US2025297092A1PendingUtilityA1
Composition that contains compound having polyoxyalkylene chain and ester-based thixotropy-imparting agent
Est. expiryMay 19, 2042(~15.8 yrs left)· nominal 20-yr term from priority
C08F 290/062C08K 2003/2227C08K 5/5425C08K 5/5419C08K 5/14C08K 5/13C08K 3/26C08F 283/06C09K 5/00C08F 220/283C08F 220/20C08F 220/1811C08F 220/58C08F 290/046C08K 5/10C08L 71/00C08L 51/08C08F 2/44
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Claims
Abstract
A composition containing a compound represented by the following Formula (1):wherein R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain; andan ester-based thixotropy-imparting agent.
Claims
exact text as granted — not AI-modified1 . A composition comprising:
a compound represented by the following Formula (1):
wherein R 11 and R 12 each independently represent a hydrogen atom or a methyl group; and R 13 represents a divalent group having a polyoxyalkylene chain; and
an ester-based thixotropy-imparting agent.
2 . The composition according to claim 1 , further comprising a thermally conductive filler.
3 . The composition according to claim 1 , further comprising a compound represented by the following Formula (2):
wherein R 21 and R 22 each independently represent a hydrogen atom or a monovalent organic group, and may be bonded to each other to form a ring; and R 23 represents a hydrogen atom or a methyl group.
4 . The composition according to claim 1 , further comprising a compound represented by the following Formula (3):
wherein R 31 and R 32 each independently represent a hydrogen atom or a methyl group; and R 33 represents a divalent group having a poly(meth)acrylate chain.
5 . A cured product of the composition according to claim 1 .
6 . An article comprising:
a heat source; and the cured product according to claim 5 in thermal contact with the heat source.Join the waitlist — get patent alerts
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