Apparatus and method for handling wafer storage box

Abstract

A method includes placing a wafer storage box onto a stage; opening the wafer storage box, such that a sealing strip of the wafer storage box is exposed; directing a light beam over the sealing strip; determining whether the light beam is blocked by the sealing strip; and in response the determination determines that the light beam is blocked by the sealing strip, performing a maintenance process on the sealing strip.

What is claimed is: 
     
         1 . A method, comprising:
 placing a wafer storage box onto a stage;   opening the wafer storage box, such that a sealing strip of the wafer storage box is exposed;   directing a light beam over the sealing strip;   determining whether the light beam is blocked by the sealing strip; and   in response the determination determines that the light beam is blocked by the sealing strip, performing a maintenance process on the sealing strip.   
     
     
         2 . The method of  claim 1 , wherein the light beam over the sealing strip propagates along a horizontal path higher than at least a portion of a top surface of the sealing strip. 
     
     
         3 . The method of  claim 1 , wherein the light beam over the sealing strip propagates along a horizontal path that is substantially parallel with a top surface of the stage. 
     
     
         4 . The method of  claim 1 , wherein the wafer storage box has a first side directly below the light beam, and a path of the light beam over the sealing strip is substantially parallel with the first side of the wafer storage box when viewed from top. 
     
     
         5 . The method of  claim 4 , further comprising:
 rotating the wafer storage box, such that a second side of the wafer storage box is turned to a position directly below the light beam.   
     
     
         6 . The method of  claim 5 , wherein after rotating the wafer storage box, the path of the light beam is substantially parallel with the second side of the wafer storage box when viewed from top. 
     
     
         7 . The method of  claim 1 , wherein the maintenance process comprises:
 adjusting a position of the sealing strip such that the light beam is not blocked by the sealing strip.   
     
     
         8 . The method of  claim 1 , wherein opening the wafer storage box comprises:
 disengaging a cover of the wafer storage box from a case of the wafer storage box, wherein the sealing strip is over the case of the wafer storage box.   
     
     
         9 . The method of  claim 1 , further comprising:
 in response the determination determines that the light beam is not blocked by the sealing strip, closing the wafer storage box.   
     
     
         10 . A method, comprising:
 opening a wafer storage box by using a gripping mechanism;   determining whether a sealing strip is detached from a ledge of a first side of the wafer storage box; and   in response the determination determines that the sealing strip is detached from the ledge of the first side of the wafer storage box, performing a first maintenance process on the sealing strip.   
     
     
         11 . The method of  claim 10 , further comprising:
 identifying a type of a wafer storage box; and   placing the wafer storage box onto one of a plurality of stages according to the identified type of the wafer storage box, wherein opening the wafer storage box is performed over said one of the plurality of stages.   
     
     
         12 . The method of  claim 10 , wherein the first maintenance process comprises:
 reducing a gap between the sealing strip and the ledge of the first side of the wafer storage box.   
     
     
         13 . The method of  claim 10 , further comprising:
 in response the determination determines that the sealing strip is not detached from the ledge of the first side of the wafer storage box, closing the wafer storage box by using the gripping mechanism.   
     
     
         14 . The method of  claim 10 , further comprising:
 determining whether the sealing strip is detached from a ledge of a second side of the wafer storage box; and   in response the determination determines that the sealing strip is detached from the ledge of the second side of the wafer storage box, performing a second maintenance process on the sealing strip.   
     
     
         15 . The method of  claim 10 , further comprising:
 rotating the wafer storage box before determining whether the sealing strip is detached from the ledge of the second side of the wafer storage box.   
     
     
         16 . An apparatus, comprising:
 a first stage configured to support a wafer storage box;   a first gripping mechanism over the first stage, configured to grip and move a cover of the wafer storage box; and   a first light inspection device over the first stage, wherein the first light inspection device comprises a light emitter configured to generate a light beam and a light sensor configured to receive the light beam, wherein a path of the light beam overlaps the first stage when viewed from top.   
     
     
         17 . The apparatus of  claim 16 , wherein a path of the light beam is substantially parallel with a top surface of the first stage. 
     
     
         18 . The apparatus of  claim 16 , wherein the light beam is a laser beam. 
     
     
         19 . The apparatus of  claim 16 , further comprising:
 a second stage;   a second gripping mechanism over the second stage; and   a second light inspection device over the second stage, wherein the first and second light inspection devices are at different levels.   
     
     
         20 . The apparatus of  claim 19 , further comprising:
 an image sensor configured to detect the wafer storage box;   a controller configured to identify a type of the wafer storage box according to a detection result of the image sensor; and   a robot arm configured to move the wafer storage box to one of the first and second stages according to the type of the wafer storage box.