Polishing pad conditioner position detection module, polishing device, and polishing detection method using the position detection module

Abstract

A polishing device includes a rotatable platen; a polishing pad placed on an upper surface of the platen and having a polishing surface; a polishing head disposed above the polishing pad and configured for mounting a substrate on a bottom surface of the polishing head; a driver configured to rotate the platen with respect to an axis perpendicular to the polishing surface of the polishing pad; a slurry supply outlet configured to supply slurry to the polishing surface of the polishing pad; a polishing pad conditioner for conditioning the polishing surface of the polishing pad; and a polishing pad conditioner position detection module configured to detect whether a disk of the polishing pad conditioner is correctly aligned.

What is claimed is: 
     
         1 . A polishing pad conditioner position detection module for a polishing device which includes a polishing pad conditioner, a disk for conditioning a polishing surface on a polishing pad, and a cleaning module for cleaning the disk and placed adjacent to the polishing pad, the polishing pad conditioner position detection module comprising:
 a frame configured to surround the cleaning module;   a housing connected to the frame; and   a detector disposed inside the housing and configured to face a side of the disk when the disk is attached to the polishing pad conditioner,   wherein the detector is configured to detect whether the disk is mounted on the polishing pad conditioner and when mounted, whether the disk is in a correct predetermined position.   
     
     
         2 . The polishing pad conditioner position detection module of  claim 1 , wherein:
 the detector is configured to detect whether the disk is mounted on the polishing pad conditioner and when mounted, whether the disk is in the correct predetermined position while a portion of polishing pad conditioner configured to hold the disk is positioned in a standby position adjacent to the cleaning module.   
     
     
         3 . The polishing pad conditioner position detection module of  claim 1 , wherein:
 the detector is positioned to detect whether the disk is in the correct predetermined position based on the disk being mounted on a holder located underside a head of the polishing pad conditioner.   
     
     
         4 . The polishing pad conditioner position detection module of  claim 1 , wherein:
 one end of the detector is arranged to face a first direction toward a center of the disk when the disk is in the correct predetermined position and is configured to detect the disk positioned within a predetermined distance in the first direction.   
     
     
         5 . The polishing pad conditioner position detection module of  claim 4 , wherein:
 the detector is configured to detect whether the disk is located within a predetermined location having a width in a second direction which is perpendicular to the first direction.   
     
     
         6 . The polishing pad conditioner position detection module of  claim 1 , further comprising a cable connected to the detector and extending out of the housing. 
     
     
         7 . The polishing pad conditioner position detection module of  claim 6 , wherein the cable comprises:
 a first cable portion connected to the detector and placed inside the housing; and   a second cable portion connected to the first cable portion and extending out of the housing.   
     
     
         8 . The polishing pad conditioner position detection module of  claim 6 , further comprising a receiving part connected to the housing for receiving the cable. 
     
     
         9 . The polishing pad conditioner position detection module of  claim 8 , wherein the receiving part further comprises a hole for routing the cable externally. 
     
     
         10 . The polishing pad conditioner position detection module of  claim 1 , wherein the housing is connected to outer surface of the cleaning module. 
     
     
         11 . The polishing pad conditioner position detection module of  claim 1 , wherein the housing further comprises a guide part inside which the detector is placed. 
     
     
         12 . The polishing pad conditioner position detection module of  claim 1 , wherein the detector and the housing in which the detector is placed are positioned to protrude from the cleaning module toward the disk. 
     
     
         13 . A polishing device comprising:
 a rotatable platen;   a polishing pad placed on an upper surface of the platen and having a polishing surface;   a polishing head disposed above the polishing pad and configured for mounting a substrate on a bottom surface of the polishing head;   a driver configured to rotate the platen with respect to an axis perpendicular to the polishing surface of the polishing pad;   a slurry supply outlet configured to supply slurry to the polishing surface of the polishing pad;   a polishing pad conditioner for conditioning the polishing surface of the polishing pad; and   a polishing pad conditioner position detection module configured to detect whether a disk of the polishing pad conditioner is correctly aligned.   
     
     
         14 . A polishing pad conditioner position detection method for detecting whether a polishing pad conditioner including a conditioner arm, a head connected to the conditioner arm, and a disk mounted on the head is in correct position, the method comprising:
 placing the polishing pad conditioner in cup position adjacent to a cleaning module for cleaning the disk; and   detecting, using a detector placed on the cleaning module, whether a center of the disk is located within a predetermined distance in a first direction from the detector.   
     
     
         15 . The polishing pad conditioner position detection method of  claim 14 , comprising:
 detecting whether the disk is located within a predetermined distance in the first direction and within a predetermined width in a second direction perpendicular to the first direction.   
     
     
         16 . The polishing pad conditioner position detection method of  claim 15 , comprising:
 determining that the disk is disposed on a conditioner arm when the disk is detected within a predetermined distance in the first direction; and   determining that the conditioner arm is in the correct position when the disk is detected within a predetermined width in the second direction.   
     
     
         17 . The polishing pad conditioner position detection method of  claim 16 , comprising:
 determining that the disk is separated from a holder placed underside a head of the polishing pad conditioner when the disk is not detected within a predetermined distance in the first direction.   
     
     
         18 . The polishing pad conditioner position detection method of  claim 15 , comprising:
 determining that a position of the conditioner arm is displaced when the disk is not detected within a predetermined width in the second direction.   
     
     
         19 . The polishing pad conditioner position detection method of  claim 14 , comprising:
 generating an alarm when the disk is not detected within a predetermined distance in the first direction.