Pad conditioner and chemical mechanical planarization apparatus

Abstract

A pad conditioner and a chemical mechanical planarization apparatus, wherein the pad conditioner comprises a swing arm; an adjusting assembly disposed at one end of the swing arm, wherein the adjusting assembly comprises an airtight chamber; a conditioning disk, disposed on one side of the adjusting assembly that is away from the swing arm, wherein the adjusting assembly is configured to drive the conditioning disk to move in a direction towards or away from the adjusting assembly by deformation of the airtight chamber; a pressure detecting unit, embedded in the airtight chamber and configured to detect an internal gas pressure within the airtight chamber; and a control unit, configured to determine a wording state of the pad conditioner based on the internal gas pressure.

What is claimed is: 
     
         1 . A pad conditioner, comprising:
 a swing arm;   an adjusting assembly disposed at one end of the swing arm, wherein the adjusting assembly comprises an airtight chamber;   a conditioning disk, disposed on one side of the adjusting assembly that is away from the swing arm, wherein the adjusting assembly is configured to drive the conditioning disk to move in a direction towards or away from the adjusting assembly by deformation of the airtight chamber;   a pressure detecting unit, embedded in the airtight chamber and configured to detect an internal gas pressure within the airtight chamber; and   a control unit, configured to receive the internal gas pressure and determine a working state of the pad conditioner.   
     
     
         2 . The pad conditioner according to  claim 1 , wherein the adjusting assembly further comprises: a cylinder, a supporting component, a central shaft, and a gas film;
 the cylinder is connected to the swing arm;   the supporting component is disposed within the cylinder, wherein the supporting component extends along an axial direction of the adjusting assembly;   one end of the central shaft that is close to the swing arm is slidably connected to the supporting component, and the other end of the central shaft that is away from the swing arm is connected to the conditioning disk, wherein the central shaft extends out of the cylinder and the central shaft is configured to drive the conditioning disk to move in a direction towards or away from the adjusting assembly; and   the gas film, that is annular in shape, is disposed within the cylinder, wherein an outer edge of the gas film is connected to an inner wall of the cylinder, and an inner edge of the gas film is connected to an outer wall of the central shaft, and   the airtight chamber is formed by the gas film, together with the cylinder, the central shaft, and the supporting component.   
     
     
         3 . The pad conditioner according to  claim 2 , wherein
 one end of the cylinder that is close to the swing arm is provided with an opening, and a rotating component is arranged at the opening, the rotating component is configured to drive the supporting component to rotate around the axis of the adjusting assembly;   the outer edge of the gas film is connected to the rotating component, and the airtight chamber is formed by the gas film, together with the rotating component, the central shaft and the supporting component.   
     
     
         4 . The pad conditioner according to  claim 3 , wherein the rotating component is provided with an inlet for introducing gas into the airtight chamber or extracting gas from the airtight chamber, wherein the introducing or the extracting of the gas causes deformation of the airtight chamber, thereby driving the central shaft to move in a direction towards or away from the swing arm. 
     
     
         5 . The pad conditioner according to  claim 4 , further comprising:
 a gas pipe, wherein one end of the gas pipe that is close to the adjusting assembly is communicated with the inlet and the other end of the gas pipe is communicated with an external gas source.   
     
     
         6 . The pad conditioner according to  claim 1 , wherein the pressure detecting unit comprises a housing, a pressure chip and a diaphragm;
 the housing is internally provided with a cavity and externally provided with a mounting portion, wherein the mounting portion is configured to attach the housing to an inner side of the airtight chamber;   the pressure chip is encapsulated within the cavity, wherein the diaphragm is located on one side of the pressure chip that is away from the mounting portion of the housing; and   the diaphragm is configured to seal the pressure chip and transmit the internal gas pressure within the airtight chamber to the pressure chip.   
     
     
         7 . The pad conditioner according to  claim 6 , wherein the pressure chip comprises a diffused silicon pressure-sensitive chip. 
     
     
         8 . The pad conditioner according to  claim 7 , wherein the cavity is filled with a buffer fluid; and
 the buffer fluid is sealed within the cavity and located between the diffused silicon pressure-sensitive chip and the diaphragm, and the buffer fluid is configured to transmit the internal gas pressure within the airtight chamber provided by the diaphragm to the pressure chip.   
     
