Electronic component, high-frequency module, and communication device

Abstract

An electronic component includes a substrate and a pillar electrode. The substrate includes a first principal surface. The pillar electrode protrudes from the first principal surface of the substrate in a thickness direction of the substrate. The pillar electrode is positioned between the first principal surface of the substrate and a bump electrode. The pillar electrode includes a second principal surface and a peripheral surface. The second principal surface is in contact with the bump electrode. The peripheral surface is connected to the second principal surface and to the first principal surface of the substrate. The pillar electrode includes a groove disposed at the second principal surface of the pillar electrode. A bottom of the groove is connected to the peripheral surface of the pillar electrode.

What is claimed is: 
     
         1 . An electronic component comprising:
 a substrate including a first principal surface; and   a pillar electrode protruding from the first principal surface of the substrate in a thickness direction of the substrate and being between the first principal surface and a bump electrode, wherein   the pillar electrode includes
 a second principal surface in contact with the bump electrode, and 
 a peripheral surface connected to the second principal surface, 
   the pillar electrode includes a groove at the second principal surface of the pillar electrode, and   a bottom of the groove is connected to the peripheral surface of the pillar electrode.   
     
     
         2 . The electronic component according to  claim 1 , wherein
 the bottom of the groove is connected to the peripheral surface of the pillar electrode at two locations or more.   
     
     
         3 . The electronic component according to  claim 1 , wherein
 the pillar electrode is elongated in a direction orthogonal to the thickness direction of the substrate.   
     
     
         4 . The electronic component according to  claim 3 , further comprising:
 a transistor including multiple electrodes, wherein   the pillar electrode is coupled to one of the multiple electrodes of the transistor.   
     
     
         5 . The electronic component according to  claim 3 , wherein
 the groove includes
 a first groove extending in a longitudinal direction of the pillar electrode, and 
 a second groove intersecting the first groove, and 
   a bottom of the first groove and a bottom of a second groove are connected to the peripheral surface of the pillar electrode.   
     
     
         6 . The electronic component according to  claim 1 , wherein
 the bottom of the groove includes a first portion and a second portion, and   a distance between the first portion and the second principal surface of the pillar electrode is greater than a distance between the second portion and the second principal surface of the pillar electrode.   
     
     
         7 . The electronic component according to  claim 6 , wherein
 the bottom of the groove includes
 a first bottom surface that is a flat surface including the first portion, and 
 a second bottom surface that is a flat surface including the second portion. 
   
     
     
         8 . The electronic component according to  claim 7 , wherein
 the bottom of the groove further includes a third bottom surface of which a distance from the second principal surface of the pillar electrode is smaller than the distance between the second portion and the second principal surface of the pillar electrode.   
     
     
         9 . The electronic component according to  claim 6 , wherein
 in the groove, a distance between the first portion and a section at which the bottom of the groove is connected to the peripheral surface of the pillar electrode is smaller than a distance between the second portion and the section.   
     
     
         10 . A high-frequency module comprising:
 the electronic component according to  claim 1 ; and   a circuit board on which the electronic component is disposed.   
     
     
         11 . A communication device comprising:
 the high-frequency module according to claim  10 ; and   a signal processing circuit connected to the high-frequency module.   
     
     
         12 . The electronic component according to  claim 2 , wherein
 the pillar electrode is elongated in a direction orthogonal to the thickness direction of the substrate.   
     
     
         13 . The electronic component according to  claim 12 , further comprising:
 a transistor including multiple electrodes, wherein   the pillar electrode is coupled to one of the multiple electrodes of the transistor.   
     
     
         14 . The electronic component according to  claim 12 , wherein
 the groove includes
 a first groove extending in a longitudinal direction of the pillar electrode, and 
 a second groove intersecting the first groove, and 
   a bottom of the first groove and a bottom of a second groove are connected to the peripheral surface of the pillar electrode.   
     
     
         15 . The electronic component according to  claim 2 , wherein
 the bottom of the groove includes a first portion and a second portion, and   a distance between the first portion and the second principal surface of the pillar electrode is greater than a distance between the second portion and the second principal surface of the pillar electrode.   
     
     
         16 . The electronic component according to  claim 15 , wherein
 the bottom of the groove includes
 a first bottom surface that is a flat surface including the first portion, and 
 a second bottom surface that is a flat surface including the second portion. 
   
     
     
         17 . The electronic component according to  claim 16 , wherein
 the bottom of the groove further includes a third bottom surface of which a distance from the second principal surface of the pillar electrode is smaller than the distance between the second portion and the second principal surface of the pillar electrode.   
     
     
         18 . The electronic component according to  claim 15 , wherein
 in the groove, a distance between the first portion and a section at which the bottom of the groove is connected to the peripheral surface of the pillar electrode is smaller than a distance between the second portion and the section.   
     
     
         19 . A high-frequency module comprising:
 the electronic component according to  claim 2 ; and   a circuit board on which the electronic component is disposed.   
     
     
         20 . A communication device comprising:
 the high-frequency module according to claim  19 ; and   a signal processing circuit connected to the high-frequency module.