Film forming apparatus and film forming method for forming metal film

Abstract

A film forming apparatus includes a masking member. The masking member has a mask portion. The mask portion has formed therein a plurality of penetrating portions that penetrates through the mask portion in accordance with a predetermined pattern to expose the mesh portion and a plurality of recessed grooves provided on a surface opposing an electrolyte membrane of the mask portion so as to be continuous with each of the penetrating portions. The film forming apparatus further includes a suction device that sucks air in the penetrating portions via the plurality of recessed grooves, with the masking member being in contact with a substrate.

What is claimed is: 
     
         1 . A film forming apparatus for forming a metal film having a predetermined pattern on a surface of a substrate by electroplating, the film forming apparatus comprising:
 a container having an opening opposing the substrate, the opening covered by an electrolyte membrane with a plating solution contained in the container;   a pressure increase mechanism that increases a pressure of the plating solution contained in the container; and   a masking member disposed between the electrolyte membrane and the substrate, the masking member being attached to the container,   wherein   the masking member includes a mesh portion in a sheet form through which the plating solution for the electroplating passes and a mask portion provided on front and back sides of the mesh portion, the mask portion being sandwiched between the electrolyte membrane and the substrate,   in the mask portion, a plurality of penetrating portions that penetrates through the mask portion in accordance with the predetermined pattern to expose the mesh portion and a plurality of recessed grooves provided on a surface opposing the electrolyte membrane of the mask portion so as to be continuous with each of the penetrating portions are formed, and   the film forming apparatus further includes a suction device that sucks air in the penetrating portions via the plurality of recessed grooves, with the masking member being in contact with the substrate.   
     
     
         2 . The film forming apparatus for forming a metal film according to  claim 1 , wherein
 a frame that supports the mesh portion is provided at a peripheral edge of the masking member,   the plurality of recessed grooves comprises:
 a plurality of first recessed grooves provided on the surface opposing the electrolyte membrane of the mask portion so as to connect the penetrating portions that are adjacent to each other; and 
 a plurality of second recessed grooves provided on the surface opposing the electrolyte membrane of the mask portion so as to connect the penetrating portions and the frame, 
   a third recessed groove continuous with the plurality of second recessed grooves is formed in the frame, and   the suction device sucks the air in the penetrating portions through the third recessed groove.   
     
     
         3 . The film forming apparatus for forming a metal film according to  claim 2 , wherein intersecting grooves that intersect with the second recessed grooves and that are continuous with the third recessed groove are formed in the mask portion. 
     
     
         4 . The film forming apparatus for forming a metal film according to  claim 3 , wherein the third recessed groove encircles the frame and is continuous with the second recessed grooves and the intersecting grooves. 
     
     
         5 . A film forming method for forming a metal film using the film forming apparatus according to  claim 1 , the film forming method comprising the steps of:
 removing air in the penetrating portions via the plurality of recessed grooves by means of the suction device, with the masking member being in contact with the substrate;   pressing the substrate with the electrolyte membrane via the mask portion by increasing a pressure of the plating solution contained in the container by means of the pressure increase mechanism, with the air removed; and   forming the meal film on the surface of the substrate by electroplating, with the electrolyte membrane pressed.