Grinding device for surface machining of workpieces

Abstract

A grinding device for surface machining of workpieces. The grinding device has a grinding wheel that is arranged to be rotatable about a first axis and includes at least one grinding element, and having at least one sensor element interacting at least indirectly with the grinding element for detecting a parameter of the grinding element, wherein the parameter can be fed to an evaluation device.

What is claimed is: 
     
         1 . A grinding device for surface machining of workpieces, the graining device comprising:
 a grinding wheel arranged to be rotatable about a first axis and includes at least one grinding element; and   at least one sensor element configured to interact at least indirectly with the grinding element for detecting a parameter of the grinding element;   wherein the at least one grinding element is arranged at a radial distance from the first axis, the at least one grinding element is surrounded, on the side radially facing and/or radially facing away from the first axis, by a carrier element that, at least in regions, covers the at least one grinding element, and   wherein the at least one sensor element is arranged on the carrier element.   
     
     
         2 . The grinding device according to  claim 1 , wherein the grinding wheel includes a plurality of grinding elements that are arranged at equal angular intervals about the first axis and machining surfaces of the grinding elements, interacting with the workpiece to be machined, are arranged in a plane running perpendicularly to the first axis, and wherein the carrier element includes at least one annular carrier wall that is arranged perpendicularly to the machining surfaces of the grinding elements. 
     
     
         3 . The grinding device according to  claim 2 , wherein the at least one carrier wall is connected to a transverse wall running in parallel with and below the machining surfaces. 
     
     
         4 . The grinding device according to  claim 1 , wherein the at least one sensor element is arranged in a region of an opening of the carrier element. 
     
     
         5 . The grinding device according to  claim 1 , wherein a machining device configured to machine the at least one grinding element is arranged in a region of the carrier element. 
     
     
         6 . The grinding device according to  claim 2 , wherein the carrier element is in a shape of a circular ring segment, and in the carrier element projects beyond the grinding elements on a side facing the machining surfaces. 
     
     
         7 . The grinding device according to  claim 1 , wherein the at least one sensor element is configured to detect a temperature and/or a frequency of the grinding elements as a parameter. 
     
     
         8 . The device according to  claim 2 , wherein the at least one sensor element is configured to detect a geometric size of the grinding elements as a parameter. 
     
     
         9 . The grinding device according to  claim 1 , wherein: (i) the grinding wheel interacts with a workpiece holding wheel that positions at least one workpiece relative to the grinding wheel and is mounted rotatably about a second axis running in parallel with the first axis, and/or (ii) the grinding wheel and the workpiece holding wheel can be driven in different directions about the first and second axes. 
     
     
         10 . The grinding device according to  claim 1 , wherein the grinding device is configured to machine surfaces of wafers.