Multilayer ceramic electronic device, circuit board, package and manufacturing method of multilayer ceramic electronic device

Abstract

A multilayer ceramic electronic device includes an element body. A first end portion of a first internal electrode layer on a first side face side of an element body contains a first sub-component, and a second end portion of a second internal electrode layer on a second side face side of the element body contains a second sub-component. A first external electrode provided on the first side face contains the first sub-component, and the second external electrode provided on the second side face contains the second subcomponent. The first sub-component is different from the second subcomponent.

What is claimed is: 
     
         1 . A multilayer ceramic electronic device comprising:
 an element body having a substantially rectangular parallelepiped shape in which each of a plurality of first internal electrode layers and each of a plurality of second internal electrode layer are alternately stacked with a dielectric layer sandwiched therebetween, the each of plurality of first internal electrode layers being drawn out to a first side face of the substantially rectangular parallelepiped shape, and the each of plurality of second internal electrode layers being drawn out to a second side face of the substantially rectangular parallelepiped shape;   a first external electrode provided on the first side face; and   a second external electrode provided on the second side face,   wherein a first end portion of the each of plurality of first internal electrode layers on the first side face side contains a first sub-component in addition to a main component, and a second end portion of the each of plurality of second internal electrode layer on the second side face side contains a second sub-component in addition to a main component,   wherein the first external electrode contains the first sub-component of the each of plurality of first internal electrode layers, and the second external electrode contains the second subcomponent of the each of plurality of second internal electrode layers, and   wherein the first sub-component is different from the second subcomponent.   
     
     
         2 . The multilayer ceramic electronic device as claimed in  claim 1 ,
 wherein the first end portion of the each of plurality of first internal electrode layers on the first side face side is a first section including the each of plurality of first internal electrode layers in a first end margin where the each of plurality of first internal electrode layers face each other without the each of plurality of second internal electrode layers therebetween, and   wherein the second end portion of the each of plurality of second internal electrode layer on the second side face side is a second section including the each of plurality of second internal electrode layers in a second end margin where the each of plurality of second internal electrode layers face each other without the each of plurality of first internal electrode layers therebetween.   
     
     
         3 . The multilayer ceramic electronic device as claimed in  claim 2 ,
 wherein, in the first section, a gradient is formed in which a concentration of the first sub-component gradually decreases from the first side face toward an opposite side, and   wherein, in the second section, a gradient is formed in which a concentration of the second sub-component gradually decreases from the second side face toward an opposite side.   
     
     
         4 . The multilayer ceramic electronic device as claimed in  claim 1 ,
 wherein a main component of the first end portion is the same as a main component of the second end portion.   
     
     
         5 . The multilayer ceramic electronic device as claimed in  claim 1 ,
 wherein the first end portion contains nickel as a main component and iron as the first sub-component, and   wherein the second end portion contains nickel as a main component and gold as the second sub-component.   
     
     
         6 . A circuit board comprising:
 a multilayer ceramic electronic device as claimed in  claim 1 ; and   a mounting board including a first land to which the first external electrode is electrically connected and a second land to which the second external electrode is electrically connected.   
     
     
         7 . A package comprising:
 a multilayer ceramic electronic device as claimed in  claim 1 ;   a carrier tape having a sealing face and a recess recessed from the sealing face for accommodating the multilayer ceramic electronic device; and   a top tape attached to the sealing face and covering the recess.   
     
     
         8 . A manufacturing method of a multilayer ceramic electronic device comprising:
 alternately stacking each of a plurality of dielectric green sheets and each of a plurality of internal electrode patterns for internal electrode layers to form a ceramic multilayer body having a substantially rectangular parallelepiped shape, the each of plurality of internal electrode patterns being alternately drawn out to a first side face and a second side face of the ceramic multilayer body;   applying a first metal paste containing a first sub-component to the first side of the ceramic multilayer body, and applying a second metal paste containing a second sub-component having a different composition from the first metal paste to the second side face;   simultaneously firing the ceramic multilayer body, the first metal paste, and the second metal paste to cause each of internal electrode layers formed from the each of plurality of internal electrode patterns to contain the first sub-component or the second sub-component, respectively.