     
         9 . The pad conditioner according to  claim 1 , wherein determining a working state of the pad conditioner is further configured to:
 in response to the internal gas pressure exceeding a preset pressure range, shut down the pad conditioner.   
     
     
         10 . A chemical mechanical planarization apparatus, comprising a pad conditioner and a polishing pad, wherein the pad conditioner is configured to condition the polishing pad, and the pad conditioner comprises:
 a swing arm;   an adjusting assembly disposed at one end of the swing arm, wherein the adjusting assembly comprises an airtight chamber;   a conditioning disk, disposed on one side of the adjusting assembly that is away from the swing arm, wherein the adjusting assembly is configured to drive the conditioning disk to move in a direction towards or away from the adjusting assembly by deformation of the airtight chamber;   a pressure detecting unit, embedded in the airtight chamber and configured to detect an internal gas pressure within the airtight chamber;   and a control unit, configured to receive the internal gas pressure and determine a working state of the pad conditioner.   
     
     
         11 . The chemical mechanical planarization apparatus according to  claim 10 , wherein the adjusting assembly further comprises: a cylinder, a supporting component, a central shaft, and a gas film;
 the cylinder is connected to the swing arm;   the supporting component is disposed within the cylinder, wherein the supporting component extends along an axial direction of the adjusting assembly;   one end of the central shaft that is close to the swing arm is slidably connected to the supporting component, and the other end of the central shaft that is away from the swing arm is connected to the conditioning disk, wherein the central shaft extends out of the cylinder and the central shaft is configured to drive the conditioning disk to move in a direction towards or away from the adjusting assembly; and   the gas film, that is annular in shape, is disposed within the cylinder, wherein an outer edge of the gas film is connected to an inner wall of the cylinder, and an inner edge of the gas film is connected to an outer wall of the central shaft, and   the airtight chamber is formed by the gas film, together with the cylinder, the central shaft, and the supporting component.   
     
     
         12 . The chemical mechanical planarization apparatus according to  claim 11 , wherein
 one end of the cylinder that is close to the swing arm is provided with an opening, and a rotating component is arranged at the opening, the rotating component is configured to drive the supporting component to rotate around the axis of the adjusting assembly;   the outer edge of the gas film is connected to the rotating component, and the airtight chamber is formed by the gas film, together with the rotating component, the central shaft and the supporting component.   
     
     
         13 . The chemical mechanical planarization apparatus according to  claim 12 , wherein the rotating component is provided with an inlet for introducing gas into the airtight chamber or extracting gas from the airtight chamber, wherein the introducing or the extracting of the gas causes the deformation of the airtight chamber, thereby driving the central shaft to move in a direction towards or away from the swing arm. 
     
     
         14 . The chemical mechanical planarization apparatus according to  claim 13 , wherein the pad conditioner further comprises:
 a gas pipe, wherein one end of the gas pipe that is close to the adjusting assembly is communicated with the inlet and the other end of the gas pipe is communicated with an external gas source.   
     
     
         15 . The chemical mechanical planarization apparatus according to  claim 10 , wherein the pressure detecting unit comprises a housing, a pressure chip and a diaphragm;
 the housing is internally provided with a cavity and externally provided with a mounting portion, wherein the mounting portion is configured to attach the housing to an inner side of the airtight chamber;   the pressure chip is encapsulated within the cavity, wherein the diaphragm is located on one side of the pressure chip that is away from the mounting portion of the housing; and   the diaphragm is configured to seal the pressure chip and transmit the internal gas pressure within the airtight chamber to the pressure chip.   
     
     
         16 . The chemical mechanical planarization apparatus according to  claim 15 , wherein the pressure chip comprises a diffused silicon pressure-sensitive chip. 
     
     
         17 . The chemical mechanical planarization apparatus according to  claim 16 , wherein the cavity is filled with a buffer fluid; and
 the buffer fluid is sealed within the cavity and located between the diffused silicon pressure-sensitive chip and the diaphragm, and the buffer fluid is configured to transmit the internal gas pressure within the airtight chamber provided by the diaphragm to the pressure chip.   
     
     
         18 . The chemical mechanical planarization apparatus according to  claim 10 , wherein determining a working state of the pad conditioner is further configured to:
 in response to the internal gas pressure exceeding a preset pressure range, shut down the pad conditioner.