Grinding configuration for substrate grinding apparatus

Abstract

Disclosed is a grinding configuration for a substrate grinding apparatus. The grinding configuration includes a grinding disk, multiple first light guides, and multiple second light guides. Multiple mounting holes are penetrated through the grinding disk, with each first light guide and each second light guide being provided in each mounting hole, respectively. Each first light guide and each second light guide is penetrated along its axial direction to form a light channel. Multiple light transmission plates are provided at the lower end of each first light guide and each second light guide, which block the communication between each light channel and the space below the grinding disk, thereby preventing slurry or foam generated during substrate grinding from entering each light channel.

1 . A grinding configuration for a substrate grinding apparatus, comprising:
 a grinding disk used to install an abrasive cloth for grinding a substrate positioned beneath the abrasive cloth;   multiple mounting holes penetrated through the grinding disk along an axial direction to define a virtual circular line, with a center of the circular line being located at a rotation center of the grinding disk, wherein each mounting hole is spaced along the circular line;   multiple first light guides and multiple second light guides respectively provided in each mounting hole, wherein each of the first light guides and each of the second light guides is penetrated along its axial direction to form a light channel; and   multiple light transmission plates through which light passes provided at the lower end of each of the first light guides and each of the second light guides, wherein each light transmission plate blocks communication between each light channel and the space below the grinding disk, thereby preventing slurry or foam generated during grinding of the substrate from entering each light channel.   
     
     
         2 . The grinding configuration for the substrate grinding apparatus according to  claim 1 , wherein multiple first positioning structures are respectively connected to each of the first light guides; and wherein each of the first positioning structures includes two clamping blocks, each of which cooperatively clamps the radial outer periphery of the first light guide and abuts the upper surface of the grinding disk, thereby axially positioning each of the first light guides. 
     
     
         3 . The grinding configuration for the substrate grinding apparatus according to  claim 1 , wherein multiple second positioning structures are respectively connected to each of the second light guides; and wherein each of the second positioning structures includes a bushing and a base, wherein each bushing tightly encloses the radial outer periphery of each second light guide and protrudes downward with a protrusion; and each base abuts against the upper surface of the grinding disk and protrudes upward with a riser block, thereby positioning each of the second light guides along its axial direction at a first position or a second position. 
     
     
         4 . The grinding configuration for the substrate grinding apparatus according to  claim 2 , wherein multiple second positioning structures are respectively connected to each of the second light guides; and wherein each of the second positioning structures includes a bushing and a base, wherein each bushing tightly encloses the radial outer periphery of each second light guide and protrudes downward with a protrusion; and each base abuts against the upper surface of the grinding disk and protrudes upward with a riser block, thereby positioning each of the second light guides along its axial direction at a first position or a second position. 
     
     
         5 . The grinding configuration for the substrate grinding apparatus according to  claim 3 , wherein each bushing forms a gap along its radial direction, and each gap extends to the radial outer periphery and the radial inner periphery of each bushing; each bushing is screwed with a second fastening bolt, respectively, thereby reducing the width of each gap, tightening the radial inner periphery of each bushing, and enabling each bushing to tightly adhere to the radial outer periphery of each second light guide. 
     
     
         6 . The grinding configuration for the substrate grinding apparatus according to  claim 4 , wherein each bushing forms a gap along its radial direction, and each gap extends to the radial outer periphery and the radial inner periphery of each bushing; each bushing is screwed with a second fastening bolt, respectively, thereby reducing the width of each gap, tightening the radial inner periphery of each bushing, and enabling each bushing to tightly adhere to the radial outer periphery of each second light guide. 
     
     
         7 . The grinding configuration for the substrate grinding apparatus according to  claim 1 , wherein each of the first light guides and each of the second light guides respectively forms two stoppers, each stopper being located on the lower surface of each light transmission plate, thereby positioning each light transmission plate.