US2026028150A1PendingUtilityA1

Supporting material and packaged article

Assignee: SEIKO EPSON CORPPriority: Jul 26, 2024Filed: Jul 25, 2025Published: Jan 29, 2026
Est. expiryJul 26, 2044(~18 yrs left)· nominal 20-yr term from priority
Inventors:ICHIMIYA YUTA
B65D 2585/689B65D 85/68B65D 5/5057B65D 81/133B65D 81/058
63
PatentIndex Score
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Claims

Abstract

In a supporting material having a plate-shaped portion that supports an electronic apparatus, in a packaged state, the plate-shaped portion has holes that receives a plurality of leg portions provided on a bottom surface of the electronic apparatus, and a thickness dimension of the plate-shaped portion and a depth dimension of the holes are equal to or larger than a protrusion dimension of the leg portions from the bottom surface.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A supporting material comprising a plate-shaped portion that supports an electronic apparatus, in a packaged state, wherein
 the plate-shaped portion has holes that receives a plurality of leg portions provided on a bottom surface of the electronic apparatus, and   a thickness dimension of the plate-shaped portion and a depth dimension of the holes are equal to or larger than a protrusion dimension of the leg portions from the bottom surface.   
     
     
         2 . The supporting material according to  claim 1 , wherein
 the holes are through holes penetrating in a thickness direction of the plate-shaped portion.   
     
     
         3 . The supporting material according to  claim 1 , wherein
 the holes are non-through holes that do not penetrate in a thickness direction of the plate-shaped portion.   
     
     
         4 . The supporting material according to  claim 1 , wherein
 the plate-shaped portion is formed using a cardboard.   
     
     
         5 . The supporting material according to  claim 1 , wherein
 a plurality of cushioning materials are provided on a surface of the plate-shaped portion opposite to a surface supporting the electronic apparatus.   
     
     
         6 . The supporting material according to  claim 5 , wherein
 the holes are through holes penetrating in a thickness direction of the plate-shaped portion, and   part of the plurality of cushioning materials are at positions overlapping at least part of a plurality of the holes in a plan view of the plate-shaped portion.   
     
     
         7 . The supporting material according to  claim 4 , further comprising a plurality of cushioning materials provided on a surface of the plate-shaped portion opposite to a surface supporting the electronic apparatus, wherein
 the plurality of cushioning materials are each formed using cardboard.   
     
     
         8 . The supporting material according to  claim 1 , wherein
 the plate-shaped portion has a size that covers the electronic apparatus in a plan view.   
     
     
         9 . A packaged article comprising:
 an electronic apparatus having a plurality of leg portions on a bottom surface thereof;   a supporting material that supports the electronic apparatus, in a packaged state;   a cushioning material that cushions impact applied to the electronic apparatus; and   a packaging box in which the electronic apparatus, the supporting material, and the cushioning material are housed, wherein   the supporting material has a plate-shaped portion,   the plate-shaped portion has holes that receives the plurality of leg portions provided on the bottom surface of the electronic apparatus, and   a thickness dimension of the plate-shaped portion and a depth dimension of the holes are equal to or larger than a protrusion dimension of the leg portions from the bottom surface.   
     
     
         10 . The packaged article according to  claim 9 , wherein
 the supporting material, the cushioning material, and the packaging box are each formed using cardboard.

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