US2025301888A1PendingUtilityA1

Display device and manufacturing method thereof

Assignee: JAPAN DISPLAY INCPriority: Mar 19, 2024Filed: Mar 18, 2025Published: Sep 25, 2025
Est. expiryMar 19, 2044(~17.6 yrs left)· nominal 20-yr term from priority
H10K 50/8445H10K 71/00H10K 59/8731H10K 59/122H10K 59/1201H10K 59/12H10K 59/873
64
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Claims

Abstract

According to one embodiment, a display device includes first and second display elements, a partition, and first and second sealing layers covering the display elements. The first display element includes a first lower electrode, a first upper electrode and a first organic layer. The second display element includes a second lower electrode, a second upper electrode and a second organic layer. The partition is provided between the display elements. The sealing layers have first and second end portions above the partition. The end portions overlap each other in a thickness direction of the first and second sealing layers.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A display device comprising:
 a first display element including:
 a first lower electrode; 
 a first upper electrode which faces the first lower electrode; and 
 a first organic layer which is located between the first lower electrode and the first upper electrode and emits light based on application of voltage; 
   a second display element including:
 a second lower electrode; 
 a second upper electrode which faces the second lower electrode; and 
 a second organic layer which is located between the second lower electrode and the second upper electrode and emits light based on application of voltage; 
   a partition between the first display element and the second display element;   a first sealing layer which covers the first display element; and   a second sealing layer which covers the second display element, wherein   the first sealing layer has a first end portion above the partition,   the second sealing layer has a second end portion above the partition, and   the first end portion and the second end portion overlap each other in a thickness direction of the first sealing layer and the second sealing layer.   
     
     
         2 . The display device of  claim 1 , wherein
 the first end portion is located between the partition and the second end portion in the thickness direction, and   a first gap is formed between the partition and the first end portion in the thickness direction.   
     
     
         3 . The display device of  claim 2 , wherein
 the first gap is a void.   
     
     
         4 . The display device of  claim 2 , wherein
 a second gap is formed between the first end portion and the second end portion in the thickness direction.   
     
     
         5 . The display device of  claim 4 , further comprising a resin layer which covers the first sealing layer and the second sealing layer, wherein
 at least part of the second gap is filled with the resin layer.   
     
     
         6 . The display device of  claim 1 , wherein
 the first sealing layer and the second sealing layer are in contact with each other above the partition.   
     
     
         7 . The display device of  claim 1 , wherein
 an area of the first display element is greater than an area of the second display element.   
     
     
         8 . The display device of  claim 1 , wherein
 the partition includes a conductive lower portion and an upper portion which has an end portion protruding from a side surface of the lower portion.   
     
     
         9 . The display device of  claim 1 , wherein
 each of the first sealing layer and second sealing layer is formed of an inorganic insulating material.   
     
     
         10 . The display device of  claim 1 , wherein
 both a thickness of the first sealing layer and a thickness of the second sealing layer are greater than a height of the partition.   
     
     
         11 . A manufacturing method of a display device, the method including:
 forming a first lower electrode and a second lower electrode in a display area;   forming a partition located between the first lower electrode and the second lower electrode;   forming a first stacked film in the display area, the first stacked film including:
 a first organic layer which emits light based on application of voltage; and 
 a first upper electrode which covers the first organic layer; 
   forming a first insulating layer which covers the first stacked film in the display area;   forming, by first etching for the first insulating layer, a first sealing layer which has a first end portion located above the partition and covers a first display element including the first lower electrode, the first organic layer and the first upper electrode;   removing a portion of the first stacked film exposed from the first sealing layer by second etching for the first stacked film;   forming a second stacked film in the display area after the second etching, the second stacked film including:
 a second organic layer which emits light based on application of voltage; and 
 a second upper electrode which covers the second organic layer; 
   forming a second insulating layer which covers the second stacked film in the display area;   forming, by third etching for the second insulating layer, a second sealing layer which has a second end portion overlapping the first end portion in a thickness direction of the first sealing layer and covers a second display element including the second lower electrode, the second organic layer and the second upper electrode; and   removing a portion of the second stacked film exposed from the second sealing layer by fourth etching for the second stacked film.   
     
     
         12 . The manufacturing method of  claim 11 , wherein
 a portion of the first stacked film located on the partition is removed in the second etching, thereby forming a first gap between the partition and the first end portion in the thickness direction.   
     
     
         13 . The manufacturing method of  claim 12 , wherein
 the first gap remains as a void after the second sealing layer is formed.   
     
     
         14 . The manufacturing method of  claim 12 , wherein
 a portion of the second stacked film located on the first end portion is removed in the fourth etching, thereby forming a second gap between the first end portion and the second end portion in the thickness direction.   
     
     
         15 . The manufacturing method of  claim 14 , further including
 forming a resin layer which covers the first sealing layer and the second sealing layer, wherein   at least part of the second gap is filled with the resin layer.   
     
     
         16 . The manufacturing method of  claim 11 , wherein
 the first sealing layer and the second sealing layer are in contact with each other above the partition.   
     
     
         17 . The manufacturing method of  claim 11 , wherein
 an area of the first display element is greater than an area of the second display element.   
     
     
         18 . The manufacturing method of  claim 11 , wherein
 the partition includes a conductive lower portion and an upper portion which has an end portion protruding from a side surface of the lower portion.   
     
     
         19 . The manufacturing method of  claim 11 , wherein
 each of the first sealing layer and the second sealing layer is formed of an inorganic insulating material.   
     
     
         20 . The manufacturing method of  claim 11 , wherein
 both a thickness of the first sealing layer and a thickness of the second sealing layer are greater than a height of the partition.

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