Magnetic thermoelectric cooling assembly and magnetic wireless charger with cooling functionality

Abstract

Disclosed are a magnetic thermoelectric cooling assembly and a magnetic wireless charger with cooling functionality. The cooling assembly includes a thermoelectric cooling chip, which includes a concave cavity for accommodating a charging coil and a magnet. This allows the cooling effect to act directly on the mobile terminal without requiring conduction through the charging coil and magnet, significantly improving cooling performance. The magnetic wireless charger with cooling functionality, by utilizing the magnetic thermoelectric cooling assembly, achieves excellent cooling effects and is highly portable.

What is claimed is: 
     
         1 . A magnetic thermoelectric cooling assembly, comprising a thermoelectric cooling chip, wherein
 the thermoelectric cooling chip comprises a cooling surface and a heating surface;   the thermoelectric cooling chip has a concave cavity extending from a side of the cooling surface toward a side of the heating surface, with the cooling surface forming a cavity base cooling surface and a cavity top cooling surface with a height difference; and   on the side of the heating surface, a heat dissipation device is provided, and the heat dissipation device comprises a thermal conduction component of a certain length, with one end of the thermal conduction component contacting the heating surface for heat transfer; the other end of the heat dissipation device is equipped with a heat dissipation component to increase a heat dissipation area or a heat storage capacity; and a magnetic component is arranged within the concave cavity.   
     
     
         2 . The magnetic thermoelectric cooling assembly according to  claim 1 , wherein the heat dissipation device further comprises a heat storage unit, with one end of the thermal conduction component embedded within the heat storage unit; and the magnetic component is a magnet, and on a side of the cooling surface of the thermoelectric cooling chip, a cold conduction component is provided to simultaneously cover both the thermoelectric cooling chip and the magnet. 
     
     
         3 . The magnetic thermoelectric cooling assembly according to  claim 2 , wherein the cold conduction component is made of aluminum alloy or silicone; and the thermal conduction component is a copper tube; and the heat storage unit is an aluminum block, with the copper tube embedded within the aluminum block. 
     
     
         4 . The magnetic thermoelectric cooling assembly according to  claim 1 , wherein the thermal conduction component is a Vapor Chamber (VC) liquid-cooled heat spreader, and a shape of an end of the VC liquid-cooled heat spreader in contact with the thermoelectric cooling chip matches a shape of the thermoelectric cooling chip. 
     
     
         5 . The magnetic thermoelectric cooling assembly according to  claim 1 , wherein the heat dissipation component is a heat dissipation fin array or a heat sink block; and
 the magnetic thermoelectric cooling assembly further comprises a cooling fan, the cooling fan is configured to dissipate heat from the heat dissipation fin array.   
     
     
         6 . The magnetic thermoelectric cooling assembly according to  claim 2 , wherein thermal conductive grease is applied between the thermoelectric cooling chip and the cold conduction component; and thermal conductive grease is applied between the thermoelectric cooling chip and the thermal conduction component. 
     
     
         7 . The magnetic thermoelectric cooling assembly according to  claim 1 , wherein the cavity top cooling surface has a rectangular shape; and the cavity base cooling surface has a circular cross-section. 
     
     
         8 . A magnetic thermoelectric cooling assembly, comprising a ring-shaped thermoelectric cooling chip, wherein the ring-shaped thermoelectric cooling chip comprises a cooling surface and a heating surface, a heat dissipation device is provided on a side of the heating surface; and the heat dissipation device comprising a thermal conduction component of a certain length, and the thermal conduction component is in contact with the heating surface for heat transfer; and one end of the thermal conduction component forms a ring matching a shape of the ring-shaped thermoelectric cooling chip, and at the other end of the thermal conduction component, a heat dissipation component is provided to increase a heat dissipation area or a heat storage capacity; and
 a magnetic component is provided on an inner or outer ring of the ring-shaped thermoelectric cooling chip.   
     
     
         9 . The magnetic thermoelectric cooling assembly according to  claim 8 , wherein the heat dissipation device further comprises a heat storage unit, an end of the thermal conduction component where the ring is arranged is embedded within the heat storage unit; and
 the magnetic component is a magnet, and a side of the cooling surface of the ring-shaped thermoelectric cooling chip is provided with a cold conduction component capable of covering both the ring-shaped thermoelectric cooling chip and the magnet.   
     
