Electroplated Part and Manufacturing Method Therefor, Fixture for Manufacturing, and Apparatus

Abstract

An electroplated part, which contains hardly any organic residues and has a uniform electroplated layer. An electroplating method for preparing the electroplated part is also provided. By controlling the ratio of the length of the motion trajectory of the electroplated part relative to an anode during the electroplating process to the width of the anode, and adding auxiliary cathodes to the electroplated part, the electroplating method improves the uniformity of the thickness of the electroplated layer at various positions of the electroplated part. A fixture for implementing the electroplating method and an electroplating apparatus are provided. The electroplated layer of the electroplated part prepared by the electroplating method has relatively uniform thickness and a high coverage rate, problems such as burn and fracture have hardly occurred during the electroplating process of the electroplated part, the yield of electroplated parts is high, and the scrap rate is low. In addition, the precision of the weight of plated layers of electroplated parts can reach 99% or above.

1 . An electroplated part, comprising a substrate and an electroplated layer, the electroplated layer covering the substrate, wherein the content of organic residues in the electroplated layer is less than 0.2%. 
     
     
         2 . The electroplated part according to  claim 1 , wherein the content of organic residues in the electroplated layer is less than 0.1%; the content of organic residues in the electroplated layer is less than 0.05%; the content of organic residues in the electroplated layer is less than 0.019%; wherein the ratio of the thickness of the electroplated layer at the thickest place to the thickness at the thinnest place on the substrate is (1-30]:1; the ratio of the thickness of the electroplated layer at the thickest place to the thickness at the thinnest place on the substrate is (1-20]:1; the ratio of the thickness of the electroplated layer at the thickest place to the thickness at the thinnest place on the substrate is (1-15]:1; the ratio of the thickness of the electroplated layer at the thickest place to the thickness at the thinnest place on the substrate is (1-12]:1. 
     
     
         3 . (canceled) 
     
     
         4 . The electroplated part according to  claim 1 , wherein the average thickness of the electroplated layer is 0.5-5 μm; the thickness of the electroplated layer at the thickest place on the substrate is (1, 7.5] times the average thickness; the thickness of the electroplated layer at the thinnest place on the substrate is [0.25, 1) times the average thickness;
 wherein the thickness of the electroplated layer at the thinnest place on the substrate is 0.25-4.25 μm; the thickness of the electroplated layer at the thinnest place on the substrate is 0.375-3.2 μm; the thickness of the electroplated layer at the thinnest place on the substrate is 0.6-3.2 μm; the thickness of the electroplated layer at the thinnest place on the substrate is 0.6-2.5 μm: or 
 wherein the thickness of the electroplated layer at the thickest place on the substrate is 1.1-15 μm; the thickness of the electroplated layer at the thickest place on the substrate is 1.1-9.75 μm; the thickness of the electroplated layer at the thickest place on the substrate is 1.1-7.5 μm; the thickness of the electroplated layer at the thickest place on the substrate is 1.2-5 μm. 
 
     
     
         5 - 6 . (canceled) 
     
     
         7 . The electroplated part according to  claim 1 , wherein the electroplated layer covers more than 99% of a surface of the substrate; the electroplated layer is a pure metal layer or an alloy layer; the content of zinc in the electroplated layer is not less than 50%; the content of zinc in the electroplated layer is more than 99%; wherein the mass-to-volume ratio of the electroplated part is 0.001-10 g/cm 3 ; the mass-to-volume ratio of the electroplated part is 0.001-5 g/cm 3 ; the mass-to-volume ratio of the electroplated part is 0.001-0.4 g/cm 3 ; and an iron alloy comprises at least one of a low alloy steel or an iron-based alloy having a carbon content of no more than 2.5 wt. %. 
     
     
         8 . The electroplated part according to  claim 1 , wherein a medical device comprises a vascular stent, a non-vascular endoluminal stent, an occluder, an orthopedic implant, a heart valve, a spacer, an artificial vessel, a dental implant device, a vascular clamp, a dental implant, a respiratory implant, a gynecological implant, an andrological implant, a suture, and a bolt; the substrate is made of a degradable metal or a degradable non-metal material; the substrate comprises at least one of pure iron, an iron alloy, pure zinc, a zinc alloy, pure magnesium, and a magnesium alloy. 
     
     
         9 . (canceled) 
     
     
         10 . A preparation method of the electroplated part according to  claim 1 , wherein the electroplated part is placed in an electroplating solution and moves relative to an anode at a certain amplitude and frequency with a fixture, wherein the length of a motion trajectory of the electroplated part relative to the anode during an electroplating process is 2-980 times the width of the anode; and/or auxiliary cathodes are connected to the electroplated part. 
     
     
         11 . The preparation method according to  claim 10 , wherein the length of the motion trajectory of the electroplated part relative to the anode during the electroplating process is 2-540 times the width of the anode; the length of the motion trajectory of the electroplated part relative to the anode during the electroplating process is 2-400 times the width of the anode; the length of the motion trajectory of the electroplated part relative to the anode during the electroplating process is 2-240 times the width of the anode; the length of the motion trajectory of the electroplated part relative to the anode during the electroplating process is 2-150 times the width of the anode. 
     
