US2025290179A1PendingUtilityA1
Low thermal expansion alloy
Est. expiryMar 15, 2044(~17.6 yrs left)· nominal 20-yr term from priority
C22C 19/05C22C 19/055C22C 19/07C22C 38/105C22C 30/00C22C 38/52
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Claims
Abstract
[Problem] To obtain Alloy with low thermal expansion properties in the vicinity of room temperature to 800° C.[Solution] The low thermal expansion alloy of the present invention comprises, by mass %, Fe:20 to 60%, Ni:20 to 35%, Cr:0 to 30%, and the balance of Co and impurities.
Claims
exact text as granted — not AI-modified1 . A low thermal expansion alloy comprising, by mass %,
Fe:20 to 60%, Ni:20 to 35%, Cr:0 to 30%, and the balance of Co and impurities.
2 . The low thermal expansion alloy according to claim 1 , wherein the microstructure of the low thermal expansion alloy contains an austenite phase in an area ratio of 90% or more.
3 . The low thermal expansion alloy according to claim 1 , wherein the low thermal expansion alloy contains Co of 20 mass % or more.
4 . The low thermal expansion alloy according to claim 1 , wherein the low thermal expansion alloy contains Ni of 25 mass % or more.
5 . The low thermal expansion alloy according to claim 3 , wherein the low thermal expansion alloy contains Ni of 25 mass % or more.
6 . The low thermal expansion alloy according to claim 2 , wherein the low thermal expansion alloy contains Co of 20 mass % or more.
7 . The low thermal expansion alloy according to claim 2 , wherein the low thermal expansion alloy contains Ni of 25 mass % or more.Join the waitlist — get patent alerts
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