Photosensitive resin composition, cured product, and semiconductor element

Abstract

A photosensitive resin composition according to the present disclosure contains a maleimide compound; a crosslinking agent; and a photopolymerization initiator, in which the maleimide compound is a reaction product of a tetracarboxylic dianhydride (a1), a diamine (a2), a triamine (a3), and maleic anhydride (a4), and the diamine (a2) includes a dimer diamine.

1 . A photosensitive resin composition comprising: a maleimide compound; a crosslinking agent; and a photopolymerization initiator,
 wherein the maleimide compound is a reaction product of a tetracarboxylic dianhydride (a1), a diamine (a2), a triamine (a3), and maleic anhydride (a4), and   the diamine (a2) includes a dimer diamine.   
     
     
         2 . The photosensitive resin composition according to  claim 1 , wherein the diamine (a2) includes a second diamine other than the dimer diamine. 
     
     
         3 . The photosensitive resin composition according to  claim 2 , wherein the second diamine is an alicyclic diamine or an aromatic diamine. 
     
     
         4 . The photosensitive resin composition according to  claim 1 , wherein the dimer diamine contains at least one of a compound represented by the following General Formula (1) and a compound represented by the following General Formula (2): 
       
         
           
           
               
               
           
         
         wherein in Formulae (1) and (2), m, n, p, and q each represent an integer of 1 or more selected so that m+n=6 to 17 and p+q=8 to 19, and a bond indicated by a broken line represents a carbon-carbon single bond or a carbon-carbon double bond, and provided that when the bond indicated by the broken line is a carbon-carbon double bond, Formulae (1) and (2) have a structure in which the number of hydrogen atoms bonded to each carbon atom constituting the carbon-carbon double bond is reduced by one from the number indicated in Formulae (1) and (2). 
       
     
     
         5 . The photosensitive resin composition according to  claim 1 , wherein the tetracarboxylic dianhydride (a1) contains at least one selected from the group consisting of 1,3,3a,4,5,9b-hexahydro-5(tetrahydro-2,5-dioxo-3-furanyl)naphtho[1,2-C]furan-1,3-dione, 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 4,4′-(4,4′-isopropylidenediphenoxy)diphthalic anhydride, 4,4′-(hexafluoroisopropylidene)diphthalic anhydride, 5-(2,5-dioxotetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, dicyclohexyl-3,4,3′,4′-tetracarboxylic dianhydride, bicyclo[2.2.2]octane-2,3,5,6-tetracarboxylic 2,3:5,6-dianhydride, 5,5′-bis-2-norbornene-5,5′,6,6′-tetracarboxylic acid-5,5′,6,6′-dianhydride, and 3,4′-biphthalic anhydride. 
     
     
         6 . The photosensitive resin composition according to  claim 1 , wherein a content of the triamine (a3) is 5 to 35 mol % based on the total amount of the diamine (a2) and the triamine (a3). 
     
     
         7 . The photosensitive resin composition according to  claim 1 , wherein a weight average molecular weight of the maleimide compound is 3000 to 40000. 
     
     
         8 . The photosensitive resin composition according to  claim 1 , wherein the maleimide compound has a fluorene skeleton. 
     
     
         9 . The photosensitive resin composition according to  claim 1 , wherein the crosslinking agent includes a polymerizable crosslinking agent having a (meth)acryloyl group. 
     
     
         10 . The photosensitive resin composition according to  claim 1 , wherein the crosslinking agent includes a polymerizable crosslinking agent having an allyl group or a vinyl group. 
     
     
         11 . The photosensitive resin composition according to  claim 1 , further comprising a thermal polymerization initiator. 
     
     
         12 . A cured product of the photosensitive resin composition according to  claim 1 . 
     
     
         13 . A semiconductor element comprising a redistribution layer containing a cured product of the photosensitive resin composition according to  claim 1 .