Electroplating tank equipment and operating method thereof

Abstract

An electroplating device includes a carrying module, a moving module, a driving module and ejecting tubes. The carrying module has a slide rail. The moving module has a first portion and a second portion. The first portion is movably disposed in the slide rail. The moving module is moved back and forth parallel to a length direction of the slide rail by the driving module. Opposite two ends of the ejecting tubes are respectively disposed on the first portion and the second portion. When the moving module is driven to move back and forth parallel to the length direction, the moving module drives the ejecting tubes to move back and forth as well. Each of the ejecting tubes has nozzles. The nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube.

What is claimed is: 
     
         1 . An electroplating tank equipment for electroplating a to-be-electroplated surface of an electroplating substrate, the electroplating tank equipment comprising:
 an electroplating device, comprising:   a carrying module having a slide rail;   a moving module having a first portion and a second portion opposite to the first portion, wherein the first portion of the moving module is movably disposed in the slide rail;   a driving module connected to the second portion of the moving module and configured to move the moving module back and forth in a direction parallel to a length direction of the slide rail; and   a plurality of ejecting tubes, wherein two opposite ends of each one of the plurality of the ejecting tubes are respectively disposed on the first portion and the second portion of the moving module, when the driving module moves the moving module back and forth along the length direction, the moving module simultaneously drives the plurality of ejecting tubes to move back and forth, and each one of the plurality of the ejecting tubes has a plurality of nozzles, and the plurality of the nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube,   wherein a distance between the nozzle on one of the two adjacent ejecting tubes and the first portion of the moving module is different from a distance between the nozzle on the other of the two adjacent ejecting tubes and the first portion of the moving module;   a conduit pipe connected to the electroplating device and configured to deliver an electroplating solution into the moving module to enter the plurality of the ejecting tubes; and   a accommodating tank connected to the electroplating device and configured to contain the electroplating solution to form an electroplating tank structure, wherein the accommodating tank further has an overflow port and a circulation space for containing the electroplating solution, and the electroplating solution around the plurality of ejecting tubes overflows into the circulation space of the accommodating tank through the overflow port such that the electroplating solution is returned to the plurality of the ejecting tubes by the conduit pipe, wherein the to-be-electroplated surface of the electroplating substrate is configured to cover an electroplating opening of the electroplating device such that a sealed electroplating space is formed, and the sealed electroplating space is configured to contain the electroplating solution such that the to-be-electroplated surface of the electroplating substrate is electroplated in the sealed electroplating space.   
     
     
         2 . The electroplating tank equipment according to  claim 1 , wherein each one of the plurality of the ejecting tubes has an initial position, a first limit position and a second limit position located at two opposite sides of the initial position, and the moving module is further configured to:
 drive the ejecting tube to move from the initial position to the first limit position;   drive the ejecting tube to move from the first limit position to the second limit position; and   drive the ejecting tube to move from the second limit position back to the initial position.   
     
     
         3 . The electroplating tank equipment according to  claim 2 , wherein a distance between two centerlines of the two adjacent ejecting tubes is the same as a distance between the initial position and the first limit position and a distance between the initial position and the second limit position. 
     
     
         4 . The electroplating tank equipment according to  claim 1 , wherein distances between two adjacent ones of the plurality of the ejecting tubes are the same. 
     
     
         5 . The electroplating tank equipment according to  claim 1 , wherein distances between the two adjacent nozzles on one of the plurality of the ejecting tubes are the same, and the moving module has a third portion perpendicular to the first portion and the second portion, the third portion is parallel to the plurality of the ejecting tubes, and the plurality of the ejecting tubes are connected to the first portion, the second portion and the third portion of the moving module. 
     
     
         6 . The electroplating tank equipment according to  claim 1 , wherein the second portion of the moving module has a main body and an external portion connected to the main body, the external portion is disposed on a side of the main body away from the first portion, one end of the plurality of the ejecting tubes is connected to the main body, and the external portion is connected to the driving module. 
     
     
         7 . The electroplating tank equipment according to  claim 6 , wherein the driving module has a push rod and a power source, two ends of the push rod are respectively connected to the external portion and pivotally connected to the power source, and the power source is configured to drive the push rod and the moving module to move back and forth along the length direction. 
     
     
         8 . An operating method of an electroplating tank equipment for electroplating a to-be-electroplated surface of an electroplating substrate, the operating method of the electroplating tank equipment comprising steps of:
 a) movably disposing a first portion of a moving module of an electroplating device in a slide rail of a carrying module;   b) moving the moving module back and forth in a direction parallel to a length direction of the slide rail by a driving module of the electroplating device such that the moving module simultaneously drives a plurality of ejecting tubes to move back and forth, wherein two opposite ends of each one of the plurality of the ejecting tubes are respectively disposed on the first portion and a second portion of the moving module, and each one of the plurality of the ejecting tubes has a plurality of nozzles, and the plurality of the nozzles on the ejecting tube are misaligned with the nozzles on the other ejecting tube adjacent to the ejecting tube, wherein a distance between the nozzle on one of the two adjacent ejecting tubes and the first portion of the moving module is different from a distance between the nozzle on the other of the two adjacent ejecting tubes and the first portion of the moving module;   c) delivering an electroplating solution into the moving module through a conduit pipe connected to the electroplating device to enter the plurality of the ejecting tubes; and   d) allowing the electroplating solution to overflow from an overflow port of a accommodating tank connected to the electroplating device to form an electroplating tank structure, wherein the accommodating tank has a circulation space to collect the electroplating solution around the ejecting tubes such that the electroplating solution is returned to the plurality of the ejecting tubes by the conduit pipe, wherein the to-be-electroplated surface of the electroplating substrate is configured to cover an electroplating opening of the electroplating device such that a sealed electroplating space is formed, and the sealed electroplating space is configured to contain the electroplating solution such that the to-be-electroplated surface of the electroplating substrate is electroplated in the sealed electroplating space.   
     
     
         9 . The operating method of the electroplating tank equipment according to  claim 8 , wherein each one of the plurality of the ejecting tubes has an initial position, a first limit position, and a second limit position located at two opposite sides of the initial position and driving the plurality of the ejecting tubes to move back and forth by the moving module further comprises:
 driving the plurality of the ejecting tubes to move from the initial position to the first limit position by the moving module;   driving the plurality of the ejecting tubes to move from the first limit position to the second limit position by the moving module; and   driving the plurality of the ejecting tubes to move from the second limit position back to the initial position by the moving module.