Substrate holder, plating apparatus, and substrate positioning method

Abstract

The present disclosure provides a substrate holder including a centering pin that does not push a substrate any farther toward the center than a designed position, even if a first holding member deviates from the designed position relative to a second holding member, when positioning the substrate. The substrate holder according to the present disclosure includes the first holding member and the second holding member. The second holding member includes a positioning member for positioning the substrate at a predetermined position, and a stopper. The positioning member includes the centering pin movable between a first position and a second position, and is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts a peripheral edge of the substrate to position the substrate at the predetermined position. The first holding member includes a driving member configured to bias the centering pin toward the first position, when the first holding member and the second holding member hold the substrate. The stopper is configured to contact the centering pin to stop the centering pin at the first position.

1 . A substrate holder comprising:
 a first holding member; and   a second holding member that sandwiches and holds a substrate with the first holding member,   the second holding member including:
 a positioning member for positioning the substrate at a predetermined position; and 
 a stopper, 
   wherein the positioning member includes a centering pin movable between a first position and a second position, and is configured so that, when the centering pin moves from the second position to the first position, the centering pin contacts a peripheral edge of the substrate to position the substrate at the predetermined position,   the first holding member includes a driving member configured to bias the centering pin toward the first position, when the first holding member and the second holding member hold the substrate, and   the stopper is configured to contact the centering pin to stop the centering pin at the first position.   
     
     
         2 . The substrate holder according to  claim 1 ,
 wherein the second holding member further includes electrical contacts that contact the substrate to supply power to the substrate.   
     
     
         3 . The substrate according to  claim 1 ,
 wherein the positioning member includes an elastic member for biasing the centering pin toward the second position.   
     
     
         4 . The substrate holder according to  claim 1 ,
 wherein the driving member includes a plunger with a spring or with an elastic body for biasing the centering pin toward the first position.   
     
     
         5 . The substrate holder according to  claim 1 ,
 wherein the centering pin has a surface to be pressed,   the driving member is configured to press the surface to be pressed in a pressing direction perpendicular to a surface to be treated of the substrate, when the first holding member and the second holding member hold the substrate, and   the surface to be pressed is orthogonal to the pressing direction.   
     
     
         6 . The substrate holder according to  claim 1 ,
 wherein the centering pin includes a rotary shaft,   the positioning member includes a bearing that supports the rotary shaft, and   the centering pin rotates about the rotary shaft to move between the first position and the second position.   
     
     
         7 . The substrate holder according to  claim 1 ,
 wherein the second holding member includes four positioning members.   
     
     
         8 . A plating apparatus comprising:
 a plating tank configured to store a plating solution;   the substrate holder according to  claim 1 ; and   a lifting mechanism configured to raise and lower the substrate holder,   wherein the substrate holder is configured to hold the substrate having a surface to be plated being directed downward,   the second holding member is a support mechanism configured to support an outer peripheral portion of the surface to be plated of the substrate, and   the first holding member is a back plate assembly disposed on a back side of the surface to be plated of the substrate, and configured to sandwich and hold the substrate with the support mechanism.   
     
     
         9 . A substrate positioning method with the substrate holder according to  claim 1 , the substrate positioning method comprising:
 a step in which the first holding member and the second holding member sandwich and hold the substrate;   a step in which the driving member moves the centering pin from the second position to the first position;   a step in which the centering pin positions the substrate at the predetermined position; and   a step in which the stopper contacts the centering pin to stop the centering pin at the first position.