Electronic device having sealing structure

Abstract

An electronic device is provided. The electronic device includes a substrate having an edge and a peripheral area adjacent to the edge, a first inorganic insulating layer disposed on the first substrate, an organic insulating layer disposed on the first inorganic insulating layer and including a recess in the peripheral area, and a second inorganic insulating layer disposed on the organic insulating layer and in the recess. In a top view, the recess extends in a first direction parallel to the edge of the substrate. In a cross-sectional view, the recess has a bottom portion adjacent to the substrate, and a width of the bottom portion of the recess is greater than a thickness of the organic insulating layer.

What is claimed is: 
     
         1 . An electronic device, comprising:
 a substrate comprising an edge, a working area and a peripheral area disposed between the edge and the working area;   a first inorganic layer disposed on the substrate;   an insulating protrusion disposed on the first inorganic layer and in the peripheral area; and   a second inorganic layer disposed on the insulating protrusion,   wherein in a cross-sectional view, the first inorganic layer has a first contact portion is in contact with an outermost portion of the insulating protrusion, and the first inorganic layer has a second contact portion is in contact with the second inorganic layer, wherein the second contact portion is between the edge and the first contact portion.   
     
     
         2 . The electronic device as claimed in  claim 1 , wherein the second inorganic layer is in contact with an upper surface of the insulating protrusion at a first area and a second area, wherein the second area is closer to the substrate than the first area. 
     
     
         3 . The electronic device as claimed in  claim 2 , wherein in a top view, the upper surface of the insulating protrusion extends in a direction that is parallel to the edge. 
     
     
         4 . The electronic device as claimed in  claim 2 , wherein a projection region of the second area on the first inorganic layer is overlapped with the first contact portion. 
     
     
         5 . The electronic device as claimed in  claim 4 , wherein the second area is closer to the edge than the first area. 
     
     
         6 . The electronic device as claimed in  claim 1 , wherein the insulating protrusion has an upper surface, a lower surface that is opposite to the upper surface, and a side surface that extends from the upper surface to the lower surface, wherein the side surface faces the edge. 
     
     
         7 . The electronic device as claimed in  claim 6 , wherein the side surface is a curved surface. 
     
     
         8 . The electronic device as claimed in  claim 6 , wherein the lowest point of the side surface is located between the highest point of the side surface and the edge. 
     
     
         9 . The electronic device as claimed in  claim 1 , wherein the second inorganic layer comprises at least two sublayers. 
     
     
         10 . The electronic device as claimed in  claim 1 , wherein a thickness of the second inorganic layer is less than the thickness of the insulating protrusion.