Integrated circuit package and method

Abstract

In an embodiment, a device includes: a package component including: a first integrated circuit die; an encapsulant at least partially surrounding the first integrated circuit die; a redistribution structure on the encapsulant, the redistribution structure physically and electrically coupling the first integrated circuit die; a first module socket attached to the redistribution structure; an interposer attached to the redistribution structure adjacent the first module socket, the outermost extent of the interposer extending beyond the outermost extent of the redistribution structure; and an external connector attached to the interposer.

What is claimed is: 
     
         1 . A device comprising:
 a package component comprising:
 a plurality of integrated circuit dies; 
 an encapsulant around the integrated circuit dies; 
 a redistribution structure over the encapsulant, an outer edge of the redistribution structure being disposed a first distance from a center of the redistribution structure in a cross-sectional view; 
 a plurality of module sockets attached to the redistribution structure, the module sockets arranged in a grid in a top-down view; and 
 a plurality of external connectors around the grid of the module sockets in the top-down view, an inner edge of each of the external connectors being disposed a second distance from the center of the redistribution structure in the cross-sectional view, an outer edge of each of the external connectors being disposed a third distance from the center of the redistribution structure in the cross-sectional view, the third distance being greater than the first distance. 
   
     
     
         2 . The device of  claim 1 , wherein the module sockets have different widths than the external connectors in the top-down view, and the module sockets have different lengths than the external connectors in the top-down view. 
     
     
         3 . The device of  claim 1 , wherein the second distance is less than the first distance. 
     
     
         4 . The device of  claim 1 , wherein the second distance is greater than the first distance. 
     
     
         5 . The device of  claim 1 , wherein the external connectors are vertically offset from the module sockets. 
     
     
         6 . The device of  claim 1 , further comprising a plurality of interposers, wherein the interposers comprise first pads connected to the redistribution structure and further comprise second pads connected to the external connectors, the first pads and the second pads having different pitches. 
     
     
         7 . The device of  claim 1 , further comprising a plurality of interposers, wherein the module sockets comprise first pads connected to the redistribution structure, the interposers comprise second pads connected to the redistribution structure, and the first pads and the second pads have a same pitch. 
     
     
         8 . The device of  claim 1 , further comprising a plurality of interposers, wherein the module sockets comprise first pads connected to the redistribution structure, the interposers comprise second pads connected to the redistribution structure, and the first pads and the second pads have different pitches. 
     
     
         9 . The device of  claim 1 , further comprising:
 a mechanical brace having openings exposing portions of the module sockets; and   a thermal module, the package component being disposed between the thermal module and the mechanical brace.   
     
     
         10 . A device comprising:
 a package component comprising:
 a plurality of integrated circuit dies; 
 an encapsulant around the integrated circuit dies; 
 a redistribution structure over the encapsulant, the redistribution structure comprising redistribution lines that are connected to the integrated circuit dies; 
 a plurality of interposers attached to the redistribution structure, the interposers disposed around an outer edge of the redistribution structure in a top-down view; and 
 a plurality of external connectors attached to the interposers. 
   
     
     
         11 . The device of  claim 10 , wherein an outer edge of each of the interposers extends beyond the outer edge of the redistribution structure. 
     
     
         12 . The device of  claim 10 , wherein an outer edge of each of the external connectors extends beyond the outer edge of the redistribution structure. 
     
     
         13 . The device of  claim 10 , further comprising a plurality of module sockets connected to the redistribution structure, wherein the external connectors are vertically offset from the module sockets. 
     
     
         14 . The device of  claim 10 , further comprising:
 a mechanical brace; and   a thermal module, the package component being disposed between the thermal module and the mechanical brace.   
     
     
         15 . A device comprising:
 a package component comprising:
 a plurality of computing dies; 
 a plurality of interface dies; 
 an encapsulant around the computing dies and the interface dies; 
 a redistribution structure over the encapsulant, the redistribution structure comprising redistribution lines that are connected to the computing dies and the interface dies; 
 a plurality of module sockets attached to a center of the redistribution structure, the module sockets disposed over the computing dies; 
 a plurality of interposers attached to an edge of the redistribution structure, the interposers disposed over the interface dies; and 
 a plurality of external connectors attached to the interposers, the external connectors extending beyond the edge of the redistribution structure. 
   
     
     
         16 . The device of  claim 15 , wherein the module sockets are disposed between the interposers in a top-down view. 
     
     
         17 . The device of  claim 15 , wherein the external connectors partially vertically overlap the redistribution structure. 
     
     
         18 . The device of  claim 15 , wherein the external connectors do not vertically overlap the redistribution structure. 
     
     
         19 . The device of  claim 15 , wherein the external connectors are vertically offset from the module sockets. 
     
     
         20 . The device of  claim 15 , further comprising:
 a mechanical brace having openings exposing the module sockets in a top-down view; and   a thermal module, the package component being disposed between the thermal module and the mechanical brace.