Grinding and/or Polishing Pad Device, Grinding and/or Polishing Machine and Method for Manufacturing a Grinding and/or Polishing Pad Device

Abstract

A grinding and/or polishing pad device for a grinding and/or polishing pad for a grinding and/or polishing machine has a drive interface unit for connecting a carrier unit of the grinding and/or polishing pad to the grinding and/or polishing machine. The drive interface unit has an offset shape and/or the drive interface unit is designed like a sprocket.

What is claimed is: 
     
         1 . A grinding and/or polishing pad device for a grinding and/or polishing pad for a grinding and/or polishing machine, comprising a drive interface unit configured to connect a carrier unit of the grinding and/or polishing pad to the grinding and/or polishing machine, wherein the drive interface unit has an offset shape and/or the drive interface unit is designed like a sprocket. 
     
     
         2 . The grinding and/or polishing pad device according to  claim 1 , wherein the carrier unit is connected flush to a contact surface of the drive interface unit for connection to the grinding and/or polishing machine on the machine side. 
     
     
         3 . The grinding and/or polishing pad device according to  claim 1 , wherein the drive interface unit has at least one air passage opening for dust extraction. 
     
     
         4 . The grinding and/or polishing pad device according to  claim 1 , wherein the carrier unit has at least one air passage opening arranged between two adjacent teeth of the sprocket-like drive interface unit. 
     
     
         5 . The grinding and/or polishing pad device according to  claim 1 , wherein the sprocket-like drive interface unit has a plurality of teeth which have at least partially different tooth heights from one another. 
     
     
         6 . The grinding and/or polishing pad device according to  claim 1 , wherein a ratio of a maximum diameter of the drive interface unit to a maximum diameter of the carrier unit is at least 0.35. 
     
     
         7 . The grinding and/or polishing pad device according to  claim 1 , wherein a ratio of a total height of the grinding and/or polishing pad device, which extends perpendicular to a main extension plane of the grinding and/or polishing pad device, to a maximum diameter of the grinding and/or polishing pad device, which extends parallel to the main extension plane of the grinding and/or polishing pad device, is at most 0.15. 
     
     
         8 . A grinding and/or polishing machine having the grinding and/or polishing pad device according to  claim 1 . 
     
     
         9 . A method for manufacturing a grinding and/or polishing pad device according to  claim 1 , comprising at least partially integrating the drive interface unit with the offset shape and/or designed like the sprocket into the carrier unit. 
     
     
         10 . The method according to  claim 9 , further comprising grinding down the drive interface unit on the machine side so as to be flush with the adjacent carrier unit. 
     
     
         11 . The method according to  claim 9 , further comprising foaming a padding unit onto the carrier unit on the machining side so that a rib structural element of the carrier unit forms a side wall of an air channel of the carrier unit. 
     
     
         12 . The grinding and/or polishing pad device according to  claim 1 , wherein the carrier unit is connected flush to an offset machine-side outer surface of the drive interface unit for connection to the grinding and/or polishing machine on the machine side. 
     
     
         13 . A method for manufacturing a grinding and/or polishing pad device according to  claim 1 , comprising at least partially molding the carrier unit over the drive interface unit with the offset shape and/or designed like the sprocket. 
     
     
         14 . The method according to  claim 13 , further comprising grinding down the drive interface unit on the machine side so as to be flush with the adjacent carrier unit.