Packaged module with low modulus composite magnetic molding material

Abstract

A packaged module includes an electrically conductive coil and a composite magnetic molding material covering the electrically conductive coil. The composite magnetic molding material includes a magnetic filler including coated magnetic particles (MB) dispersed in a composite non-magnetic material (MA). The composite magnetic molding material further includes a modulus reducing filler (MC) including modulus reducing particles or rubber particles or including functional groups having —OH or —COOH.

What is claimed is: 
     
         1 . A packaged module, comprising:
 an electrically conductive coil; and   a composite magnetic molding material covering the electrically conductive coil, wherein the composite magnetic molding material includes a magnetic filler including coated magnetic particles (MB) dispersed in a composite non-magnetic material (MA) and a modulus reducing filler (MC) including modulus reducing particles or rubber particles or including functional groups having —OH or —COOH.   
     
     
         2 . The packaged module of  claim 1 , further comprising:
 a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a plurality of pins, and wherein the electrically conductive coil is disposed on the first surface of the substrate.   
     
     
         3 . The packaged module of  claim 2 , wherein the substrate includes a plurality of electrically conductive wiring structures configured to provide interconnections or electrical couplings between the electrically conductive coil and one or more of the plurality of pins. 
     
     
         4 . The packaged module of  claim 2 , wherein the electrically conductive coil has coil terminals configured to be substantially coplanar with each other and directly attached to corresponding pads on the first surface of the substrate. 
     
     
         5 . The packaged module of  claim 1 , further comprising:
 an integrated circuit (“IC”) die disposed in the packaged module and being configured to co-work with an integrated inductive energy storage device including the electrically conductive coil and the composite magnetic molding material.   
     
     
         6 . The packaged module of  claim 1 , wherein the electrically conductive coil is core-less. 
     
     
         7 . The packaged module of  claim 1 , wherein the electrically conductive coil is conformally coated with a thin insulation layer and has coil terminals with each one of the coil terminals having an exposed area that is free of coverage from the thin insulation layer. 
     
     
         8 . The packaged module of  claim 1 , wherein the electrically conductive coil is configured to have a winding having multiple wiring turns wound along a predetermined direction in a helix-like shape. 
     
     
         9 . The packaged module of  claim 1 , wherein the electrically conductive coil is configured to have a winding having a single turn in the form of a conductive spread sheet wound along a predetermined direction. 
     
     
         10 . The packaged module of  claim 1 , wherein the composite magnetic molding material includes the coated magnetic particles (MB) in an amount of 68.3% to 99% by mass. 
     
     
         11 . The packaged module of  claim 1 , wherein an amount of the modulus reducing filler (MC) in the composite magnetic material is in a range of substantially 0.8% to 17.3% by mass. 
     
     
         12 . The packaged module of  claim 1 , wherein the coated magnetic particles include magnetic metal particles (MB1) that are surface coated with an insulation coating layer (MB2). 
     
     
         13 . The packaged module of  claim 1 , wherein the coated magnetic particles (MB) include iron (Fe) and silicon (Si) or includes Fe of 48.6% to 90.7% by mass. 
     
     
         14 . The packaged module of  claim 1 , wherein the coated magnetic particles have non-uniform sizes and/or non-uniform shapes or have sizes in median diameters ranging from 0.3 μm to 54.8 μm. 
     
     
         15 . The packaged module of  claim 1 , wherein the coated magnetic particles (MB) include large sized particles having sizes in median diameters essentially ranging from 33.6 μm to 54.8 μm, and/or small sized particles with median diameters essentially ranging from 0.3 μm to 8.6 μm and/or medium sized particles having sizes in median diameters essentially ranging from 8.7 μm to 33.4 μm. 
     
     
         16 . The packaged module of  claim 1 , wherein the coated magnetic particles (MB) include large sized particles with median diameters essentially ranging from 33.6 μm to 54.8 μm in an amount of no lower than 33.8%×(1±20%) by quantity percentage or in an amount of 33.8% to 76.3% by quantity percentage with a predetermined tolerance margin of ±20%, or in an amount of no lower than 48.6% by cross-sectional area percentage or in an amount of substantially from 48.6% to 79.3% by cross-sectional area percentage, or in an amount of no lower than 48.6% by mass or in an amount of substantially from 48.6% to 79.3% by mass. 
     
     
         17 . The packaged module of  claim 1 , wherein the coated magnetic particles (MB) include particles with median diameters no greater than 20 μm in an amount of no greater than 40.8% by mass or by cross-sectional area percentage, or no greater than 47.2% by quantity percentage. 
     
     
         18 . The packaged module of  claim 1 , wherein the coated magnetic particles (MB) include small sized particles with median diameters essentially ranging from 0.3 μm to 8.6 μm in an amount of no greater than 34.6% by quantity percentage, or in an amount of no greater than 28.7% by cross-sectional area percentage or in an amount of substantially from 7.2% to 28.7% by cross-sectional area percentage, or in an amount of no greater than 28.7% by mass or in an amount of substantially from 7.2% to 28.7% by mass. 
     
     
         19 . The packaged module of  claim 1 , wherein the coated magnetic particles (MB) include medium sized particles with median diameters essentially ranging from 8.7 μm to 33.4 μm in an amount of no greater than 34.6% by quantity percentage, or in an amount of no greater than 38.4% by cross-sectional area percentage or in an amount of substantially from 11.3% to 38.4% by cross-sectional area percentage, or in an amount of no greater than 38.4% by mass or in an amount of substantially from 11.3% to 38.4% by mass. 
     
