US2025290179A1PendingUtilityA1

Low thermal expansion alloy

Assignee: SHINHOKOKU MAT CORPPriority: Mar 15, 2024Filed: Mar 15, 2024Published: Sep 18, 2025
Est. expiryMar 15, 2044(~17.6 yrs left)· nominal 20-yr term from priority
C22C 19/05C22C 19/055C22C 19/07C22C 38/105C22C 30/00C22C 38/52
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Claims

Abstract

[Problem] To obtain Alloy with low thermal expansion properties in the vicinity of room temperature to 800° C.[Solution] The low thermal expansion alloy of the present invention comprises, by mass %, Fe:20 to 60%, Ni:20 to 35%, Cr:0 to 30%, and the balance of Co and impurities.

Claims

exact text as granted — not AI-modified
1 . A low thermal expansion alloy comprising, by mass %,
 Fe:20 to 60%,   Ni:20 to 35%,   Cr:0 to 30%, and   the balance of Co and impurities.   
     
     
         2 . The low thermal expansion alloy according to  claim 1 , wherein the microstructure of the low thermal expansion alloy contains an austenite phase in an area ratio of 90% or more. 
     
     
         3 . The low thermal expansion alloy according to  claim 1 , wherein the low thermal expansion alloy contains Co of 20 mass % or more. 
     
     
         4 . The low thermal expansion alloy according to  claim 1 , wherein the low thermal expansion alloy contains Ni of 25 mass % or more. 
     
     
         5 . The low thermal expansion alloy according to  claim 3 , wherein the low thermal expansion alloy contains Ni of 25 mass % or more. 
     
     
         6 . The low thermal expansion alloy according to  claim 2 , wherein the low thermal expansion alloy contains Co of 20 mass % or more. 
     
     
         7 . The low thermal expansion alloy according to  claim 2 , wherein the low thermal expansion alloy contains Ni of 25 mass % or more.

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