Multi-functional shutter disk for thin film deposition chamber
Abstract
The present disclosure provides a multifunction chamber having a multifunctional shutter disk. The shutter disk includes a lamp device, a DC/RF power device, and a gas line on one surface of the shutter disk. With this configuration, simplifying the chamber type is possible as the various specific, dedicated chambers such as a degas chamber, a pre-clean chamber, a CVD/PVD chamber are not required. By using the multifunctional shutter disk, the degassing function and the pre-cleaning function are provided within a single chamber. Accordingly, a separate degas chamber and a pre-clean chamber are no longer required and the overall transfer time between chambers is reduced or eliminated.
Claims
exact text as granted — not AI-modified1 . A film deposition chamber, comprising:
an electrode; a holder configured to hold a workpiece; and a shutter disk overlying the holder, the shutter disk including: a first side and a second side, the first side of the shutter disk facing the holder; a thermal energy source on the first side of the shutter disk; and a gas line connected to the shutter disk for providing at least one of a reactive gas or an inert gas for applying to the workpiece.
2 . The film deposition chamber of claim 1 , wherein the shutter disk is between the electrode and the holder, and
wherein the shutter disk is movable from a position overlying the holder.
3 . The film deposition chamber of claim 1 , wherein the shutter disk has a circular shape with a first radius, the first side including an inner circular area having a second radius and an outer ring area occupying an area outside of the second radius of the inner circular area and within the first radius of the shutter disk.
4 . The film deposition chamber of claim 1 , wherein the thermal energy source includes a lamp module within the inner circular area of the first side of the shutter disk.
5 . The film deposition chamber of claim 4 , wherein the shutter disk further includes an etch module within the outer ring area of the first side of the shutter disk.
6 . The film deposition chamber of claim 5 , wherein the etch module includes a source of electromagnetic energy suitable for use in at least one of a chemical etching pre-clean process and a physical etching pre-clean process.
7 . The film deposition chamber of claim 6 , wherein the etch module is connected to a power source.
8 . The film deposition chamber of claim 7 , wherein the power source includes a direct current (DC) power or a radio frequency (RF) power.
9 . The film deposition chamber of claim 6 , further comprising:
a power module on the first side of the shutter disk.
10 . A film deposition chamber, comprising:
a holder configured to hold a workpiece; and a shutter disk adjacent to the holder, the shutter disk having a first surface and a second surface, comprising: a thermal energy source module on the first surface of the shutter disk; and a power module adjacent to the thermal energy source module on the first surface, wherein the first surface including: an inner circle having a first radius, the thermal energy source module occupying at least a portion of the inner circle; and an outer circle concentric with the inner circle, the outer circle having a second radius greater than the first radius, the power module occupying at least a portion of an area between the outer circle and the inner circle.
11 . The film deposition chamber of claim 10 , wherein the power module includes a source of electromagnetic energy suitable for use in at least one of a chemical etching pre-clean process and a physical etching pre-clean process.
12 . The film deposition chamber of claim 11 , wherein the thermal energy source module and the power module are coplanar to each other on the first surface.
13 . The film deposition chamber of claim 11 , further comprising:
a gas line for supplying reactive gas suitable for use in the chemical etching pre-clean process and inert gas suitable for use in the physical etching pre-clean process.
14 . The film deposition chamber of claim 10 , wherein the thermal energy source module includes a heater to heat a workpiece.
15 . A film deposition chamber, comprising:
a holder configured to hold a workpiece; and a shutter disk adjacent to the holder, the shutter disk comprising: a first surface of the shutter disk; and a power module on the first surface, wherein the first surface includes: a first section; and a second section adjacent to the first section occupied by the power module.
16 . The film deposition chamber of claim 15 , further comprising:
a gas supply module adjacent to the power module on the first surface, the gas supply module being configured to supply reactive gas suitable for use in the chemical etching pre-clean process and inert gas suitable for use in the physical etching pre-clean process.
17 . The film deposition chamber of claim 16 , wherein the first surface includes a third section adjacent to the first section and the second section occupied by the gas supply module.
18 . The film deposition chamber of claim 17 , wherein the shutter disk is a substantially circular shape and the first surface of the shutter disk includes a circular contour, the second section includes a circular area having a first radius, the third section includes a ring shaped area that surrounds the second section, the first section includes a ring shaped area that surrounds the third section.
19 . The film deposition chamber of claim 17 , wherein the shutter disk is a substantially circular shape and the first surface of the shutter disk includes a circular contour, the second section includes a circular area having a first radius, the second section includes a ring shaped area that surrounds the first section, the third section includes a ring shaped area that surrounds the second section.
20 . The film deposition chamber of claim 17 , wherein the shutter disk is a substantially circular shape and the first surface of the shutter disk includes a circular contour, the third section includes a circular area having a first radius, the second section includes a ring shaped area that surrounds the third section, the second section includes a ring shaped area that surrounds the third section.Join the waitlist — get patent alerts
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