Substrate polishing device

Abstract

A substrate polishing device includes: a plurality of wheels, the plurality of wheels comprising electromagnets; at least one belt comprising a first surface on a circumference of the plurality of wheels and a second surface opposite to the first surface and facing a polishing surface of the substrate, the at least one belt being configured to move based on rotation of the plurality of wheels; a magnetic field supplier configured to supply current to the electromagnets to generate a magnetic field in the plurality of wheels; at least one MRF supplier configured to supply the MRF onto the second surface of the at least one belt; a recovery structure configured to recover the MRF from the at least one belt; and a conditioner configured to filter the MRF recovered from the recovery structure and supply the filtered MRF to the at least one MRF supplier.

What is claimed is: 
     
         1 . A substrate polishing device for polishing a substrate using a magnetorheological fluid (MRF), the substrate polishing device comprising:
 a plurality of wheels configured to rotate based on a wheel axis that is parallel to the substrate, the plurality of wheels comprising electromagnets;   at least one belt comprising a first surface on a circumference of the plurality of wheels and a second surface opposite to the first surface and facing a polishing surface of the substrate, the at least one belt being configured to move based on rotation of the plurality of wheels;   a magnetic field supplier configured to supply current to the electromagnets to generate a magnetic field in the plurality of wheels;   at least one MRF supplier configured to supply the MRF onto the second surface of the at least one belt;   a recovery structure configured to recover the MRF from the at least one belt; and   a conditioner configured to filter the MRF recovered from the recovery structure and supply the filtered MRF to the at least one MRF supplier.   
     
     
         2 . The substrate polishing device of  claim 1 , wherein the at least one belt is configured to support the MRF on the second surface, and
 wherein the polishing surface of the substrate is configured to be polished by frictional contact of the MRF supported and moving on the second surface of the at least one belt.   
     
     
         3 . The substrate polishing device of  claim 1 , wherein the at least one belt comprises a plurality of belts, and
 wherein the second surface of each belt of the plurality of belts faces the polishing surface of the substrate.   
     
     
         4 . The substrate polishing device of  claim 3 , wherein the at least one MRF supplier comprises a plurality of MRF suppliers connected to the plurality of belts, respectively. 
     
     
         5 . The substrate polishing device of  claim 3 , wherein the at least one MRF supplier comprises a supply pump configured to apply pressure to the MRF. 
     
     
         6 . The substrate polishing device of  claim 1 , wherein the magnetic field supplier is further configured to independently supply the magnetic field to the plurality of wheels. 
     
     
         7 . The substrate polishing device of  claim 1 , wherein the magnetic field supplier comprises:
 a power supply configured to supply current; and   a connecting portion connected to the power supply and the plurality of wheels, the connecting portion being configured to transmit the current supplied from the power supply to the plurality of wheels.   
     
     
         8 . The substrate polishing device of  claim 1 , further comprising:
 at least one processor configured to control the magnetic field supplier to control a strength of the magnetic field generated by the electromagnets based on the current supplied from the magnetic field supplier.   
     
     
         9 . The substrate polishing device of  claim 1 , wherein the MRF comprises magnetic particles and abrasive particles, and
 wherein an arrangement of the magnetic particles changes based on a strength of the magnetic field.   
     
     
         10 . The substrate polishing device of  claim 9 , wherein the magnetic particles comprise iron powder (carbonyl iron powder (CIP), magnetite (Fe 3 O 4 ), and cobalt ferrite (CoFe 3 O 4 ). 
     
     
         11 . The substrate polishing device of  claim 9 , wherein the abrasive particles comprise silica (SiO 2 ), cerium oxide (CeO 2 ), aluminum oxide (Al 2 O 3 ), zinc peroxide (ZnO 2 ), and carbon (C). 
     
     
         12 . The substrate polishing device of  claim 11 , wherein the conditioner comprises a filtering portion configured to remove impurities in the MRF. 
     
     
         13 . The substrate polishing device of  claim 12 , wherein the conditioner is further configured to maintain the MRF supplied to the at least one MRF supplier at a preset constant condition based on the magnetic field. 
     
     
         14 . A substrate polishing device for polishing a substrate using a magnetorheological fluid (MRF), the substrate polishing device comprising:
 a plurality of wheels in at least a 2×2 matrix and configured to rotate based on a wheel axis that is parallel to the substrate,, the plurality of wheels comprising electromagnets;   at least two belts, each of the at least two belts comprising a first surface on a circumference of the plurality of wheels arranged in a row and a second surface opposite to the first surface and facing a polishing surface of the substrate, the at least two belts being configured to support the MRF and move based on to rotation of the plurality of wheels;   a head structure configured to support the substrate such that the polishing surface of the substrate faces the second surface of each belt of the at least two belts;   a magnetic field supplier configured to supply current to the electromagnets to generate a magnetic field in the plurality of wheels;   an MRF supplier configured to supply the MRF to the second surface of each belt of the at least two belts;   a recovery structure configured to recover the MRF from the second surface of each belt of the at least two belts; and   a conditioner on the magnetic field supplier and configured to maintain the MRF recovered from the recovery structure and supplied to the MRF supplier at a preset constant condition.   
     
     
         15 . The substrate polishing device of  claim 14 , further comprising:
 a blocking portion between the magnetic field supplier and the conditioner.   
     
     
         16 . The substrate polishing device of  claim 14 , wherein the head structure comprises:
 a head surface configured to support the substrate so that the polishing surface of the substrate faces the second surface of each belt of the at least two belts;   a head driving portion configured to rotate the head surface with respect to an axis in a direction a perpendicular to the polishing surface; and   an angle adjustment portion configured to adjust an angle formed by the head surface with respect to the second surface of each belt of the at least two belts so that one side of the head surface is inclined with respect to the second surface of each belt of the at least two belts.   
     
     
         17 . A substrate polishing device for polishing a substrate using a magnetorheological fluid (MRF), the substrate polishing device comprising:
 a plurality of wheels arranged in a row and configured to rotate based on a wheel axis parallel to the substrate, the plurality of wheels comprising an electromagnet;   a belt comprising a first surface on a circumference of the plurality of wheels and a second surface opposite to the first surface and facing a polishing surface of the substrate, the belt being configured to support the MRF and move based on to rotation of the plurality of wheels;   a magnetic field supplier on a side of the plurality of wheels and configured to supply current to the electromagnet to generate a magnetic field in the plurality of wheels;   an MRF supplier configured to supply the MRF to the second surface of the belt;   a recovery structure configured to recover the MRF from the belt; and   a conditioner on a side portion of the magnetic field supplier and configured to maintain the MRF recovered from the recovery structure and supplied to the MRF supplier under a preset constant condition,   wherein the belt passes through a center of the polishing surface of the substrate.   
     
     
         18 . The substrate polishing device of  claim 17 , further comprising:
 a blocking portion between the magnetic field supplier and the conditioner.   
     
     
         19 . The substrate polishing device of  claim 17 , wherein the MRF comprises magnetic particles and abrasive particles, and
 wherein an arrangement of the magnetic particles changes based on a strength of the magnetic field.   
     
     
         20 . The substrate polishing device of  claim 17 , wherein the magnetic field supplier comprises:
 a power supply connected to the plurality of wheels and configured to supply current to the plurality of wheels; and   a support portion connected to the power supply and supporting the power supply.