Thermal management system and method of controlling the same

Abstract

A thermal management system and a method of controlling the same are disclosed. The thermal management system includes a heat exchanger comprising a plurality of plates in a stacked relationship. When in the stacked relationship, the plates form flow channels for a first fluid and a second fluid. The thermal management system further includes at least one flow control device located downstream of the heat exchanger to regulate an outflow of the first fluid and/or the second fluid from the heat exchanger. The method includes selectively controlling the at least one flow control device to create a backflow pressure, thereby improving flow distribution of the first fluid and/or the second fluid within the flow channels of the heat exchanger mitigating maldistribution.

What is claimed is: 
     
         1 . A method for controlling a thermal management system, comprising:
 providing a thermal management system including a heat exchanger fluidly connected to a first circuit for a first fluid and a second circuit for a second fluid, wherein at least one flow control device is disposed downstream of the heat exchanger in the first circuit and/or the second circuit; and   selectively controlling the at least one flow control device to cause an accumulation of the first fluid and/or the second fluid within the heat exchanger.   
     
     
         2 . The method of  claim 1 , wherein the first circuit includes a vapor-injection compressor. 
     
     
         3 . The method of  claim 1 , wherein the first fluid is a refrigerant. 
     
     
         4 . The method of  claim 1 , wherein the second fluid is a coolant. 
     
     
         5 . The method of  claim 1 , wherein the heat exchanger is a plate heat exchanger. 
     
     
         6 . The method of  claim 1 , wherein the heat exchanger is a chiller. 
     
     
         7 . The method of  claim 1 , wherein the at least one flow control device is selectively controlled depending on a compressor speed, an expansion valve position, and/or an outlet temperature of the second fluid. 
     
     
         8 . The method of  claim 1 , wherein the at least one flow control device is selectively controlled to provide a liquid free, gaseous phase first fluid to a compressor. 
     
     
         9 . The method of  claim 1 , wherein, in at least one operating mode of the thermal management system, an outflow rate of the first fluid and/or the second fluid from the heat exchanger is less than a respective one of an inflow rate of the first fluid and/or an inflow rate of the second fluid into the heat exchanger. 
     
     
         10 . The method of  claim 1 , wherein, in at least one operating mode of the thermal management system, an outflow rate of the first fluid from the heat exchanger is less than an inflow rate of the first fluid into the heat exchanger. 
     
     
         11 . The method of  claim 1 , wherein the at least one flow control device is disposed downstream of the heat exchanger in the first circuit. 
     
     
         12 . The method of  claim 11 , wherein the at least one flow control device is disposed downstream of the heat exchanger in the second circuit. 
     
     
         13 . The method of  claim 1 , wherein the at least one flow control device is a two-way valve. 
     
     
         14 . The method of  claim 1 , wherein the at least one flow control device is disposed between the heat exchanger and a compressor in the first circuit. 
     
     
         15 . The method of  claim 1 , wherein the at least one flow control device is selectively positionable between a fully-opened position, a fully-closed position, and at least one partially-closed position between the fully-opened position and the fully-closed position. 
     
     
         16 . The method of  claim 15 , wherein the at least one flow control device is selectively positioned in the at least one partially-closed position to cause the accumulation of the first fluid and/or the second fluid within the heat exchanger. 
     
     
         17 . The method of  claim 15 , wherein the at least one flow control device is selectively positioned in the at least one partially-closed position when a deficiency in an outlet temperature of the second fluid from the heat exchanger in relation to a compressor speed and an expansion valve position and a system efficiency occurs. 
     
     
         18 . The method of  claim 15 , wherein the at least one flow control device is selectively position in the at least one partially-closed position when a flow rate of the first fluid is relatively low. 
     
     
         19 . A method for controlling a thermal management system, comprising:
 providing a thermal management system including a heat exchanger fluidly connected to a first circuit for a first fluid and a second circuit for a second fluid; and   regulating a flow of the first fluid and/or the second fluid through the heat exchanger, wherein the outflow rate of the first fluid and/or the second fluid is less than a respective one of an inflow rate of the first fluid and/or an inflow rate of the second fluid into the heat exchanger.   
     
     
         20 . A thermal management system, comprising:
 a first circuit having a flow of a first fluid therein;   a second circuit having a flow of a second fluid therein, wherein the second fluid is in thermal energy exchanger relationship with the first fluid; and   a heat exchanger fluidly connected to the first circuit and the second circuit, wherein at least one flow control device is disposed downstream of the heat exchanger in the first circuit and/or the second circuit to regulate the flow of the first fluid and/or the flow of the second fluid through the heat exchanger, wherein, in one or more operating modes of the thermal management system, the at least one flow control device is selectively controlled to cause an accumulation of the first fluid and/or the second fluid within the heat exchanger.