Electrochemical deposition apparatus

Abstract

An electrochemical deposition apparatus is provided to include a process groove body with an accommodating groove is configured to accommodate a plating solution; a substrate carrier including a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.

1 . An electrochemical deposition apparatus, comprising:
 a process groove body with an accommodating groove, wherein the accommodating groove is configured to accommodate a plating solution;   a substrate carrier, wherein the substrate carrier comprises a carrying surface for carrying a substrate to be plated, and at least a portion of the substrate carrier is in the accommodating groove; and   at least one driving assembly on the process groove body and configured to control the substrate carrier to move along a first plane, wherein the first plane intersects with a normal direction of the carrying surface.   
     
     
         2 . The electrochemical deposition apparatus of  claim 1 , wherein each of the at least one driving assembly comprises:
 a transmission adaptor;   a first displacement unit on the process groove body and configured to control the transmission adaptor to move along a first direction; and   a second displacement unit on the transmission adaptor and configured to control the substrate carrier to move in a second direction;   wherein the first direction intersects with the second direction, and the first direction and the second direction intersect with the normal direction of the carrying surface.   
     
     
         3 . The electrochemical deposition apparatus of  claim 2 , wherein the first displacement unit comprises:
 a first mounting member comprising a first slide way on the first mounting member and extending along the first direction;   a first sliding block in the first slide way; and   a first motor; wherein a housing of the first motor is fixedly connected to the first mounting member, and a driving shaft of the first motor is connected to the first sliding block and configured to control the first sliding block to slide along the first slide way;   wherein the transmission adaptor is connected to the first sliding block.   
     
     
         4 . The electrochemical deposition apparatus of  claim 2 , wherein each of the at least one driving assembly further comprises:
 a limiting device on the process groove body and configured to limit a moving range within which the transmission adaptor moves in the first direction.   
     
     
         5 . The electrochemical deposition apparatus of  claim 2 , wherein the second displacement unit comprises:
 a second mounting member comprising a second slide way on the second mounting member and extending along the second direction;   a second sliding block in the second slide way; and   a second motor, wherein a housing of the second motor is fixedly connected to the second mounting member, and a driving shaft of the second motor is connected to the second sliding block and configured to control the second sliding block to slide along the second slide way.   
     
     
         6 . The electrochemical deposition apparatus of  claim 2 , wherein the process groove body comprises:
 a main groove body having the accommodating groove, and   a reinforcing structure fixed around the main groove body;   wherein the first displacement unit is on the reinforcing structure, and the electrochemical deposition apparatus further comprises an avoidance notch on a side wall of the main groove body at a position corresponding to the first displacement unit.   
     
     
         7 . The electrochemical deposition apparatus of any  claim 1 , wherein the electrochemical deposition apparatus comprises two driving assemblies on two opposite sides of the process groove body, respectively. 
     
     
         8 . The electrochemical deposition apparatus of  claim 1 , wherein the electrochemical deposition apparatus further comprises:
 an injection plate detachably arranged in the accommodating groove, and comprising an accommodating case having a first accommodating chamber, wherein the accommodating case is provided with a first liquid inlet and a plurality of liquid outlets, the first liquid inlet and the plurality of liquid outlets are communicated with the first accommodating chamber, and the plurality of liquid outlets are arranged to face the carrying surface;   wherein a distance from the injection plate to the carrying surface is adjustable.   
     
     
         9 . The electrochemical deposition apparatus of  claim 8 , wherein the accommodating case further comprises a plurality of first mounting hole groups thereon arranged in the first direction, each of the plurality of first mounting hole groups comprises a plurality of first mounting holes arranged in a third direction, and the third direction is the normal direction of the carrying surface;
 the electrochemical deposition apparatus further comprises:   a mounting plate comprising a plurality of second mounting hole groups thereon, wherein each of the plurality of second mounting hole groups comprises a plurality of second mounting holes arranged in the third direction, the plurality of second mounting hole groups are in one-to-one correspondence with the plurality of first mounting hole groups, and each of the plurality of second mounting holes is configured to correspond to and be aligned with one of the plurality of first mounting holes; and   a plurality of fasteners, each of which is configured to extend into one first mounting hole and one second mounting hole aligned with each other, to fasten the accommodating case and the mounting plate.   
     
