to claim 1 , having a tensile strength of 500 MPa or more,
wherein the “tensile strength” refers to a value obtained by performing a tensile test at room temperature (25° C.) in an atmosphere using a round bar-shaped No. 3 test piece having a parallel portion with a diameter of 6 mm in accordance with ASTM A370-17.
3 . The low thermal expansion alloy according to claim 1 , having a thermal expansion coefficient of 3.5×10 −6 /° C. or more and 6.0×10 −6 /° C. or less,
wherein the “thermal expansion coefficient” refers to an average linear thermal expansion coefficient from 30° C. to 100° C., measured in accordance with ASTM E228-17.
4 . The low thermal expansion alloy according to claim 1 , having a magnetic transformation point of 280° C. or higher.
5 . The low thermal expansion alloy according to claim 1 , wherein the unavoidable impurities include at least one selected from the group consisting of:
Sn≤0.010 mass %; Zn≤0.010 mass %; As≤0.010 mass %; Se≤0.010 mass %; Sb≤0.010 mass %; Ag≤0.010 mass %; Bi≤0.0010 mass %; O≤0.050 mass %, and N≤0.050 mass %.Join the waitlist — get patent alerts
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