Polishing pad conditioning apparatus

Abstract

A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.

What is claimed is: 
     
         1 . A method for manufacturing a semiconductor wafer polishing pad, comprising:
 forming a plurality of protrusions, each of the plurality of protrusions comprising a fiber and a polymer structure surrounding the fiber and having the fiber protruding above a top surface of the polymer structure; and   arranging the plurality of protrusions into clusters on a base such that each of the clusters comprises a set of the plurality of protrusions defining a concentric ring and a center protrusion disposed at an axial center of the concentric ring.   
     
     
         2 . The method of  claim 1 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging a first subset of the clusters to extend radially from a center of the base towards an edge of the base such that a line extending from the center of the base intersects the center protrusion of each cluster of the first subset of the clusters.   
     
     
         3 . The method of  claim 1 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging a first protrusion of the plurality of protrusions to protrude from a surface of the base at an angle other than 90 degrees.   
     
     
         4 . The method of  claim 1 , wherein the fiber comprises at least 90% carbon by weight. 
     
     
         5 . The method of  claim 1 , wherein forming the plurality of protrusions comprises:
 forming a first protrusion of the plurality of protrusions such that the polymer structure comprises a first part having a uniform width and a second part having a tapered sidewall so as to have a non-uniform width.   
     
     
         6 . The method of  claim 5 , wherein forming the first protrusion comprises:
 forming the first protrusion such that the second part is between the first part and the top surface of the polymer structure.   
     
     
         7 . The method of  claim 1 , wherein the polymer structure comprises polyetheretherketone. 
     
     
         8 . The method of  claim 1 , wherein forming the plurality of protrusions comprises:
 forming a first protrusion of the plurality of protrusions to have a first height; and   forming a second protrusion of the plurality of protrusions to have a second height different than the first height.   
     
     
         9 . The method of  claim 1 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging a first protrusion of the plurality of protrusions on the base such that the first protrusion protrudes a first distance from a surface of the base; and   arranging a second protrusion of the plurality of protrusions on the base such that the second protrusion protrudes a second distance from the surface of the base greater than the first distance.   
     
     
         10 . The method of  claim 1 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging eight protrusions of the plurality of protrusions around another protrusion of the plurality of protrusions to define a first cluster of the clusters.   
     
     
         11 . The method of  claim 1 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging a first subset of the clusters in an ellipse around a center portion of the base.   
     
     
         12 . A method for manufacturing a semiconductor wafer polishing pad, comprising:
 forming a plurality of protrusions, each of the plurality of protrusions comprising a fiber and a polymer structure surrounding the fiber and having the fiber protruding above a top surface of the polymer structure; and   arranging the plurality of protrusions into clusters on a base such that a first subset of the clusters defines in an ellipse around a center portion of the base.   
     
     
         13 . The method of  claim 12 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging a first protrusion of the plurality of protrusions to protrude from a surface of the base at a first angle other than 90 degrees.   
     
     
         14 . The method of  claim 13 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging a second protrusion of the plurality of protrusions to protrude from the surface of the base at a 90 degree angle.   
     
     
         15 . The method of  claim 12 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging a second subset of the clusters to extend radially from a center of the base towards an edge of the base such that a line extending from the center of the base intersects a center protrusion of each cluster of the second subset of the clusters.   
     
     
         16 . The method of  claim 12 , wherein forming the plurality of protrusions comprises:
 forming a first protrusion of the plurality of protrusions to have a first height; and   forming a second protrusion of the plurality of protrusions to have a second height different than the first height.   
     
     
         17 . A method for manufacturing a semiconductor wafer polishing pad, comprising:
 forming a plurality of protrusions, each of the plurality of protrusions comprising a fiber and a polymer structure surrounding the fiber and having the fiber protruding above a top surface of the polymer structure; and   arranging the plurality of protrusions into clusters on a base, wherein a first subset of the clusters extend radially from a center of the base towards an edge of the base such that a line extending from the center of the base intersects a center protrusion of each cluster of the first subset of the clusters.   
     
     
         18 . The method of  claim 17 , wherein arranging the plurality of protrusions into the clusters on the base comprises:
 arranging the plurality of protrusions such that an angle defined between a first protrusion of the plurality of protrusions and the base is different than an angle defined between a second protrusion of the plurality of protrusions and the base.   
     
     
         19 . The method of  claim 17 , wherein the fiber comprises at least 90% carbon by weight. 
     
     
         20 . The method of  claim 17 , wherein the polymer structure comprises polyetheretherketone.