Electronic modules for co-packaged optics and copper packages

Abstract

Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

What is claimed is: 
     
         1 . An electronic module, comprising: 
 a multi-chip module (MCM) substrate having a first surface configured for connection to a system printed circuit board (PCB) and a second surface defining a central portion and a peripheral portion;   a main die positioned on the central portion of the second surface of the MCM substrate; and   a plurality of interconnects positioned on the peripheral portion of the MCM substrate and in electrical communication with the main die, wherein each interconnect is configured to engage a connector portion of a secondary assembly substrate such that a main portion of the secondary assembly substrate is positioned such that a functional portion of the secondary assembly substrate is disposed outside of a footprint of the MCM substrate, and wherein the main portion of the secondary assembly substrate is larger than the connector portion of the secondary assembly substrate.   
     
     
         2 . The electronic module of  claim 1 , wherein each interconnect of the plurality of interconnects is configured to mechanically receive and electrically connect a secondary assembly comprising the secondary assembly substrate to the MCM substrate. 
     
     
         3 . The electronic module of  claim 1 , wherein each interconnect comprises a frame defining an access opening that allows the main portion of the secondary assembly substrate to extend beyond an edge of the interconnect. 
     
     
         4 . The electronic module of  claim 1 , wherein the plurality of interconnects are configured to receive a first secondary assembly that is a co-packaged copper (CPC) package and a second secondary assembly that is a co-packaged optics (CPO) package simultaneously. 
     
     
         5 . The electronic module of  claim 1 , further comprising an attachment member configured to mechanically secure the connector portion of the secondary assembly substrate with respect to a corresponding interconnect. 
     
     
         6 . The electronic module of  claim 5 , wherein the attachment member is a contiguous element configured to simultaneously secure a plurality of secondary assembly substrates in their corresponding interconnects. 
     
     
         7 . An electronic module, comprising: 
 a multi-chip module (MCM) comprising a main die disposed on an MCM substrate, the MCM substrate further comprising a plurality of interconnects disposed on a peripheral portion thereof; and   a first secondary assembly comprising a first secondary assembly substrate, the first secondary assembly substrate comprising: 
 a connector portion engaged and supported by a first interconnect of the plurality of interconnects; and 
 a main portion that is positioned such that a functional portion of the first secondary assembly substrate is disposed outside a footprint of the MCM substrate,  
 wherein the main portion has a surface area sufficient to support a plurality of active components, and the connector portion has a smaller surface area optimized for high-density electrical interconnection. 
   
     
     
         8 . The electronic module of  claim 7 , wherein the first secondary assembly is a co-packaged copper (CPC) package and the main portion hosts one or more devices comprising one or more radio-frequency copper cable connectors. 
     
     
         9 . The electronic module of  claim 7 , wherein the first secondary assembly is a co-packaged optics (CPO) package and the main portion hosts one or more devices comprising one or more optical devices. 
     
     
         10 . The electronic module of  claim 9 , wherein the CPO package comprises a power connection on the main portion of the first secondary assembly substrate configured to receive power directly from a system PCB to which the MCM substrate is mounted. 
     
     
         11 . The electronic module of  claim 7 , further comprising a second secondary assembly engaged with a second interconnect, wherein the first secondary assembly is a CPC package and the second secondary assembly is a CPO package. 
     
     
         12 . The electronic module of  claim 7 , further comprising a support member configured to be positioned between the main portion of the first secondary assembly substrate and a system PCB to which the MCM substrate is coupled to support the main portion, wherein the support member is disposed entirely beyond the peripheral portion of the MCM substrate. 
     
     
         13 . The electronic module of  claim 7 , wherein the first secondary assembly is a CPO package, and wherein the main portion comprises an optical connector configured to couple with an external optical fiber cable for transmitting optical signals between the CPO package and another component of an electronic device. 
     
     
         14 . The electronic module of  claim 7 , wherein the first secondary assembly is a CPO package, and wherein the one or more devices are supported on a first surface of the first secondary assembly substrate that is oriented toward a system PCB to which the MCM substrate is coupled, thereby eliminating a need for signal traces to pass through a core of the first secondary assembly substrate and improving signal integrity of high-speed electrical traces between the one or more devices and an interconnect of the plurality of interconnects. 
     
     
         15 . An electronic module comprising: 
 an MCM substrate supporting a main die; and    a co-packaged optics (CPO) package comprising a CPO package substrate electrically coupled to the main die, the CPO package substrate supporting optical devices on a first surface thereof,    wherein the CPO package comprises a CPO package substrate that is oriented such that the first surface of the CPO package substrate faces a system PCB, providing a direct electrical path between the optical devices and an interconnect of the MCM substrate that improves a signal integrity metric by eliminating the need for signal vias through the CPO package substrate.   
     
     
         16 . The electronic module of  claim 15 , wherein the interconnect is configured to mechanically receive and electrically connect the CPO package substrate to the MCM substrate. 
     
     
         17 . The electronic module of  claim 15 , wherein the CPO package substrate comprises a connector portion configured to be coupled to the interconnect and a main portion, wherein the main portion hosts the optical devices. 
     
     
         18 . The electronic module of  claim 17 , wherein when the connector portion of the CPO package substrate is coupled to the interconnect, the main portion of the CPO package substrate is disposed outside of a footprint of the MCM substrate. 
     
     
         19 . The electronic module of  claim 17 , wherein the main portion has a surface area sufficient to support a plurality of active components, and the connector portion has a smaller surface area that the main portion and is optimized for high-density electrical interconnection. 
     
     
         20 . The electronic module of  claim 15 , further comprising a co-packaged copper (CPC) package coupled to the main die, the CPC package hosting one or more devices comprising one or more radio-frequency copper cable connectors.