Polishing process apparatus

Abstract

A polishing process apparatus includes a carrier configured to hold a polishing target; a platen disposed below the carrier; a polishing pad disposed below the platen; a nozzle system including at least one nozzle configured to discharge temperature-control fluid to an upper surface of the polishing pad, an additional nozzle configured to discharge slurry solution to an upper surface of the polishing pad, and a barrier configured to separate temperature-control fluid discharged from the at least one nozzle from slurry solution discharged from the additional nozzle on an upper surface of the polishing pad; a temperature sensor configured to measure a temperature of the polishing pad; and a controller configured to control the platen, the at least one nozzle, the additional nozzle, the barrier, and the temperature sensor. The controller is configured to maintain a temperature of the platen to be within a platen target temperature range by controlling the platen, and to maintain a temperature of the polishing pad to be within a process target temperature range by controlling at least one of a supply amount and a temperature of the temperature-control fluid discharged from the at least one nozzle.

What is claimed is: 
     
         1 . A polishing process apparatus, comprising:
 a carrier configured to hold a polishing target;   a platen disposed below the carrier;   a polishing pad disposed below the platen;   a nozzle system including at least one nozzle configured to discharge temperature-control fluid to an upper surface of the polishing pad, an additional nozzle configured to discharge slurry solution to an upper surface of the polishing pad, and a barrier configured to separate temperature-control fluid discharged from the at least one nozzle from slurry solution discharged from the additional nozzle on an upper surface of the polishing pad;   a temperature sensor configured to measure a temperature of the polishing pad; and   a controller configured to control the platen, the at least one nozzle, the additional nozzle, the barrier, and the temperature sensor,   wherein the controller is configured to maintain a temperature of the platen to be within a platen target temperature range by controlling the platen, and to maintain a temperature of the polishing pad to be within a process target temperature range by controlling at least one of a supply amount and a temperature of the temperature-control fluid discharged from the at least one nozzle.   
     
     
         2 . The polishing process apparatus of  claim 1 , wherein the barrier is disposed between the at least one nozzle and the additional nozzle in a direction parallel to an upper surface of the polishing pad. 
     
     
         3 . The polishing process apparatus of  claim 2 , wherein the barrier is configured to extend in a radial direction away from a center of the polishing pad. 
     
     
         4 . The polishing process apparatus of  claim 3 , wherein a length of the barrier is longer than a radius of the polishing pad. 
     
     
         5 . The polishing process apparatus of  claim 1 , wherein the controller is configured to separate temperature-control fluid discharged from the at least one nozzle from slurry solution discharged from the additional nozzle by controlling a level at which the barrier is disposed. 
     
     
         6 . The polishing process apparatus of  claim 1 ,
 wherein an upper surface of the barrier includes a support stand including at least one spring, and one end of the spring is in contact with the upper surface of the barrier, and   wherein the controller is configured to control a level at which the barrier is disposed using the spring.   
     
     
         7 . The polishing process apparatus of  claim 1 , wherein the controller is configured to control a temperature of temperature-control fluid discharged from the at least one nozzle according to a temperature of the polishing pad. 
     
     
         8 . The polishing process apparatus of  claim 7 , wherein the controller is configured to lower the temperature of the temperature-control fluid discharged from the at least one nozzle when a temperature of the polishing pad is higher than a process target temperature, and to increase the temperature of the temperature-control fluid discharged from the at least one nozzle when a temperature of the polishing pad is lower than the process target temperature. 
     
     
         9 . The polishing process apparatus of  claim 1 , wherein the at least one nozzle includes a cooling nozzle and a heating nozzle. 
     
     
         10 . The polishing process apparatus of  claim 9 , wherein, the controller is configured to discharge cooling fluid through the cooling nozzle when a temperature of the polishing pad is higher than a process target temperature, and to discharge heating fluid through the heating nozzle when a temperature of the polishing pad is lower than the process target temperature. 
     