     
         20 . The packaged module of  claim 1 , wherein, the coated magnetic particles (MB) include small sized particles with median diameters essentially ranging from 0.3 μm to 8.6 μm and medium sized particles with median diameters essentially ranging from 8.7 μm to 33.4 μm in an amount of 22.3% to 62.2% by quantity percentage with a predetermined tolerance margin of +20%. 
     
     
         21 . The packaged module of  claim 1 , wherein the coated magnetic particles (MB) are surface coated with an insulation coating layer (MB2) that contains elements Silicon (Si), Carbon (C), and Oxygen (O). 
     
     
         22 . The packaged module of  claim 1 , wherein the coated magnetic particles are surface coated with an insulation coating layer (MB2) that contains element Si in an amount of 0.52% to 2.93% of the composite magnetic material by mass with a predetermined tolerance margin of +20%. 
     
     
         23 . The packaged module of  claim 1 , wherein the coated magnetic particles are surface coated with an insulation coating layer (MB2) that includes a layer of polymer including silane coupling agents or that includes one or more types of silane coupling agents selected from KH550, KH560, KH570 and DA. 
     
     
         24 . The packaged module of  claim 1 , wherein the composite non-magnetic material (MA) includes a thermoset cross-linkable polymeric resin (MA1). 
     
     
         25 . The packaged module of  claim 1 , wherein the modulus reducing filler (MC) or the modulus reducing particles or rubber particles form island structures within the composite non-magnetic material (MA). 
     
     
         26 . The packaged module of  claim 1 , wherein the composite magnetic molding material has a relative magnetic permeability of no lower than 6.5 at a frequency essentially ranging from 800 MHz to 1000 MHz, or a relative magnetic permeability of no lower than 8 at a frequency essentially ranging from 450 MHz to 750 MHz, or a relative magnetic permeability of no lower than 10 at a frequency of no greater than 450 MHz, or a relative magnetic permeability of no lower than 13 at a frequency of no greater than 200 MHz, or a relative magnetic permeability of no lower than 16 at a frequency of no greater than 100 MHz. 
     
     
         27 . The packaged module of  claim 1 , wherein the magnetic molding compound has a low core-loss of essentially 15 kW/m 3  to 60 KW/m 3  at 5 mT and/or a thermal conductivity ranging from 1.6 W/m·K to 4 W/m·K. 
     
     
         28 . The packaged module of  claim 1 , wherein the electrically conductive coil includes a substantial body including wiring turns wound along a direction of a height of the packaged module. 
     
     
         29 . The packaged module of  claim 28 , wherein a top side wiring turn and a bottom side wiring turn of the electrically conductive coil are respectively substantially plan. 
     
     
         30 . The packaged module of  claim 28 , wherein the electrically conductive coil has coil terminals with each one of the coil terminals integrally formed as part of a wiring turn of the electrically conductive coil and is stretched out from the wiring turn to beyond the substantial body in a width and length plane of the packaged module. 
     
     
         31 . The packaged module of  claim 1 , wherein the electrically conductive coil includes wiring turns wound into multiple layers when inspected from a plane view perpendicular to a direction of a height of the packaged module. 
     
     
         32 . The packaged module of  claim 1 , wherein the electrically conductive coil has coil terminals with one or more of the coil terminals vertically bent down to reach a substantially same plane as rest of the coil terminals. 
     
     
         33 . The packaged module of  claim 28 , wherein the packaged module is configured to support an operating current ranging from  1 A to  4 A with the electrically conductive coil being wound with a round coil wire having a wire diameter no greater than 0.3 mm, or wherein the packaged module is configured to support an operating current ranging from  4 A to  10 A with the electrically conductive coil being wound with a round coil wire having a wire diameter no greater than 0.4 mm. 
     
     
         34 . The packaged module of  claim 1 , wherein the packaged module is configured to support an operating current ranging from  1 A to  4 A or from  4 A to  10 A, and wherein the packaged module has a power conversion efficiency peak value higher than 85% up to or higher than 90%. 
     
     
         35 . The packaged module of  claim 1 , wherein the electrically conductive coil includes wiring turns wound along a direction of a width or a length of the packaged module. 
     
     
         36 . The packaged module of  claim 35 , wherein a substantial body of the electrically conductive coil that includes the wiring turns has a bottom side that is substantially flat. 
     
     
         37 . The packaged module of  claim 35 , wherein the electrically conductive coil has coil terminals with each one of the coil terminals integrally formed as part of a flat portion of a wiring turn of the electrically conductive coil. 
     
     
         38 . The packaged module of  claim 37 , wherein the electrically conductive coil is conformally coated with a thin insulation layer, and wherein each one of the coil terminals has an exposed area that is free of coverage from the thin insulation layer, and wherein for each one of the coil terminals, the exposed area spreads from an end edge of the coil terminal to a position which lands in a scope from a minimum position to a maximum position located on the flat portion that the coil terminal is integrally formed with. 
     
     
         39 . The packaged module of  claim 1 , further comprising:
 a substrate; and   an IC die disposed on a first surface of the substrate or embedded inside the substrate; wherein the electrically conductive coil is disposed on the first surface of the substrate or embedded inside the substrate.   
     
     
         40 . The packaged module of  claim 39 , wherein the substrate further has a second surface opposite to the first surface and a plurality of pins formed on the second surface, wherein the plurality of pins include an input pin and a switch pin disposed at a first peripheral side of the packaged module, and wherein the input pin is capable of receiving an input voltage, and wherein the switch pin is electrically coupled to the IC die and the electrically conductive coil. 
     
     
         41 . The packaged module of  claim 40 , wherein the plurality of pins further include output pins disposed at a second peripheral side which is opposite to the first peripheral side of the packaged module.