Automated cmp pad change for cmp system

Abstract

A system, controller, and method of automatically changing a polishing pad of a chemical mechanical polishing (CMP) system are provided. In one aspect, a CMP system includes a platen having a pad mounting surface upon which a pad, or replacement pad, can be disposed. The platen forms a plurality of apertures that extend to the pad mounting surface. The CMP system also includes a pad handler arranged to selectively move a pad onto the pad mounting surface during a pad installation process, and to selectively move the pad from the pad mounting surface during a pad removal process. The CMP system further includes a vacuum pump arranged to selectively apply a vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface, such as during CMP processing of a substrate. The vacuum pump can cease applying the vacuum during an automated pad change process.

What is claimed is: 
     
         1 . A chemical mechanical polishing (CMP) system, comprising:
 a platen having a pad mounting surface and forming a plurality of apertures that extend to the pad mounting surface;   a pad handler arranged to selectively move a pad onto the pad mounting surface during pad installation, and to selectively move the pad from the pad mounting surface during pad removal; and   a vacuum pump arranged to selectively apply a vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface.   
     
     
         2 . The CMP system of  claim 1 , further comprising:
 pad stops arranged to stop the pad in position on the pad mounting surface during pad installation and to urge the pad from the pad mounting surface and to the pad handler during pad removal.   
     
     
         3 . The CMP system of  claim 2 , wherein the pad stops are each rotatable and each have a main body and a web projecting from the main body, and wherein:
 the pad stops are rotatable so that the pad engages the main bodies of the pad stops to stop the pad in position on the pad mounting surface during pad installation, and   the pad stops are rotatable so that the webs of the pad stops engage the pad so as to urge the pad from the pad mounting surface and to the pad handler during pad removal.   
     
     
         4 . The CMP system of  claim 1 , further comprising:
 a new pad cartridge configured to store a plurality of new pads, and   wherein the pad handler is arranged to selectively move the pad, which is one of the plurality of new pads, from the new pad cartridge onto the pad mounting surface.   
     
     
         5 . The CMP system of  claim 1 , further comprising:
 a used pad cartridge configured to store a plurality of used pads, and   wherein the pad handler is arranged to selectively move the pad, which is one of the plurality of used pads, from the pad mounting surface into the used pad cartridge.   
     
     
         6 . The CMP system of  claim 1 , further comprising:
 a pad cartridge configured to store a plurality of pads, the pad cartridge having a support plate that is biased against the plurality of pads so as to align one of the plurality of pads with a door of the pad cartridge.   
     
     
         7 . The CMP system of  claim 6 , wherein the support plate is biased against the plurality of pads so as to press one of the plurality of pads against a cartridge roller of the pad cartridge. 
     
     
         8 . The CMP system of  claim 1 , wherein the pad has a closed-cell layer that is arranged to be disposed on the pad mounting surface. 
     
     
         9 . The CMP system of  claim 1 , wherein the pad handler has rollers, with at least one of the rollers being rotatably driven. 
     
     
         10 . The CMP system of  claim 1 , wherein the pad handler has rollers, including a first pair and a second pair, with rollers of the first pair being rotatable and movable relative to rollers of the second pair. 
     
     
         11 . The CMP system of  claim 10 , wherein the rollers of the first pair include a first roller and a second roller that are movable between a plurality of positions, including a first position, a second position, and a third position, wherein:
 in the first position, the first pair of rollers is aligned with the rollers of the second pair along a first direction,   in the second position, the rollers of the first pair are offset with respect to the rollers of the second pair along the first direction and positioned closer to the pad mounting surface than the rollers of the first pair are in the first position, and   in the third position, the rollers of the first pair are offset with respect to the rollers of the second pair along the first direction and positioned so that the first roller is positioned above the pad mounting surface and the second roller is positioned, at least in part, below the pad mounting surface.   
     
     
         12 . The CMP system of  claim 11 , wherein the rollers of the first pair are arranged at staggered heights in each of the first, second, and third positions. 
     
     
         13 . The CMP system of  claim 1 , wherein the platen is rotatable about an axis of rotation, and wherein the system further comprises:
 a rotary union mechanically coupling the platen with a vacuum conduit so as to provide fluid communication between the vacuum pump and the plurality of apertures.   
     
     
         14 . The CMP system of  claim 1 , wherein the plurality of apertures are concentrically arranged in at least two rows on the pad mounting surface. 
     
     
         15 . A controller for use in a chemical mechanical polishing (CMP) system, comprising:
 one or more processors; and   one or more memory devices storing a program, which, when executed by any combination of the one or more processors, causes the one or more processors to perform an operation, the operation comprising:
 moving, using a pad handler, a pad onto, or from, a pad mounting surface of a platen, wherein the platen forms a plurality of apertures that extend to the pad mounting surface; and 
 selectively controlling a vacuum pump to apply vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface or to release the pad from the pad mounting surface. 
   
     
     
         16 . The controller of  claim 15 , wherein in moving, using the pad handler, the pad onto, or from, the pad mounting surface of the platen, the operation comprises:
 retrieving, using the pad handler, the pad from a pad cartridge; and   selectively moving a pair of rollers of the pad handler to guide the pad onto the pad mounting surface.   
     
     
         17 . The controller of  claim 15 , wherein in moving, using the pad handler, the pad onto, or from, the pad mounting surface of the platen, the operation comprises:
 controlling the vacuum pump to cease applying vacuum within the plurality of apertures; and   retrieving the pad from the pad mounting surface by using rollers of the pad handler to rotatably drive the pad along the pad mounting surface and by rotating pad stops to engage the pad so as to urge the pad toward the rollers.   
     
     
         18 . A method, comprising:
 moving, using a pad handler, a pad onto, or from, a pad mounting surface of a platen, wherein the platen forms a plurality of apertures that extend to the pad mounting surface; and   selectively controlling a vacuum pump to apply vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface or to release the pad from the pad mounting surface.   
     
     
         19 . The method of  claim 18 , wherein moving, using the pad handler, the pad onto, or from, the pad mounting surface of the platen comprises:
 retrieving, using the pad handler, the pad from a pad cartridge; and   selectively moving a pair of rollers of the pad handler to guide the pad onto the pad mounting surface.   
     
     
         20 . The method of  claim 18 , wherein moving, using the pad handler, the pad onto, or from, the pad mounting surface of the platen comprises:
 controlling the vacuum pump to cease applying vacuum within the plurality of apertures; and   retrieving the pad from the pad mounting surface by using rollers of the pad handler to rotatably drive the pad along the pad mounting surface and by rotating pad stops to engage the pad so as to urge the pad toward the rollers.