Substrate polishing apparatus and substrate processing apparatus

Abstract

To mitigate the influence of twisting on pure water supply piping. A substrate polishing apparatus includes: a polishing table which rotates; a polishing head which holds a substrate and presses the substrate against the polishing table; a swinging arm which swings the polishing head; a bearing device which is disposed in an inside of the swinging arm and pivotally supports the polishing head; and pure water supply piping which is introduced into the inside of the swinging arm and supplies pure water to the bearing device. The pure water supply piping includes a spiral part which is wound so as to go around a swinging axis line of the swinging arm.

What is claimed is: 
     
         1 . A substrate polishing apparatus, comprising:
 a polishing table, rotating;   a polishing head, holding a substrate and pressing the substrate against the polishing table;   a swinging arm, swinging the polishing head;   a bearing device, disposed in an inside of the swinging arm and pivotally supporting the polishing head; and   pure water supply piping, introduced into the inside of the swinging arm and supplying pure water to the bearing device, and   the pure water supply piping comprising a spiral part wound so as to go around a swinging axis line of the swinging arm.   
     
     
         2 . The substrate polishing apparatus according to  claim 1 , wherein
 an opening part is formed on an upper surface of the swinging arm on the swinging axis line, and   the pure water supply piping comprises a first straight line part extending upward from the spiral part and passing through the opening part, and   a second straight line part extending from an upper end of the first straight line part in a direction intersecting with the swinging axis line and fixed to an outside of the swinging arm.   
     
     
         3 . The substrate polishing apparatus according to  claim 2 , wherein
 the first straight line part is disposed along the swinging axis line.   
     
     
         4 . The substrate polishing apparatus according to  claim 1 , wherein
 the spiral part is extendable and retractable in an up-down direction.   
     
     
         5 . The substrate polishing apparatus according to  claim 1 , wherein
 the pure water supply piping is formed from perfluoroalkoxy alkane.   
     
     
         6 . A substrate processing apparatus, comprising:
 the substrate polishing apparatus according to  claim 1 , polishing a substrate; and   a substrate cleaning apparatus, cleaning the substrate polished by the substrate polishing apparatus.