     
         10 . The magnetic thermoelectric cooling assembly according to  claim 9 , wherein a top surface of the thermal conduction component is lower than a top surface of the heat storage unit; and
 the thermal conduction component is a copper tube, a middle portion of the copper tube is bent to form a ring matching a shape of the ring-shaped thermoelectric cooling chip; and two ends of the copper tube extend parallelly away from the ring.   
     
     
         11 . The magnetic thermoelectric cooling assembly according to  claim 8 , wherein the thermal conduction component is a VC liquid-cooled heat spreader, and an end of the VC liquid-cooled heat spreader in contact with the ring-shaped thermoelectric cooling chip forms a ring matching the shape of the ring-shaped thermoelectric cooling chip. 
     
     
         12 . The magnetic thermoelectric cooling assembly according to  claim 9 , wherein the heat storage unit is ring-shaped, and an outer diameter of the heat storage unit being greater than that of the thermal conduction component; and an inner diameter of the heat storage unit is less than or equal to the outer diameter of the thermal conduction component. 
     
     
         13 . The magnetic thermoelectric cooling assembly according to  claim 9 , wherein the heat storage unit is circular, and an outer diameter of the heat storage unit is larger than that of the thermal conduction component; and an accommodating cavity is formed on the heat storage unit, and the accommodating cavity extends inward from a side in contact with the thermal conduction component. 
     
     
         14 . A magnetic wireless charger with cooling functionality, comprising a housing, wherein
 a thermoelectric cooling assembly and a control assembly are arranged inside the housing;   the thermoelectric cooling assembly comprises a thermoelectric cooling chip, the thermoelectric cooling chip comprises a cooling surface and a heating surface; the cooling surface protrudes from the housing or contacts the housing to transfer cold through the housing; a heat dissipation device is provided on a side of the heating surface, and the heat dissipation device comprises a thermal conduction component with a certain length, one end of the thermal conduction component contacts the heating surface for heat transfer; at the other end of the thermal conduction component, a heat dissipation component is provided to increase a heat dissipation area or a heat storage capacity; and   the thermoelectric cooling assembly further comprises a magnetic component and a coil, the magnetic component and the coil are embedded in the thermoelectric cooling chip.   
     
     
         15 . The magnetic wireless charger with cooling functionality according to  claim 14 , wherein a heat dissipation hole corresponding to the heat dissipation component is provided at an end of the housing away from the thermoelectric cooling chip; and
 a through hole is formed in the housing for installing the thermoelectric cooling chip, with the cooling surface being flush with or protruding from an outer surface of the through hole; and   an upper surface of the magnetic component is flush with the cooling surface or lower than the cooling surface.   
     
     
         16 . The magnetic wireless charger with cooling functionality according to  claim 14 , wherein the thermoelectric cooling chip has a concave cavity extending from a side of the cooling surface to a side of the heating surface, forming a cavity base cooling surface and a cavity top cooling surface with a height difference, and the magnetic component and the coil are embedded in the concave cavity. 
     
     
         17 . The magnetic wireless charger with cooling functionality according to  claim 14 , wherein the thermoelectric cooling chip is annular, and the magnetic component and the coil are embedded in an inner ring of the thermoelectric cooling chip. 
     
     
         18 . The magnetic wireless charger with cooling functionality according to  claim 14 , wherein the control assembly comprises a printed circuit board (PCB) board arranged side by side with the heat dissipation component at the bottom of the housing; and a battery is further provided inside the housing, and the battery is located above the PCB board and the heat dissipation component. 
     
     
         19 . The magnetic wireless charger with cooling functionality according to  claim 14 , wherein the heat dissipation device further comprises a heat storage unit, and one end of the thermal conduction component is embedded within the heat storage unit;
 the heat dissipation component is a combination of a heat dissipation fin array and a cooling fan, or the heat dissipation component is a heat sink block; and the heat sink block is in contact with the housing to dissipate heat; and   the thermal conduction component is a copper tube, a VC liquid-cooled heat spreader, or a graphene plate, and the heat storage unit is an aluminum block or a copper block.   
     
     
         20 . The magnetic wireless charger with cooling functionality according to  claim 14 , wherein the thermoelectric cooling assembly further comprises a surface cover that covers the coil, the magnetic component, and the thermoelectric cooling chip, or only covers the magnetic component and the coil.