US2026047637A1PendingUtilityA1
Thermal-resistant shoe components
Est. expiryFeb 5, 2038(~11.5 yrs left)· nominal 20-yr term from priority
Inventors:BECERRA II ROBERT HENRY
A43B 17/003A43B 17/10A43B 13/12A43B 13/32A43B 7/125A43B 7/34
59
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Claims
Abstract
Provided herein are embodiments of a shoe component. The shoe component may include a toebox, an insole, an adhesive membrane, a thermal-resistant insert, a midsole, and an outsole. The insert may further include a footbed. The footbed may include an upper surface and a bottom surface. The insert may further include an upper laminate on the upper surface of the footbed and a lower laminate on the bottom surface of the footbed.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A shoe component comprising:
a toebox; an insole; an adhesive membrane; a thermal-resistant insert;
wherein the insert comprises a footbed;
wherein the footbed comprises an upper surface and a bottom surface;
a midsole; and an outsole.
2 . The shoe component of claim 1 , wherein the insert comprises an upper laminate on the upper surface of the footbed.
3 . The shoe component of claim 2 , wherein the insert comprises a lower laminate on the bottom surface of the footbed.
4 . The shoe component of claim 1 , wherein the adhesive membrane may be located between the insole and the insert.
5 . The shoe component of claim 1 , wherein the adhesive membrane may be located between the insert and the midsole.
6 . The shoe component of claim 1 , wherein the insert further comprises chemical and/or radiation-resistant properties.
7 . The shoe component of claim 1 , wherein the insert is not removable.
8 . The shoe component of claim 1 , footbed is made of molded material that has an open-cell material structure.
9 . The shoe component of claim 2 , wherein the upper laminate is bonded on the upper surface of the footbed using a material that has heat storage and release properties.
10 . The shoe component of claim 3 , wherein the bottom laminate is bonded on the bottom surface of the footbed using a hydrophilic fiber material.
11 . The shoe component of claim 1 , wherein the insert further comprises moisture-wicking properties.
12 . The shoe component of claim 1 , wherein the insert further comprises anti-microbial coatings.
13 . The shoe component of claim 1 , wherein the insert further comprises performance-lining materials.
14 . A method of creating a temperature differential inside and outside a shoe comprising:
providing a shoe component, wherein the shoe component comprises a toebox layer, an insole layer, an adhesive membrane layer, a midsole layer, and an outsole layer; laminating an insert, wherein the insert comprises a footbed, and wherein the footbed further comprises an upper surface and a bottom surface; and placing the insert in between one of the layers of the shoe component.
15 . The method of creating a temperature differential inside and outside a shoe of claim 14 , wherein laminating an insert further comprises bonding a hydrophilic fiber material to the lower surface of the insert and bonding a material that has heat storage and release properties to the upper surface of the insert
16 . The method of creating a temperature differential inside and outside a shoe of claim 14 , wherein providing a shoe component further comprises affixing using the adhesive membrane the insole and the insert.
17 . The method of creating a temperature differential inside and outside a shoe of claim 14 , wherein providing a shoe component further comprises affixing using the adhesive membrane the midsole and the insert.
18 . The method of creating a temperature differential inside and outside a shoe of claim 14 further comprising providing the insert with moisture-wicking properties.
19 . The method of creating a temperature differential inside and outside a shoe of claim 14 further comprising coating the insert with anti-microbial materials.
20 . The method of creating a temperature differential inside and outside a shoe of claim 14 further comprising affixing the insert within the shoe component.Join the waitlist — get patent alerts
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