US2025256321A1PendingUtilityA1
Hot stamping component and method of manufacturing the same
Est. expiryOct 29, 2041(~15.2 yrs left)· nominal 20-yr term from priority
C21D 8/00B21D 22/022C21D 9/46C21D 9/0062B21D 43/02B21D 43/003C22C 38/54C22C 38/58C22C 38/50C22C 38/48C22C 38/44C22C 38/04C22C 38/02C21D 9/48C21D 9/0068C21D 1/18C21D 1/673B21D 37/16
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Claims
Abstract
The present disclosure provides a method of manufacturing a hot stamping component, the method includes inserting a blank into a heating furnace, heating the blank, and transferring the heated blank from the heating furnace to a mold, wherein an air cooling time of the blank in the transferring of the blank satisfies Equation 1.
Claims
exact text as granted — not AI-modified1 .- 18 . (canceled)
19 . A method of manufacturing a hot stamping component, the method comprising:
inserting a blank into a heating furnace; heating the blank; and transferring the heated blank from the heating furnace to a mold, wherein the heating of the blank comprises:
step-heating the blank in multiple stages; and
soaking the blank in a temperature range of about Ac3 to about 1,000° C.,
wherein, in the heating of the blank, the heating time of the blank satisfies equation 1 below
λ
n
=
(
a
n
×
T
n
+
b
n
)
×
t
c
n
<
Equation
1
>
where λ n represents a heating time(s), a n represents a heating furnace heat loss correction coefficient, T n represents a heating temperature (° C.), b n represents an Ac3 temperature correction coefficient, t represents a material thickness (mm), and c n represents a high temperature material thickness sensitivity coefficient,
wherein, in Equation 2, an is −0.60 or greater and −0.55 or less, T n is Ac3 or greater and 1000° C. or less, b n is 700 or greater and 900 or less, t is 1 mm or greater and 2.6 mm or less, and c n is 0.7 or greater and 0.9 or less, and
wherein, in Equation 2, λ n is 100 s or more and 900 s or less.
20 . The method of claim 19 , wherein, in the transferring of the blank, the heated blank is air-cooled at room temperature.
21 . The method of claim 19 , wherein the heating furnace comprises a plurality of sections having different temperature ranges.
22 . The method of claim 21 , wherein a ratio of a length of sections for step-heating the blank to a length of a section for soaking the blank is about 1:1 to 4:1.
23 . The method of claim 19 , further comprising:
after transferring the blank, forming a molded body by pressing the transferred blank with the mold; and cooling the formed molded body.
24 . The method of claim 23 wherein, in the molding of the molded body, a molding start temperature of the blank is 500° C. or higher and 700° C. or less.
25 . The method of claim 23 , wherein the cooling of the molded body is performed within the mold.
26 . The method of claim 25 , wherein, in the cooling of the molded body, a mold cooling time during which the molded body is cooled in the mold satisfies Equation 2 below
λ
q
=
(
a
q
×
P
+
b
q
)
×
t
c
q
<
Equation
2
>
where λ q represents a mold cooling time(s), a q represents a mold thermal conductivity correction coefficient, P represents a pressing force (MPa), b q represents a material hardenability correction coefficient, t represents a material thickness (mm), and c q represents a low temperature material thickness sensitivity coefficient.
27 . The method of claim 26 , wherein, in Equation 2, a q is −1.0 or greater and −0.2 or less, P is 0.1 MPa or greater and 5 MPa or less, b q is 11 or greater and 15 or less, t is 1 mm or greater and 2.6 mm or less, and c q is 1.00 or greater and 1.05 or less.
28 . The method of claim 27 , wherein, in Equation 2, λ q is 6 s or more and 40 s or less.
29 . The method of claim 23 , wherein, in the cooling of the molded body, a cooling end temperature of the mold at which the cooling is terminated is above the room temperature and below about 200° C.
30 . A hot stamping component manufactured according to the method of claim 19 , the hot stamping component having a tensile strength of 1,350 MPa or greater and less than 2,300 MPa.Join the waitlist — get patent alerts
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