     
         11 . A polishing process apparatus, comprising:
 a carrier configured to hold a polishing target;   a platen disposed below the carrier;   a polishing pad disposed below the platen;   a nozzle system including a first nozzle configured to supply fluid to an upper surface of the polishing pad, a second nozzle configured to supply a slurry solution to the upper surface of the polishing pad, and a fluid barrier;   a temperature sensor configured to measure a temperature of the polishing pad; and   a controller configured to control the platen, the first nozzle, the second nozzle, the fluid barrier, and the temperature sensor,   wherein the fluid barrier is disposed between the first nozzle and the second nozzle in a direction parallel to an upper surface of the polishing pad, and is configured to separate fluid discharged from the first nozzle from slurry solution discharged from the second nozzle on an upper surface of the polishing pad, and   wherein the controller is configured to maintain a temperature of the polishing pad to be within a process target temperature range by controlling at least one of a supply amount and a temperature of fluid discharged from the first nozzle while a polishing process is performed on the polishing target.   
     
     
         12 . The polishing process apparatus of  claim 11 , wherein the fluid barrier is configured to extend in a radial direction away from a center of the polishing pad. 
     
     
         13 . The polishing process apparatus of  claim 12 , wherein a length of the fluid barrier is longer than a radius of the polishing pad. 
     
     
         14 . The polishing process apparatus of  claim 11 , wherein the controller is configured to separate fluid discharged from the first nozzle from slurry solution discharged from the second nozzle by controlling a level at which the fluid barrier is disposed. 
     
     
         15 . The polishing process apparatus of  claim 14 ,
 wherein an upper surface of the fluid barrier includes a support stand including at least one spring, and one end of the spring is in contact with the upper surface of the fluid barrier, and   wherein the controller is configured to control a level at which the fluid barrier is disposed using the spring.   
     
     
         16 . The polishing process apparatus of  claim 11 , wherein the controller is configured to control a temperature of fluid discharged from the first nozzle according to a temperature of the polishing pad. 
     
     
         17 . The polishing process apparatus of  claim 16 , wherein, the controller is configured to lower the temperature of the fluid when a temperature of the polishing pad is higher than a process target temperature, and to increase the temperature of the fluid when a temperature of the polishing pad is lower than the process target temperature. 
     
     
         18 . A polishing process apparatus, comprising:
 a carrier configured to hold a polishing target;   a platen disposed below the carrier;   a polishing pad disposed below the platen;   a nozzle system including at least one nozzle configured to supply fluid to an upper surface of the polishing pad, an additional nozzle configured to supply a slurry solution to an upper surface of the polishing pad, and a barrier configured to separate fluid discharged from the at least one nozzle from slurry solution discharged from the additional nozzle on an upper surface of the polishing pad;   a temperature sensor configured to measure a temperature of the polishing pad; and   a controller configured to control the platen, the at least one nozzle, the additional nozzle, the barrier, and the temperature sensor,   wherein the controller is configured to maintain a temperature of the platen to be within a platen target temperature range by controlling the platen, to trigger a polishing process for the polishing target while a temperature of the polishing pad is maintained to be within a process basic temperature range, and while the polishing process is performed, to maintain a temperature of the polishing pad to be within a process target temperature range by controlling at least one of a temperature and a supply amount of fluid discharged from the at least one nozzle.   
     
     
         19 . The polishing process apparatus of  claim 18 ,
 wherein the platen includes a plurality of fluid circulation channels, and   wherein the controller is configured to control a temperature of the platen by controlling at least one of a temperature and a circulation amount of circulation fluid circulating the plurality of fluid circulation channels.   
     
     
         20 . The polishing process apparatus of  claim 18 ,
 wherein the platen includes a plurality of thermoelectric elements, and   wherein the controller is configured to control a temperature of the platen by controlling a voltage applied to each of the plurality of thermoelectric elements.