Semiconductor device and a method for film deposition

Abstract

A semiconductor device and a method and tool for film deposition are provided. The method of film deposition includes holding a semiconductor device in a chamber by a holding component, wherein the chamber is defined by a showerhead and a pedestal, providing reacting gases by the showerhead from a bottom side of the chamber, and forming a first dielectric layer on a backside surface of the semiconductor device.

What is claimed is: 
     
         1 . A method of film deposition, comprising:
 providing a semiconductor device including an active surface and a backside surface opposite to the active surface;   holding the backside surface of the semiconductor device by a holding component; and   forming a dielectric layer on the backside surface of the semiconductor device.   
     
     
         2 . The method of  claim 1 , further comprising:
 providing reacting gases by a showerhead;   creating a plasma between the backside surface of the semiconductor device and the showerhead, wherein the reacting gases interact with the plasma;   depositing a dielectric material on the backside surface of the semiconductor device from the reacting gases; and   providing neutral gases onto the active surface of the semiconductor device by a pedestal.   
     
     
         3 . The method of  claim 2 , further comprising heating the semiconductor device by the pedestal. 
     
     
         4 . The method of  claim 2 , wherein the active surface of the semiconductor device is physically isolated from the pedestal. 
     
     
         5 . The method of  claim 1 , wherein the active surface of the semiconductor device is physically isolated from the holding component. 
     
     
         6 . The method of  claim 2 , wherein a distance between the active surface of the semiconductor device and the pedestal is less than a distance between the backside surface of the semiconductor device and the showerhead. 
     
     
         7 . The method of  claim 2 , wherein holding the semiconductor device comprises holding the backside surface of the semiconductor device via a holding surface of the holding component, wherein the holding surface of the holding component faces the pedestal. 
     
     
         8 . The method of  claim 1 , wherein the backside surface of the semiconductor device has a first portion covered by the holding component, the first portion is in contact with the holding component, and the holding component comprises a plurality of protruding portions in contact with the first portion of the backside surface of the semiconductor device. 
     
     
         9 . The method of  claim 1 , wherein a value of bow of the semiconductor device decreases after the dielectric layer is formed. 
     
     
         10 . The method of  claim 1 , wherein a plurality of semiconductor dies are disposed adjacent to the active surface, the semiconductor device comprises a wafer, and the holding component has an annular shape. 
     
     
         11 . The method of  claim 1 , wherein the dielectric layer includes a thin film, and the dielectric layer is formed in a CVD process. 
     
     
         12 . A method of film deposition, comprising:
 holding a semiconductor device in a chamber by a holding component, wherein the chamber is defined by a showerhead and a pedestal;   providing reacting gases by the showerhead from a bottom side of the chamber; and   forming a first dielectric layer on a backside surface of the semiconductor device.   
     
     
         13 . The method of  claim 12 , wherein the semiconductor device has an active surface opposite to the backside surface of the semiconductor device, the active surface of the semiconductor device faces a top side of the chamber, and the backside surface of the semiconductor device faces the bottom side of the chamber; and a distance between the active surface of the semiconductor device and the top side of the chamber is less than a distance between the backside surface of the semiconductor device and the bottom side of the chamber. 
     
     
         14 . The method of  claim 12 , further comprising creating a plasma within the chamber; providing neutral gases by the pedestal from a top side of the chamber; and heating the wafer by the pedestal from a top side of the chamber; wherein the active surface is physically isolated from the pedestal, the backside surface of the semiconductor device has a first portion covered by the holding component.