     
         12 . The preparation method according to  claim 10 , wherein the width of the anode is ≥0.1 cm; the amplitude of swing of the electroplated part relative to the anode is 0°-180°; the auxiliary cathodes are connected to two ends of the electroplated part in a longitudinal axis direction or in a direction parallel to an anode surface. 
     
     
         13 . The preparation method according to  claim 10 , wherein the amplitude of swing of the electroplated part relative to the anode is 0°-160°; the frequency of motion of the electroplated part relative to the anode is 0.1 s-20 s/cycle; wherein the area of the auxiliary cathode is 30%-70% of the area of a cathode; the auxiliary cathode has a length of 0.5 mm-20 mm; the auxiliary cathode has a length of 0.5 mm-10 mm; the auxiliary cathode is of any shape; the auxiliary cathode comprises at least one of a linear type, an annular type, a ring type, a prismatic type, a pyramidal type, a spiral type, a wheel type, a cylindrical type, and a corrugated type. 
     
     
         14 . (canceled) 
     
     
         15 . The preparation method according to  claim 10 , wherein the cross-sectional area of the auxiliary cathode in a direction perpendicular to an anode surface or a longitudinal axis direction of the electroplated part is larger than the cross-sectional area of the short axis of the electroplated part; the auxiliary cathode is connected to the electroplated part through a linkage or a point. 
     
     
         16 . The preparation method according to  claim 15 , wherein the linkage is one of a straight line or a non-straight line; the linkage is at least one of a linear type, an S type, a ω type, or a 0 type; the linkage is fixedly or detachably connected to the electroplated part, the fixture, and the auxiliary cathode. 
     
     
         17 . The preparation method according to  claim 10 , wherein the electroplated part is subjected to a force of the fixture during the electroplating process; the magnitude of the force applied to the electroplated part by the fixture during the electroplating process is 1×10 −3  N-0.5 N;
 wherein the contact area between the electroplated part and the fixture is not more than 0.1 mm 2 ; or 
 wherein the temperature of the electroplating solution during the electroplating process of the electroplated part is 10° C.-50° C.; the current density during the electroplating process of the electroplated part is 1 A·dm 2 -20 A·dm 2 ; the electroplating time during the electroplating process of the electroplated part is 10-300 s. 
 
     
     
         18 - 19 . (canceled) 
     
     
         20 . The preparation method according to  claim 10 , wherein each component in the electroplating solution is an inorganic substance. 
     
     
         21 . The preparation method according to  claim 10 , wherein when zinc is contained in a plated layer, the electroplating solution comprises 3.4-4.5 wt. % of a zinc-containing component and 2.1-3.1 wt. % of a pH adjusting agent; or the electroplating solution comprises 1.5-3.0 wt. % of the zinc-containing component and 6.5-8.8 wt. % of the pH adjusting agent;
 the zinc-containing component is at least one of zinc chloride, zinc sulfate, and zinc oxide;   the pH adjusting agent is at least one of boric acid, sodium borate, potassium borate, calcium borate, sodium hydroxide, and potassium hydroxide.   
     
     
         22 . The preparation method according to  claim 21 , wherein the electroplating solution further comprises 15.5-19.5 wt. % of a chloride salt; the chloride salt is at least one of sodium chloride, potassium chloride, and ammonium chloride. 
     
     
         23 . A fixture, configured to fix an electroplated part in an electroplating bath and drive the electroplated part to move relative to an anode. 
     
     
         24 . The fixture according to  claim 23 , comprising a connecting portion and clamping portions perpendicularly connected to the connecting portion, wherein the clamping portion is parallel to a long axis direction of the electroplated part; an end of the connecting portion near the electroplated part has at least two connecting rods, and at least one clamping portion is connected to each connecting rod. 
     
     
         25 . The fixture according to  claim 24 , wherein the distance between two connecting rods is [0.6, 0.98] times the distance between corresponding contact points of the electroplated part and the connecting rod; wherein the ratio of a distance between any two points connected by a straight line on a cross section of the clamping portion perpendicular to the length direction of the electroplated part to an inner diameter of the electroplated part is 1:1-1:20; the clamping portion has a length of 0.16 mm-7 mm. 
     
     
         26 . (canceled) 
     
     
         27 . The fixture according to  claim 24 , wherein more than 95% of a surface of the fixture is covered with an insulating layer; or more than 25% of the surface of the fixture is covered with the insulating layer; wherein a fixing part is further connected to an end of the connecting portion away from the electroplated part. 
     
     
         28 . (canceled) 
     
     
         29 . An electroplating apparatus, comprising the fixture according to  claim 23 , and further comprising a power supply, an electrolytic bath, and anodes, wherein the fixture is connected to the electroplating apparatus through a supporting rod. 
     
     
         30 . The electroplating apparatus according to  claim 29 , wherein the number of the anodes is greater than or equal to 2; the center position of the two or more anodes coincides with the center position of a motion trajectory of an electroplated part;
 wherein the width of the anode is ≥0.1 cm; the electroplating apparatus further comprises a component configured to control and drive relative motion of the fixture and the anode; and further comprising a display screen.   
     
     
         31 - 32 . (canceled)