     
         10 - 12 . (canceled) 
     
     
         13 . The electrochemical deposition apparatus of  claim 8 , wherein the accommodating case comprises: a first wall, a second wall opposite to the first wall, and a plurality of side walls for connecting the first wall and the second wall, the first wall, the second wall, and the plurality of side walls are connected together to form the first accommodating chamber, wherein the plurality of liquid outlets are on the first wall, and the plurality of first mounting holes are on the plurality of side walls. 
     
     
         14 . The electrochemical deposition apparatus of  claim 13 , wherein the injection plate further comprises: a plurality of liquid return lines passing through the first accommodating chamber, an inlet of each of the plurality of liquid return lines is on the first wall, and an outlet of each of the plurality of liquid return lines is on the second wall; and
 wherein multiple liquid outlets are around the inlet of each of the plurality of liquid return lines.   
     
     
         15 - 18 . (canceled) 
     
     
         19 . The electrochemical deposition apparatus of  claim 8 , wherein the process groove body is provided with a liquid circulation outlet communicated with the accommodating groove;
 the electrochemical deposition apparatus further comprises:   a filter screen at the liquid circulation outlet, and configured to filter the plating solution discharged from the accommodating groove to the liquid circulation outlet; and   a circulation assembly, wherein an inlet of the circulation assembly is connected to the liquid circulation outlet, and an outlet of the circulation assembly is communicated with the first liquid inlet.   
     
     
         20 . The electrochemical deposition apparatus of  claim 1 , wherein the substrate carrier comprises:
 a carrying plate comprising a first carrying sub-surface, and comprising a hollowed-out structure therein; and   a supporting plate, wherein the supporting plate covers the hollowed-out structure, and comprises a second carrying sub-surface, and the second carrying sub-surface and the first carrying sub-surface together form the carrying surface.   
     
     
         21 . The electrochemical deposition apparatus of  claim 20 , wherein the substrate carrier further comprises:
 a conductive ring on the carrying plate and surrounding the supporting plate;   a pull-up structure fixedly connected to the carrying plate; and   a conductive block on the pull-up structure and electrically connected to the conductive ring, wherein the conductive block is connected to the driving assembly.   
     
     
         22 . The electrochemical deposition apparatus of  claim 21 , wherein the driving assembly comprises: a first displacement unit and a second displacement unit comprising a second sliding block; and
 one of the conductive block and the second sliding block is provided with a limiting protrusion, and the other one of the conductive block and the second sliding block is provided with a limiting groove, and the limiting protrusion is arranged in the limiting groove.   
     
     
         23 . The electrochemical deposition apparatus of  claim 21 , wherein the pull-up structure comprises:
 a first sealing plate and a second sealing plate opposite to each other, wherein the first sealing plate and the second sealing plate are connected to two opposite surfaces of the carrying plate, respectively; and   a handle between the first sealing plate and the second sealing plate and connected to the first sealing plate and the second sealing plate;   wherein at least a portion of the conductive block is between the first sealing plate and the second sealing plate.   
     
     
         24 . The electrochemical deposition apparatus of  claim 23 , wherein the electrochemical deposition apparatus further comprises an insulating layer between the conductive block and the first sealing plate and between the conductive block and the second sealing plate. 
     
     
         25 . The electrochemical deposition apparatus of  claim 1 , wherein the electrochemical deposition apparatus further comprises an electrode structure; and
 the electrode structure comprises a support frame and at least one metal mesh structure on the support frame.   
     
     
         26 . The electrochemical deposition apparatus of  claim 25 , wherein the electrode structure comprises a plurality of metal mesh structures, and the support frame comprises a support portion electrically connected to each of the plurality of metal mesh structures. 
     
     
         27 . The electrochemical deposition apparatus of  claim 25 , wherein the electrode structure further comprises: an energizing portion configured to apply an electric signal and a transmission portion, wherein each of the plurality of metal mesh structures is electrically connected to the energizing portion through the transmission portion; and
 at least one of the energizing portion and the transmission portion comprises: a conductive main body and a protective layer wrapping the conductive main body, wherein an electric conductivity of the conductive main body is greater than that of the protective layer.   
     
     
         28 - 30 . (canceled)