Polishing apparatus and polishing method

Abstract

The present application provides polishing apparatus and a polishing method, which relate to the technical field of semiconductors and are used for solving a problem of poor tuning effect of a pad conditioner. The polishing apparatus comprises a polishing pad, a pad conditioner, a cleaning nozzle, a pressure detecting unit and a control unit, where the pad conditioner can be moved onto a pressure detecting unit and contact with the pressure detecting unit, the pressure detecting unit is used for measuring the pressure data of the pad conditioner, the cleaning nozzle is used for cleaning the pad conditioner, and the control unit is electrically connected with the pad conditioner and the pressure detecting unit to control a working state of the pad conditioner according to the pressure data.

What is claimed is: 
     
         1 . A polishing apparatus, comprising a polishing pad, a movable pad conditioner, a cleaning nozzle, a pressure detecting unit provided on the cleaning nozzle, and a control unit, wherein
 the pad conditioner is movable on the pressure detecting unit and in contact with the pressure detecting unit, and the pad conditioner is configured to tune the polishing pad;   the pressure detecting unit is configured to measure pressure data of the pad conditioner;   the cleaning nozzle is configured to clean the pad conditioner; and   the control unit is electrically coupled with both the pad conditioner and the pressure detecting unit, and sets a working state of the pad conditioner according to the pressure data; wherein,   the control unit is configured to acquire the pressure data of the pad conditioner when the cleaning nozzle cleans the pad conditioner.   
     
     
         2 . The polishing apparatus according to  claim 1 , wherein the pressure detecting unit further comprises:
 a hollow base, provided on the cleaning nozzle; and   a pressure sensing element, disposed at one end of the hollow base away from the cleaning nozzle, the pressure sensing element being configured to sense the pressure data.   
     
     
         3 . The polishing apparatus according to  claim 2 , wherein the pressure sensing element further comprises a pressure sensing ring, and a shape of the pressure sensing ring is same as that of one end of the hollow base away from the cleaning nozzle. 
     
     
         4 . The polishing apparatus according to  claim 3 , wherein the pressure sensing ring further comprises a conductive material layer, a spacer layer and a pressure-sensitive material layer disposed in a stacked manner, wherein a material of the spacer layer comprises a polyester material. 
     
     
         5 . The polishing apparatus according to  claim 3 , wherein the pressure sensing element further comprises a plurality of supporting legs, which are disposed at intervals and are all disposed between the pressure sensing ring and the hollow base. 
     
     
         6 . The polishing apparatus according to  claim 5 , wherein the plurality of supporting legs and the pressure sensing ring are an integral structure, and a material of the plurality of supporting legs comprises a flexible material. 
     
     
         7 . The polishing apparatus according to  claim 3 , wherein the pad conditioner further comprises:
 a tuning base, a surface of which has a central area and an edge area surrounding the central area, a shape of the edge area corresponding to a shape of the pressure sensing ring; and   tuning particles, disposed in the central area.   
     
     
         8 . The polishing apparatus according to  claim 3 , wherein the hollow base further comprises a tubular structure, the cleaning nozzle is multiple in number, and the tubular structure is provided outside at least one cleaning nozzle. 
     
     
         9 . The polishing apparatus according to  claim 8 , wherein the hollow base further comprises an outer edge, the outer edge is disposed on a radial side wall of one end of the tubular structure facing the pad conditioner, and a surface of the outer edge facing the pad conditioner is on a same level with a surface of the tubular structure facing the pad conditioner. 
     
     
         10 . The polishing apparatus according to  claim 1 , wherein the control unit is configured to:
 in response to the pressure data being out of a preset pressure range, set the pad conditioner in an idle state; and in response to the pressure data being within the preset pressure range, set the pad conditioner in a polishing state;   wherein in response to the pad conditioner being in the polishing state, the pad conditioner performs at least one tuning on the polishing pad.   
     
     
         11 . A polishing method, comprising:
 step a, moving a pad conditioner of a polishing apparatus towards a pressure detecting unit and to contact with the pressure detecting unit, wherein the pressure detecting unit is provided on a cleaning nozzle of the polishing apparatus, and in response to the cleaning nozzle cleaning the pad conditioner, obtaining pressure data of the pad conditioner;   step b, setting a working state of the pad conditioner according to the pressure data and a preset pressure range; and   sequentially repeating the step a and step b until the pad conditioner finishes tuning of a polishing pad of the polishing apparatus or the pad conditioner is in an idle state.   
     
     
         12 . The polishing method according to  claim 11 , wherein controlling the working state of the pad conditioner according to the pressure data and the preset pressure range comprises:
 in response to the pressure data being out of the preset pressure range, setting the pad conditioner in an idle state, and in response to the pressure data being within the preset pressure range, setting the pad conditioner in a polishing state; and   in response to the pad conditioner being in a polishing state, performing, by the pad conditioner performs, at least one tuning on the polishing pad.   
     
     
         13 . A wafer processing system comprising a polishing pad, a movable pad conditioner, a cleaning nozzle, a pressure detecting unit provided on the cleaning nozzle, and a control unit; wherein,
 the polishing pad is configured to polish the wafer;   the pad conditioner is movable on the pressure detecting unit and in contact with the pressure detecting unit;   the pressure detecting unit is configured to measure pressure data of the pad conditioner;   the cleaning nozzle is configured to clean the pad conditioner; and   the control unit is electrically coupled with both the pad conditioner and the pressure detecting unit, and sets a working state of the pad conditioner according to the pressure data; wherein,   the control unit is configured to acquire the pressure data of the pad conditioner when the cleaning nozzle cleans the pad conditioner.   
     
     
         14 . The wafer processing system according to  claim 13 , wherein the pressure detecting unit further comprises:
 a hollow base, provided on the cleaning nozzle; and   a pressure sensing element, disposed at one end of the hollow base away from the cleaning nozzle, the pressure sensing element being configured to sense the pressure data.   
     
     
         15 . The wafer processing system according to  claim 14 , wherein the pressure sensing element further comprises a pressure sensing ring, and a shape of the pressure sensing ring is same as that of one end of the hollow base away from the cleaning nozzle. 
     
     
         16 . The wafer processing system according to  claim 15 , wherein the pressure sensing ring further comprises a conductive material layer, a spacer layer and a pressure-sensitive material layer disposed in a stacked manner, wherein a material of the spacer layer comprises a polyester material. 
     
     
         17 . The wafer processing system according to  claim 15 , wherein the pressure sensing element further comprises a plurality of supporting legs, which are disposed at intervals and are all disposed between the pressure sensing ring and the hollow base. 
     
     
         18 . The wafer processing system according to  claim 17 , wherein the plurality of supporting legs and the pressure sensing ring are an integral structure, and a material of the plurality of supporting legs comprises a flexible material. 
     
     
         19 . The wafer processing system according to  claim 15 , wherein the pad conditioner further comprises:
 a tuning base, a surface of which has a central area and an edge area surrounding the central area, a shape of the edge area corresponding to a shape of the pressure sensing ring; and   tuning particles, disposed in the central area.   
     
     
         20 . The wafer processing system according to  claim 13 , wherein the control unit is configured to:
 in response to the pressure data being out of a preset pressure range, set the pad conditioner in an idle state; and in response to the pressure data being within the preset pressure range, set the pad conditioner in a polishing state;   wherein in response to the pad conditioner being in the polishing state, the pad conditioner performs at least one tuning on the polishing pad.