Electrode plate and electroplating device with same

Abstract

An electrode plate and an electroplating device having the electrode plate is used as an anode electrode. The electrode plate includes a substrate, N electrode patterns and N wirings. The substrate has a first surface and a second surface opposite to each other and has a plurality of through holes. The N electrode patterns are disposed on the first surface of the substrate, and are spaced apart from each other. The N wirings are disposed on the second surface of the substrate. Each of the N wirings has a first end and a second end. The first end of the N wirings is connected to the corresponding N electrode patterns via at least one through hole. The second ends of the N wirings are used to connect to power modules respectively, wherein each of the N electrode patterns receives a current provided by a corresponding power module.

What is claimed is: 
     
         1 . An electrode plate suitable for being used as an anode electrode of an electroplating device, wherein the electrode plate comprises:
 a substrate having a first surface and a second surface which are opposite to each other and a plurality of through holes;   N electrode patterns disposed on the first surface of the substrate, wherein the N electrode patterns are spaced apart from each other, and N is a value of positive integer greater than 1; and   N wirings disposed on the second surface of the substrate, wherein each of the N wirings has a first end and a second end, and the first end of each of the N wirings is connected to a corresponding electrode pattern from the N electrode patterns via at least a corresponding through hole, the second ends of the N wirings is used to be respectively connected to N power modules, such that each of the N electrode patterns receives a current provided by a corresponding power module from the N power modules.   
     
     
         2 . The electrode plate according to  claim 1 , wherein the second ends of the N wirings are all extended outwards from the same side of the substrate. 
     
     
         3 . The electrode plate according to  claim 1 , wherein N is two and the N electrode patterns comprise a first electrode pattern and a second electrode pattern, the first electrode pattern is located in the middle of the substrate, and the second electrode pattern encloses around the first electrode pattern. 
     
     
         4 . The electrode plate according to  claim 1 , wherein N is three and the N electrode patterns comprise a first electrode pattern, a second electrode pattern and a third electrode pattern, and the first electrode pattern, the second electrode pattern and the third electrode pattern are sequentially arranged along one direction. 
     
     
         5 . The electrode plate according to  claim 4 , wherein the N wirings comprise a first wiring, a second wiring and a third wiring which are connected to the first electrode pattern, the second electrode pattern and the third electrode pattern, and the second ends of the first wiring, the second wiring and the third wiring are all extended outwards from the same side of the substrate and are sequentially arranged along the direction. 
     
     
         6 . The electrode plate according to  claim 1 , wherein N is twelve and the N electrode patterns comprise a first electrode pattern, a second electrode pattern, a third electrode pattern, a fourth electrode pattern, a fifth electrode pattern, a sixth electrode pattern, a seventh electrode pattern, an eighth electrode pattern, a ninth electrode pattern, a tenth electrode pattern, an eleventh electrode pattern and a twelfth electrode pattern, and the first electrode pattern, the second electrode pattern, the third electrode pattern and the fourth electrode pattern are respectively located in four corners of the substrate; the fifth electrode pattern, the sixth electrode pattern, the seventh electrode pattern and the eighth electrode pattern are respectively located on four sides of the substrate, the fifth electrode pattern is located between the first electrode pattern and the second electrode pattern, the sixth electrode pattern is located between the second electrode pattern and the third electrode pattern, the seventh electrode pattern is located between the third electrode pattern and the fourth electrode pattern, the eighth electrode pattern is located between the fourth electrode pattern and the first electrode pattern, and the fifth electrode pattern, the sixth electrode pattern, the seventh electrode pattern and the eighth electrode pattern enclose around the ninth electrode pattern, the tenth electrode pattern, the eleventh electrode pattern and the twelfth electrode pattern which are sequentially arranged along one direction. 
     
     
         7 . The electrode plate according to  claim 6 , wherein the N wirings comprise a first wiring, a second wiring, a third wiring, a fourth wiring, a fifth wiring, a sixth wiring, a seventh wiring, an eighth wiring, a ninth wiring, a tenth wiring, an eleventh wiring and a twelfth wiring which are respectively connected to the first electrode pattern, the second electrode pattern, the third electrode pattern, the fourth electrode pattern, the fifth electrode pattern, the sixth electrode pattern, the seventh electrode pattern, the eighth electrode pattern, the ninth electrode pattern, the tenth electrode pattern, the eleventh electrode pattern and the twelfth electrode pattern, and the second ends of the first wiring, the second wiring, the fifth wiring, the eighth wiring, the ninth wiring, the tenth wiring, the eleventh wiring, and the twelfth wiring, the sixth wiring, the seventh wiring, the third wiring and the fourth wiring are all extended outwards from the same side of the substrate and are sequentially arranged along the direction. 
     
     
         8 . An electroplating device, comprising:
 a trough comprising a base and a first sidewall, a second sidewall, a third sidewall and a fourth sidewall connected to the base, wherein the first sidewall has an opening, and the first sidewall, the second sidewall, the third sidewall and the fourth sidewall are connected to form an accommodation space;   a plurality of fan blades disposed in the accommodation space, wherein the fan blades are used for disturbing an electroplating liquid; and   the electrode plate according to  claim 1 , disposed in the accommodation space and located between the fan blades and the third sidewall, wherein the N electrode patterns of the electrode plate face towards the fan blades.   
     
     
         9 . The electroplating device according to  claim 8 , wherein the second ends of the N wirings are all extended outwards from the same side of the substrate, along a direction vertical to the base. 
     
     
         10 . The electroplating device according to  claim 9 , further comprising N power modules, the N power modules being respectively connected to the second ends of the N wirings, thereby providing currents to the N electrode patterns.